JPH0355999B2 - - Google Patents
Info
- Publication number
- JPH0355999B2 JPH0355999B2 JP27821090A JP27821090A JPH0355999B2 JP H0355999 B2 JPH0355999 B2 JP H0355999B2 JP 27821090 A JP27821090 A JP 27821090A JP 27821090 A JP27821090 A JP 27821090A JP H0355999 B2 JPH0355999 B2 JP H0355999B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- hole
- wiring conductor
- circuit board
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 42
- 229910000679 solder Inorganic materials 0.000 claims description 32
- 230000000903 blocking effect Effects 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27821090A JPH03141692A (ja) | 1990-10-17 | 1990-10-17 | 回路基板装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27821090A JPH03141692A (ja) | 1990-10-17 | 1990-10-17 | 回路基板装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03141692A JPH03141692A (ja) | 1991-06-17 |
| JPH0355999B2 true JPH0355999B2 (enrdf_load_html_response) | 1991-08-27 |
Family
ID=17594134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27821090A Granted JPH03141692A (ja) | 1990-10-17 | 1990-10-17 | 回路基板装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03141692A (enrdf_load_html_response) |
-
1990
- 1990-10-17 JP JP27821090A patent/JPH03141692A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03141692A (ja) | 1991-06-17 |
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