JPH0361346B2 - - Google Patents
Info
- Publication number
- JPH0361346B2 JPH0361346B2 JP56184800A JP18480081A JPH0361346B2 JP H0361346 B2 JPH0361346 B2 JP H0361346B2 JP 56184800 A JP56184800 A JP 56184800A JP 18480081 A JP18480081 A JP 18480081A JP H0361346 B2 JPH0361346 B2 JP H0361346B2
- Authority
- JP
- Japan
- Prior art keywords
- wti
- wiring
- film
- alloy
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10D64/011—
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56184800A JPS5886724A (ja) | 1981-11-18 | 1981-11-18 | 電極および配線の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56184800A JPS5886724A (ja) | 1981-11-18 | 1981-11-18 | 電極および配線の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5886724A JPS5886724A (ja) | 1983-05-24 |
| JPH0361346B2 true JPH0361346B2 (OSRAM) | 1991-09-19 |
Family
ID=16159510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56184800A Granted JPS5886724A (ja) | 1981-11-18 | 1981-11-18 | 電極および配線の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5886724A (OSRAM) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60183726A (ja) * | 1984-03-02 | 1985-09-19 | Toshiba Corp | 半導体装置の電極パタ−ンの形成方法 |
| JPH07111969B2 (ja) * | 1986-02-28 | 1995-11-29 | 株式会社東芝 | 半導体装置の製造方法 |
| JPS6489470A (en) * | 1987-09-30 | 1989-04-03 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
| JP2707305B2 (ja) * | 1989-01-26 | 1998-01-28 | 株式会社日立製作所 | 薄膜形成法とそれによって得られた半導体装置及びその製造方法 |
| US5093274A (en) * | 1990-02-02 | 1992-03-03 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method for manufacture thereof |
| KR100364810B1 (ko) * | 2000-02-22 | 2002-12-16 | 주식회사 하이닉스반도체 | 반도체소자의 제조방법 |
| JP4928098B2 (ja) * | 2005-08-03 | 2012-05-09 | セイコーエプソン株式会社 | 強誘電体キャパシタの製造方法 |
| JP5057113B2 (ja) * | 2009-11-17 | 2012-10-24 | セイコーエプソン株式会社 | 半導体装置および電子部品並びにそれらの製造方法 |
-
1981
- 1981-11-18 JP JP56184800A patent/JPS5886724A/ja active Granted
Non-Patent Citations (1)
| Title |
|---|
| THIN SOLID FILMS=1978 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5886724A (ja) | 1983-05-24 |
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