JPH0360296B2 - - Google Patents

Info

Publication number
JPH0360296B2
JPH0360296B2 JP61104437A JP10443786A JPH0360296B2 JP H0360296 B2 JPH0360296 B2 JP H0360296B2 JP 61104437 A JP61104437 A JP 61104437A JP 10443786 A JP10443786 A JP 10443786A JP H0360296 B2 JPH0360296 B2 JP H0360296B2
Authority
JP
Japan
Prior art keywords
resin composition
mold
plastic
powdered
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61104437A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62259830A (ja
Inventor
Yoshihisa Nagashima
Takao Sakakibara
Toshikazu Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Toryo Co Ltd
Tokai Kogyo Co Ltd
Original Assignee
Dai Nippon Toryo Co Ltd
Tokai Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Toryo Co Ltd, Tokai Kogyo Co Ltd filed Critical Dai Nippon Toryo Co Ltd
Priority to JP10443786A priority Critical patent/JPS62259830A/ja
Publication of JPS62259830A publication Critical patent/JPS62259830A/ja
Publication of JPH0360296B2 publication Critical patent/JPH0360296B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP10443786A 1986-05-07 1986-05-07 プラスチック成形体の製造方法 Granted JPS62259830A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10443786A JPS62259830A (ja) 1986-05-07 1986-05-07 プラスチック成形体の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10443786A JPS62259830A (ja) 1986-05-07 1986-05-07 プラスチック成形体の製造方法

Publications (2)

Publication Number Publication Date
JPS62259830A JPS62259830A (ja) 1987-11-12
JPH0360296B2 true JPH0360296B2 (enExample) 1991-09-13

Family

ID=14380640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10443786A Granted JPS62259830A (ja) 1986-05-07 1986-05-07 プラスチック成形体の製造方法

Country Status (1)

Country Link
JP (1) JPS62259830A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63118216A (ja) * 1986-07-14 1988-05-23 Minako Yasuda プリント方法
KR100410883B1 (ko) * 2001-07-23 2003-12-12 현대자동차주식회사 시작형 부품의 엠보 스킨몰드 제조방법
DE102004041867A1 (de) * 2004-08-27 2006-03-16 Leonhard Kurz Gmbh & Co. Kg Dekorierter Spritzgussartikel, sowie Transferfolie und Verfahren zur Herstellung eines solchen

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588623A (ja) * 1981-07-10 1983-01-18 Toyota Motor Corp 樹脂部品の導体化射出成形方法

Also Published As

Publication number Publication date
JPS62259830A (ja) 1987-11-12

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