JPH0366831B2 - - Google Patents

Info

Publication number
JPH0366831B2
JPH0366831B2 JP61199299A JP19929986A JPH0366831B2 JP H0366831 B2 JPH0366831 B2 JP H0366831B2 JP 61199299 A JP61199299 A JP 61199299A JP 19929986 A JP19929986 A JP 19929986A JP H0366831 B2 JPH0366831 B2 JP H0366831B2
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
layer
multilayer printed
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61199299A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6354800A (ja
Inventor
Hideo Machida
Shinichi Izawa
Shin Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Priority to JP19929986A priority Critical patent/JPS6354800A/ja
Publication of JPS6354800A publication Critical patent/JPS6354800A/ja
Publication of JPH0366831B2 publication Critical patent/JPH0366831B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP19929986A 1986-08-25 1986-08-25 多層プリント配線板の製造方法 Granted JPS6354800A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19929986A JPS6354800A (ja) 1986-08-25 1986-08-25 多層プリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19929986A JPS6354800A (ja) 1986-08-25 1986-08-25 多層プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS6354800A JPS6354800A (ja) 1988-03-09
JPH0366831B2 true JPH0366831B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-10-18

Family

ID=16405491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19929986A Granted JPS6354800A (ja) 1986-08-25 1986-08-25 多層プリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS6354800A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0271590A (ja) * 1988-09-06 1990-03-12 Mitsubishi Electric Corp ハイブリッドｉｃ用基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156375A (en) * 1976-06-22 1977-12-26 Nippon Electric Co Method of producing multilayer circuit substrate
JPS5398096A (en) * 1977-02-08 1978-08-26 Nec Corp Production of thin film metal resistor
JPS60124891A (ja) * 1983-12-09 1985-07-03 セイコーエプソン株式会社 プリント回路基板の製造方法
JPS6167989A (ja) * 1984-09-11 1986-04-08 三洋電機株式会社 多層配線基板の製造方法

Also Published As

Publication number Publication date
JPS6354800A (ja) 1988-03-09

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