JPH0371641U - - Google Patents

Info

Publication number
JPH0371641U
JPH0371641U JP1990111168U JP11116890U JPH0371641U JP H0371641 U JPH0371641 U JP H0371641U JP 1990111168 U JP1990111168 U JP 1990111168U JP 11116890 U JP11116890 U JP 11116890U JP H0371641 U JPH0371641 U JP H0371641U
Authority
JP
Japan
Prior art keywords
jaw
frame
arm
depending
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990111168U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPH0371641U publication Critical patent/JPH0371641U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

【図面の簡単な説明】
第１図は、半導体ウエハ開放可能に係合するた
めの、本考案に従つて構成された装置の平面図で
ある。第２図は、第１図の装置の断面図である。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) フレームと； 前記フレームに配設され、該フレームから外方
    へ伸び、長手方向に伸びるスロツトを有する長手
    アームと； 前記フレームから離れた位置で前記フレームか
    ら垂下し、前記ウエハの一部分を係合することが
    できる第１の顎と； 上部が前記アームの上に位置し顎部分が前記ア
    ームの下に垂下するように前記スロツトを通して
    伸び、前記スロツト内に滑動可能に配設されてい
    ることにより、前記垂下顎部分が前記アームの下
    面に沿つて前記第１の顎に対して移動可能であり
    、その垂下顎部分が第１の顎によつて係合された
    部分とは反対側のウエハ端部分を係合する第２の
    顎と； 前記フレームと前記第２の顎の前記上部との間
    に接続され、前記ウエハを保持するために、前記
    第２の顎の垂下顎部分を前記第１の顎に向かつて
    移動させる流体シリンダ手段と； を有することを特徴とするウエハを開放可能に係
    合する装置。 (2) 前記アームは係合すべきウエハを有するカ
    セツトのポケツト内に挿入できる大きさであるこ
    とを特徴とする請求項１記載の装置。 (3) 前記フレームは、 第１の端部と第２の端部とを有し、前記第１の
    端部がロボツトにより係合させるのに必要な大き
    さである円筒状工具チヤツクと；そして、 前記アームを調整可能に配設するための、工具
    チヤツクの第２の端部に固着されたプレートと； を有することを特徴とする請求項１記載の装置。 (4) 第２の垂下顎部分を移動させるための前記
    手段は、エアシリンダからなることを特徴とする
    請求項１記載の装置。
JP1990111168U 1988-05-25 1990-10-25 Pending JPH0371641U (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/198,347 US4900214A (en) 1988-05-25 1988-05-25 Method and apparatus for transporting semiconductor wafers

Publications (1)

Publication Number Publication Date
JPH0371641U true JPH0371641U (ja) 1991-07-19

Family

ID=22733007

Family Applications (2)

Application Number Title Priority Date Filing Date
JP1121673A Pending JPH0220041A (ja) 1988-05-25 1989-05-17 半導体ウエハの係合方法および装置
JP1990111168U Pending JPH0371641U (ja) 1988-05-25 1990-10-25

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP1121673A Pending JPH0220041A (ja) 1988-05-25 1989-05-17 半導体ウエハの係合方法および装置

Country Status (2)

