JPH04131397A - リードフレームへの全面メッキ装置 - Google Patents
リードフレームへの全面メッキ装置Info
- Publication number
- JPH04131397A JPH04131397A JP25139690A JP25139690A JPH04131397A JP H04131397 A JPH04131397 A JP H04131397A JP 25139690 A JP25139690 A JP 25139690A JP 25139690 A JP25139690 A JP 25139690A JP H04131397 A JPH04131397 A JP H04131397A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- roller
- power supply
- rollers
- conveyance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 20
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000003825 pressing Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007562 laser obscuration time method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25139690A JPH04131397A (ja) | 1990-09-20 | 1990-09-20 | リードフレームへの全面メッキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25139690A JPH04131397A (ja) | 1990-09-20 | 1990-09-20 | リードフレームへの全面メッキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04131397A true JPH04131397A (ja) | 1992-05-06 |
| JPH0545679B2 JPH0545679B2 (enExample) | 1993-07-09 |
Family
ID=17222224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25139690A Granted JPH04131397A (ja) | 1990-09-20 | 1990-09-20 | リードフレームへの全面メッキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04131397A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009503263A (ja) * | 2005-08-03 | 2009-01-29 | ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー | 基板を処理する、特に基板を電気メッキする装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5881997A (ja) * | 1981-11-07 | 1983-05-17 | Hideo Tsubaki | 水平搬送式自動メツキ装置 |
-
1990
- 1990-09-20 JP JP25139690A patent/JPH04131397A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5881997A (ja) * | 1981-11-07 | 1983-05-17 | Hideo Tsubaki | 水平搬送式自動メツキ装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009503263A (ja) * | 2005-08-03 | 2009-01-29 | ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー | 基板を処理する、特に基板を電気メッキする装置 |
| US8038851B2 (en) | 2005-08-03 | 2011-10-18 | Gebr. Schmid Gmbh & Co. | Device for the treatment, particularly galvanization, of substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0545679B2 (enExample) | 1993-07-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |