ATE283305T1 - Verbundstoffe aus pulverisierten füllstoffen und einer polymermatrix und verfahren zu ihrer herstellung - Google Patents

Verbundstoffe aus pulverisierten füllstoffen und einer polymermatrix und verfahren zu ihrer herstellung

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Publication number
ATE283305T1
ATE283305T1 AT00945027T AT00945027T ATE283305T1 AT E283305 T1 ATE283305 T1 AT E283305T1 AT 00945027 T AT00945027 T AT 00945027T AT 00945027 T AT00945027 T AT 00945027T AT E283305 T1 ATE283305 T1 AT E283305T1
Authority
AT
Austria
Prior art keywords
polymer
materials
bodies
mixture
mixtures
Prior art date
Application number
AT00945027T
Other languages
English (en)
Inventor
Richard A Holl
Original Assignee
Kreido Lab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kreido Lab filed Critical Kreido Lab
Application granted granted Critical
Publication of ATE283305T1 publication Critical patent/ATE283305T1/de

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
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    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
    • B22F3/227—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip by organic binder assisted extrusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B01F33/836—Mixing plants; Combinations of mixers combining mixing with other treatments
    • B01F33/8361—Mixing plants; Combinations of mixers combining mixing with other treatments with disintegrating
    • B01F33/83613—Mixing plants; Combinations of mixers combining mixing with other treatments with disintegrating by grinding or milling
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    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
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    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0227—Insulating particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]

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  • Ceramic Engineering (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AT00945027T 1999-07-02 2000-07-01 Verbundstoffe aus pulverisierten füllstoffen und einer polymermatrix und verfahren zu ihrer herstellung ATE283305T1 (de)

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Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7538237B2 (en) * 1999-07-02 2009-05-26 Kreido Laboratories Process for high shear gas-liquid reactions
US6471392B1 (en) 2001-03-07 2002-10-29 Holl Technologies Company Methods and apparatus for materials processing
US6742774B2 (en) * 1999-07-02 2004-06-01 Holl Technologies Company Process for high shear gas-liquid reactions
KR100345323B1 (ko) * 2000-04-24 2002-07-24 학교법인 포항공과대학교 나노 자성체 입자들을 포함하는 복합체
JP3664094B2 (ja) * 2000-10-18 2005-06-22 株式会社村田製作所 複合誘電体成形物、その製造方法、およびそれを用いたレンズアンテナ
JP2002289617A (ja) * 2001-03-28 2002-10-04 Mitsubishi Heavy Ind Ltd 集積回路構造
US6830806B2 (en) * 2001-04-12 2004-12-14 Kreido Laboratories Methods of manufacture of electric circuit substrates and components having multiple electric characteristics and substrates and components so manufactured
EP1446222A2 (de) * 2001-09-13 2004-08-18 Holl Technologies Company Verfahren und vorrichtung zur übertragung von wärmeenergie zwischen einer körperoberfläche und wärmeübertragungsmittel
US6787246B2 (en) 2001-10-05 2004-09-07 Kreido Laboratories Manufacture of flat surfaced composites comprising powdered fillers in a polymer matrix
DE10224377B4 (de) * 2002-06-01 2004-11-11 Rauschert Gmbh Verfahren zur Herstellung vorkeramischer Verbundkörper mit Einlegeteilen aus Stahl oder Grauguss
US7098360B2 (en) * 2002-07-16 2006-08-29 Kreido Laboratories Processes employing multiple successive chemical reaction process steps and apparatus therefore
CA2497615A1 (en) * 2002-09-11 2004-03-25 Kreido Laboratories Methods and apparatus for high-shear mixing and reacting of materials
WO2004030802A2 (en) * 2002-10-03 2004-04-15 Kreido Laboratories Apparatus for transfer of heat energy between a body surface and heat transfer fluid
US20040236009A1 (en) * 2003-05-23 2004-11-25 Robson Mafoti Low density adhesives and sealants
US20050080185A1 (en) * 2003-10-10 2005-04-14 Mhetar Vijay R. Poly(arylene ether) composition and method of making
US20050110168A1 (en) * 2003-11-20 2005-05-26 Texas Instruments Incorporated Low coefficient of thermal expansion (CTE) semiconductor packaging materials
US7261389B2 (en) * 2003-11-26 2007-08-28 Fuji Xerox Co., Ltd. Systems and methods for dissipating heat into a fluid ejector carriage device
US7192116B2 (en) * 2003-11-26 2007-03-20 Fuji Xerox Co., Ltd. Systems and methods for dissipating heat from a fluid ejector carriage
TWI380900B (zh) * 2004-09-17 2013-01-01 住友化學股份有限公司 光學疊層體
EP1674151B1 (de) * 2004-12-23 2008-04-16 Kinematica Ag Vorrichtung zum Dispergieren eines festen, flüssigen oder gasförmigen Stoffes in einer Flüssigkeit
US7678721B2 (en) * 2006-10-26 2010-03-16 Agy Holding Corp. Low dielectric glass fiber
DE102007010271B4 (de) * 2007-03-02 2014-05-22 Siemens Aktiengesellschaft Verfahren zur Herstellung von Glimmer-Verbundmaterial mit Glimmer-Partikeln und dessen Verwendung
EP2294296B1 (de) 2008-07-03 2015-01-28 H R D Corporation Verfahren mit hoher scherkraft für luft-kraftstoff-mischung
US8497804B2 (en) * 2008-10-31 2013-07-30 Medtronic, Inc. High dielectric substrate antenna for implantable miniaturized wireless communications and method for forming the same
US8983618B2 (en) * 2008-10-31 2015-03-17 Medtronic, Inc. Co-fired multi-layer antenna for implantable medical devices and method for forming the same
US9399143B2 (en) * 2008-10-31 2016-07-26 Medtronic, Inc. Antenna for implantable medical devices formed on extension of RF circuit substrate and method for forming the same
US20100140222A1 (en) * 2008-12-10 2010-06-10 Sun Jennifer Y Filled polymer composition for etch chamber component
US8050771B2 (en) * 2008-12-29 2011-11-01 Medtronic, Inc. Phased array cofire antenna structure and method for operating the same
US8626310B2 (en) * 2008-12-31 2014-01-07 Medtronic, Inc. External RF telemetry module for implantable medical devices
US8725263B2 (en) 2009-07-31 2014-05-13 Medtronic, Inc. Co-fired electrical feedthroughs for implantable medical devices having a shielded RF conductive path and impedance matching
US8419405B2 (en) * 2009-09-23 2013-04-16 Revolutionary Plastics, Llc System for forming a composition with an optimized filler
KR101268883B1 (ko) * 2010-12-06 2013-05-29 한국세라믹기술원 미네랄브릿지 구조를 갖는 고강도 유무기 복합체 및 이의 제조방법
CA2874322A1 (en) 2011-05-27 2012-12-06 Revolutionary Plastics, Llc Method to heuristically control formation and properties of a composition
WO2013082024A1 (en) 2011-11-29 2013-06-06 Revolutionary Plastics, Llc Low density high impact resistant composition and method of forming
US10000670B2 (en) 2012-07-30 2018-06-19 Henkel IP & Holding GmbH Silver sintering compositions with fluxing or reducing agents for metal adhesion
JP6380387B2 (ja) * 2013-05-30 2018-08-29 住友ベークライト株式会社 放熱部材用樹脂組成物および電子部品装置
JP6486369B2 (ja) * 2013-09-05 2019-03-20 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 金属焼結フィルム組成物
KR102250469B1 (ko) * 2014-02-26 2021-05-12 엔지케이 인슐레이터 엘티디 관통 구멍을 갖는 절연 기판
US9526185B2 (en) * 2014-04-08 2016-12-20 Finisar Corporation Hybrid PCB with multi-unreinforced laminate
EP3132497A4 (de) * 2014-04-18 2018-04-18 TransSiP UK, Ltd. Metamaterialsubstrat für schaltungsentwurf
DE102015100863B4 (de) * 2015-01-21 2022-03-03 Infineon Technologies Ag Verfahren zur Handhabung eines Produktsubstrats und ein verklebtes Substratsystem
KR102360575B1 (ko) 2015-05-08 2022-02-09 헨켈 아이피 앤드 홀딩 게엠베하 소결성 필름 및 페이스트, 및 그의 사용 방법
US10116018B2 (en) * 2016-01-07 2018-10-30 GM Global Technology Operations LLC Cure in place thermal interface material
CN108856661B (zh) * 2018-08-09 2023-11-03 辽宁科技大学 连铸机沟槽内壁结晶器铜板生产方法及采用的电镀槽结构
IT201900010080A1 (it) * 2019-06-26 2020-12-26 Nol Tec Europe S R L Apparecchiatura e procedimento per la miscelazione di granulati e/o polveri e/o liquidi negli impianti di produzione della gomma
WO2021060764A1 (ko) * 2019-09-23 2021-04-01 주식회사 아모그린텍 Rf 방열플라스틱 및 이를 포함하여 구현된 중계기 함체
US20220348813A1 (en) * 2019-09-23 2022-11-03 Amogreentech Co., Ltd. Rf heat dissipation plastic, method for manufacturing rf heat dissipation plastic, and repeater cabinet using same
EP3805300B1 (de) * 2019-10-11 2022-12-21 SHPP Global Technologies B.V. Polymerkeramikverbundgehäuse und -gehäuseteile für tragbare elektronische vorrichtungen
FR3102948B1 (fr) * 2019-11-12 2022-06-24 Safran Nacelles Pièce à résistance à l’usure par frottement améliorée
DE102021112544A1 (de) 2021-05-14 2022-11-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zum Herstellen eines faserverstärkten Kunststoffproduktes sowie Anlage dafür
CN114016333A (zh) * 2021-11-24 2022-02-08 泉州市环球新材料科技有限公司 一种热粘合法无尘膨化纸及其制备装置

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4287075A (en) 1978-04-17 1981-09-01 Tdk Electronics Co., Ltd. High dielectric constant type ceramic composition consisting essentially of Pb(Fe1/2 Nb1/2)O3 -Pb(Mg1/3 Nb2/3)O3 -Pb(Mg1/2 W1/2)O3
US4335180A (en) 1978-12-26 1982-06-15 Rogers Corporation Microwave circuit boards
JPS62121758A (ja) * 1985-08-26 1987-06-03 Matsushita Electric Works Ltd ポリフエニレンオキサイド系樹脂組成物およびこの樹脂組成物からなるシ−ト
DE3774390D1 (de) * 1986-09-22 1991-12-12 Gen Electric Haertbare lineare polyphenylenaetherharzzusammensetzungen, die polymere mit sich gegenseitig durchdringenden polymeren strukturen enthalten, und verfahren.
DE3725058A1 (de) 1987-07-29 1989-02-09 Roehm Gmbh Thermoplastisch verarbeitbare polyarylenether mit 9,9-bis-(4'-hydroxyphenyl)fluoren
JP2844233B2 (ja) * 1988-12-26 1999-01-06 日本ジーイープラスチックス株式会社 ポリフェニレンエーテル樹脂組成物
DE59010515D1 (de) 1989-03-17 1996-10-31 Sumitomo Chemical Co Neue Polyarylenether
US5198137A (en) * 1989-06-12 1993-03-30 Hoeganaes Corporation Thermoplastic coated magnetic powder compositions and methods of making same
JPH03179805A (ja) 1989-12-07 1991-08-05 Murata Mfg Co Ltd 誘電体レンズアンテナ用複合材料
US5204416A (en) 1990-04-17 1993-04-20 Raychem Corporation Crosslinked fluorinated poly(arylene ether)
US5506049C1 (en) 1991-05-24 2001-05-29 World Properties Inc Particulate filled composite film and method of making same
US5268140A (en) * 1991-10-03 1993-12-07 Hoeganaes Corporation Thermoplastic coated iron powder components and methods of making same
US5391603A (en) 1992-03-09 1995-02-21 The Dow Chemical Company Impact modified syndiotactic vinyl aromatic polymers
EP0571883A1 (de) 1992-05-26 1993-12-01 Hoechst Aktiengesellschaft Polyarylenether mit Xanthoneinheiten, Verfahren zu ihrer Herstellung und ihre Verwendung
US5279463A (en) 1992-08-26 1994-01-18 Holl Richard A Methods and apparatus for treating materials in liquids
US5449652A (en) 1993-06-04 1995-09-12 Battelle Memorial Institute Ceramic compositions for BZN dielectric resonators
US5358775A (en) 1993-07-29 1994-10-25 Rogers Corporation Fluoropolymeric electrical substrate material exhibiting low thermal coefficient of dielectric constant
DE4344044A1 (de) * 1993-12-23 1995-06-29 Abb Research Ltd Elektrisches Isoliermaterial und Verfahren zur Herstellung eines elektrisch isolierten Leiters
SE9402497D0 (sv) * 1994-07-18 1994-07-18 Hoeganaes Ab Iron powder components containing thermoplastic resin and methods of making same
US5552210A (en) 1994-11-07 1996-09-03 Rogers Corporation Ceramic filled composite polymeric electrical substrate material exhibiting high dielectric constant and low thermal coefficient of dielectric constant
US5693742A (en) 1994-12-01 1997-12-02 General Electric Company Solventless method for making polyarylene ethers
US5658994A (en) 1995-07-13 1997-08-19 Air Products And Chemicals, Inc. Nonfunctionalized poly(arylene ether) dielectrics
US5874516A (en) 1995-07-13 1999-02-23 Air Products And Chemicals, Inc. Nonfunctionalized poly(arylene ethers)
DE19526855A1 (de) 1995-07-22 1997-01-23 Basf Ag Verfahren zur Herstellung von Polyarylenethern mit Anhydridendgruppen
DE19530574A1 (de) 1995-08-19 1997-02-20 Basf Ag Titandioxid-Pigmente
US5658485A (en) 1995-10-03 1997-08-19 Lucent Technologies Inc. Pyrochlore based oxides with high dielectric constant and low temperature coefficient
US5659006A (en) 1995-12-14 1997-08-19 General Electric Company Method for making polyarylene ethers from mesitol
US5739193A (en) 1996-05-07 1998-04-14 Hoechst Celanese Corp. Polymeric compositions having a temperature-stable dielectric constant
US5929138A (en) 1996-11-05 1999-07-27 Raychem Corporation Highly thermally conductive yet highly comformable alumina filled composition and method of making the same
US6039784A (en) * 1997-03-12 2000-03-21 Hoeganaes Corporation Iron-based powder compositions containing green strength enhancing lubricants
US6143052A (en) * 1997-07-03 2000-11-07 Kiyokawa Plating Industries, Co., Ltd. Hydrogen storage material
JPH11322920A (ja) 1998-05-19 1999-11-26 Asahi Chem Ind Co Ltd 高密着性ポリアリーレンエーテル
US6093636A (en) 1998-07-08 2000-07-25 International Business Machines Corporation Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets

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DE60016228T2 (de) 2006-05-04
US20020038582A1 (en) 2002-04-04
US6391082B1 (en) 2002-05-21
AU5902300A (en) 2001-01-22
CN1420904A (zh) 2003-05-28
WO2001002468A9 (en) 2002-07-25
KR100690110B1 (ko) 2007-03-08
WO2001002468A1 (en) 2001-01-11
EP1200509B1 (de) 2004-11-24
KR20020085865A (ko) 2002-11-16
DE60016228D1 (de) 2004-12-30
EP1200509A1 (de) 2002-05-02
JP2003521566A (ja) 2003-07-15

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