Country Link
US (1) US4900214A (ja)
JP (2) JPH0220041A (ja)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1228105B (it) * 1988-12-20 1991-05-28 Sgs Thomson Microelectronics Pinza per la movimentazione, vantaggiosamente robotizzata, di una o piu' fette di silicio e/o di un supporto di tali fette
CH680275A5 (ja) * 1990-03-05 1992-07-31 Tet Techno Investment Trust
JPH05235154A (ja) * 1992-02-24 1993-09-10 Mitsubishi Electric Corp ウエハ把持装置
US5570987A (en) * 1993-12-14 1996-11-05 W. L. Gore & Associates, Inc. Semiconductor wafer transport container
US5590996A (en) * 1994-10-13 1997-01-07 Semitherm Wafer transfer apparatus
US5713711A (en) * 1995-01-17 1998-02-03 Bye/Oasis Multiple interface door for wafer storage and handling container
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
CH697146A5 (de) * 1996-10-09 2008-05-15 Tec Sem Ag Greifvorrichtung zur Handhabung von Wafern.
US5980187A (en) * 1997-04-16 1999-11-09 Kla-Tencor Corporation Mechanism for transporting semiconductor-process masks
US5988971A (en) * 1997-07-09 1999-11-23 Ade Optical Systems Corporation Wafer transfer robot
US6256555B1 (en) 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
WO2000033359A2 (en) 1998-12-02 2000-06-08 Kensington Laboratories, Inc. Specimen holding robotic arm end effector
US6454332B1 (en) * 1998-12-04 2002-09-24 Applied Materials, Inc. Apparatus and methods for handling a substrate
US6322312B1 (en) 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
EP1041604B1 (en) * 1999-04-01 2007-05-02 Applied Materials, Inc. Pneumatically actuated flexure gripper for wafer handling robots
US6164899A (en) * 1999-04-22 2000-12-26 Automated Concepts, Inc. Disk transfer apparatus
US6491330B1 (en) * 1999-05-04 2002-12-10 Ade Corporation Edge gripping end effector wafer handling apparatus
US6357996B2 (en) 1999-05-14 2002-03-19 Newport Corporation Edge gripping specimen prealigner
US6513848B1 (en) * 1999-09-17 2003-02-04 Applied Materials, Inc. Hydraulically actuated wafer clamp
US7104578B2 (en) * 2002-03-15 2006-09-12 Asm International N.V. Two level end effector
US7256375B2 (en) * 2002-08-30 2007-08-14 Asm International N.V. Susceptor plate for high temperature heat treatment
US7654596B2 (en) 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
WO2005004967A2 (en) * 2003-07-02 2005-01-20 Cook Incorporated Small gauge needle catheterization apparatus
US7181132B2 (en) 2003-08-20 2007-02-20 Asm International N.V. Method and system for loading substrate supports into a substrate holder
JP2005167208A (ja) * 2003-10-24 2005-06-23 Ade Corp ノッチ化／フラット化２００ｍｍウエーハエッジグリップエンドエフェクタ
JP3909770B2 (ja) * 2004-03-29 2007-04-25 川崎重工業株式会社 基板把持装置
US20060060145A1 (en) * 2004-09-17 2006-03-23 Van Den Berg Jannes R Susceptor with surface roughness for high temperature substrate processing
US20060065634A1 (en) * 2004-09-17 2006-03-30 Van Den Berg Jannes R Low temperature susceptor cleaning
US7651306B2 (en) * 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7255747B2 (en) * 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7819079B2 (en) * 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7374391B2 (en) * 2005-12-22 2008-05-20 Applied Materials, Inc. Substrate gripper for a substrate handling robot
US20080166210A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Supinating cartesian robot blade
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US8801069B2 (en) * 2010-02-26 2014-08-12 Brooks Automation, Inc. Robot edge contact gripper
JP2013198960A (ja) * 2012-03-26 2013-10-03 Disco Corp ロボットハンド
CN109461693B (zh) * 2017-09-06 2023-06-02 台湾积体电路制造股份有限公司 晶片传送装置、晶片处理系统及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114978B1 (ja) * 1969-10-14 1976-05-13
JPS584389B2 (ja) * 1976-04-07 1983-01-26 鹿島建設株式会社 運搬作業自動記録装置
JPS5864041A (ja) * 1981-10-13 1983-04-16 Nec Corp ウエハのハンドリング装置
JPS62169439A (ja) * 1986-01-22 1987-07-25 Hitachi Ltd 保持具
JPS62293631A (ja) * 1986-06-13 1987-12-21 Hitachi Ltd ウエハ把持具

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1232488A (en) * 1915-05-11 1917-07-10 Hugh Brooks Lifter.
US1606569A (en) * 1924-10-04 1926-11-09 Guess Edward Henry Jar wrench
US2002149A (en) * 1934-05-28 1935-05-21 Herbert De L Kneeland Dish or pan lifter
US2988237A (en) * 1954-12-10 1961-06-13 Jr George C Devol Programmed article transfer
US2992848A (en) * 1959-07-16 1961-07-18 Edward W Livensparger Receptacle lifter
US3233750A (en) * 1963-07-05 1966-02-08 Us Industries Inc Gripping and releasing device for feed mechanisms
DE1293994B (de) * 1964-11-13 1969-04-30 Gressbach Arthur Selbstspannender Greifer
US3750804A (en) * 1969-03-07 1973-08-07 Triax Co Load handling mechanism and automatic storage system
US3648854A (en) * 1970-04-03 1972-03-14 Erie Eng Co Reach-extension attachment for work transfer device
FR2244602A1 (en) * 1973-09-25 1975-04-18 Koch Albert Remote handling tool for e.g. toxic material - has intersliding upper and lower arms with secondary linking lever
DE2420320A1 (de) * 1974-04-26 1975-11-06 Christian Haertig Zange zum oeffnen und schliessen von schraubverschluessen an glaesern u.ae. mit verstellbarer backe
GB1513444A (en) * 1974-09-06 1978-06-07 Chemical Reactor Equip As Pick-up devices for lifting and moving semiconductor wafers
US4002245A (en) * 1974-09-16 1977-01-11 George Mink Material handling apparatus having gripping means for moving articles in several directions
SU738867A1 (ru) * 1977-12-26 1980-06-05 Севастопольский Приборостроительный Институт Исполнительный орган промышленного робота
US4293268A (en) * 1979-09-21 1981-10-06 George Mink Material handling device
US4266910A (en) * 1979-09-04 1981-05-12 Pickard Equipment, Inc. Pipe positioner boom and head assembly for pipe laying frame
JPS5638468A (en) * 1979-09-06 1981-04-13 Dainippon Screen Mfg Co Ltd Loading equipment of wafer
SU1009758A1 (ru) * 1981-07-31 1983-04-07 Предприятие П/Я А-1477 Схват промышленного робота
US4457661A (en) * 1981-12-07 1984-07-03 Applied Materials, Inc. Wafer loading apparatus
NL8105908A (nl) * 1981-12-30 1983-07-18 Metaverpa Nv Mechanisme voor het over een bepaalde hoek draaien van een voorwerp om een vertikale as.
US4410209A (en) * 1982-03-11 1983-10-18 Trapani Silvio P Wafer-handling tool
DE3219502C2 (de) * 1982-05-25 1990-04-19 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Vorrichtung zum automatischen Transport scheibenförmiger Objekte
US4616971A (en) * 1983-10-11 1986-10-14 Fairchild Camera And Instrument Corp. Robotic hand and method for manipulating printed circuit boards
US4553069A (en) * 1984-01-05 1985-11-12 General Ionex Corporation Wafer holding apparatus for ion implantation
US4558984A (en) * 1984-05-18 1985-12-17 Varian Associates, Inc. Wafer lifting and holding apparatus
US4595221A (en) * 1984-10-09 1986-06-17 Priam Corporation Disc transfer device
US4639028A (en) * 1984-11-13 1987-01-27 Economic Development Corporation High temperature and acid resistant wafer pick up device
US4626013A (en) * 1984-12-11 1986-12-02 General Electric Company Dual axis gripper
JPS61226287A (ja) * 1985-03-07 1986-10-08 エプシロン　テクノロジー　インコーポレーテツド 加工品を取扱うたぬの装置および方法
US4685852A (en) * 1985-05-20 1987-08-11 Machine Technology, Inc. Process apparatus and method and elevator mechanism for use in connection therewith
US4696501A (en) * 1986-01-30 1987-09-29 Honeywell Inc. Robot gripper
US4701096A (en) * 1986-03-05 1987-10-20 Btu Engineering Corporation Wafer handling station
US4699414A (en) * 1986-04-21 1987-10-13 The United States Of America As Represented By The Secretary Of The Air Force Multi use gripper for industrial robot
US4806057A (en) * 1986-04-22 1989-02-21 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114978B1 (ja) * 1969-10-14 1976-05-13
JPS584389B2 (ja) * 1976-04-07 1983-01-26 鹿島建設株式会社 運搬作業自動記録装置
JPS5864041A (ja) * 1981-10-13 1983-04-16 Nec Corp ウエハのハンドリング装置
JPS62169439A (ja) * 1986-01-22 1987-07-25 Hitachi Ltd 保持具
JPS62293631A (ja) * 1986-06-13 1987-12-21 Hitachi Ltd ウエハ把持具

Also Published As

Publication number Publication date
US4900214A (en) 1990-02-13
JPH0220041A (ja) 1990-01-23

Similar Documents

Publication Publication Date Title
JPH0371641U (ja)
JPS61191847U (ja)
JPH0179900U (ja)
JPH03128943U (ja)
JPS6211511U (ja)
JPH0439532U (ja)
JPH031704U (ja)
JPS6196684U (ja)
JPH0371632U (ja)
JPS6236537U (ja)
JPS6296018U (ja)
JPH045645U (ja)
JPS61195827U (ja)
JPS6196685U (ja)
JPS6282195U (ja)
JPS60194444U (ja) 長尺工作物自動交換装置
JPS6064926U (ja) ウエハ搬送装置
JPS61193922U (ja)
JPS61102449U (ja)
JPS627302U (ja)
JPS6442836U (ja)
JPS5969805U (ja) ポツトチヤツク装置
JPH0260246U (ja)
JPH0349240U (ja)
JPS6261437U (ja)