JPH0355282B2 - - Google Patents
Info
- Publication number
- JPH0355282B2 JPH0355282B2 JP57037367A JP3736782A JPH0355282B2 JP H0355282 B2 JPH0355282 B2 JP H0355282B2 JP 57037367 A JP57037367 A JP 57037367A JP 3736782 A JP3736782 A JP 3736782A JP H0355282 B2 JPH0355282 B2 JP H0355282B2
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- temperature
- dimensional stabilization
- pressing
- multilayer ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Producing Shaped Articles From Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57037367A JPS58154293A (ja) | 1982-03-10 | 1982-03-10 | グリ−ンシ−トの寸法安定化法 |
| US06/463,855 US4497677A (en) | 1982-03-10 | 1983-02-04 | Method for manufacturing ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57037367A JPS58154293A (ja) | 1982-03-10 | 1982-03-10 | グリ−ンシ−トの寸法安定化法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58154293A JPS58154293A (ja) | 1983-09-13 |
| JPH0355282B2 true JPH0355282B2 (https=) | 1991-08-22 |
Family
ID=12495549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57037367A Granted JPS58154293A (ja) | 1982-03-10 | 1982-03-10 | グリ−ンシ−トの寸法安定化法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4497677A (https=) |
| JP (1) | JPS58154293A (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5944797A (ja) * | 1982-09-07 | 1984-03-13 | 増田 閃一 | 物体の静電的処理装置 |
| US4755631A (en) * | 1985-04-11 | 1988-07-05 | International Business Machines Corporation | Apparatus for providing an electrical connection to a metallic pad situated on a brittle dielectric substrate |
| US4672739A (en) * | 1985-04-11 | 1987-06-16 | International Business Machines Corporation | Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate |
| US4808365A (en) * | 1986-10-24 | 1989-02-28 | International Business Machines Corporation | Method for reducing edge curl on green sheets |
| US4799983A (en) * | 1987-07-20 | 1989-01-24 | International Business Machines Corporation | Multilayer ceramic substrate and process for forming therefor |
| JPH03123010A (ja) * | 1989-10-05 | 1991-05-24 | Murata Mfg Co Ltd | 積層電子部品の製造方法 |
| JPH07120857B2 (ja) * | 1990-02-14 | 1995-12-20 | 日本碍子株式会社 | セラミック回路基板の製造方法 |
| US5178260A (en) * | 1991-02-26 | 1993-01-12 | Aluminum Company Of America | Pallet for drying ceramic cards |
| US5302219A (en) * | 1991-04-03 | 1994-04-12 | Coors Electronic Package Company | Method for obtaining via patterns in ceramic sheets |
| US5207968A (en) * | 1991-05-16 | 1993-05-04 | Aluminum Company Of America | Method for making a dimensionally stable green ceramic sheet |
| JP3185249B2 (ja) * | 1991-06-26 | 2001-07-09 | 株式会社村田製作所 | セラミックグリーンブロックのカット方法 |
| KR0127666B1 (ko) * | 1992-11-25 | 1997-12-30 | 모리시다 요이찌 | 세라믹전자부품 및 그 제조방법 |
| US5821846A (en) * | 1995-05-22 | 1998-10-13 | Steward, Inc. | High current ferrite electromagnetic interference suppressor and associated method |
| US5948200A (en) * | 1996-07-26 | 1999-09-07 | Taiyo Yuden Co., Ltd. | Method of manufacturing laminated ceramic electronic parts |
| US6194053B1 (en) * | 1998-02-26 | 2001-02-27 | International Business Machines Corporation | Apparatus and method fabricating buried and flat metal features |
| US6780267B1 (en) * | 1999-09-22 | 2004-08-24 | Matsushita Electric Industrial Co., Ltd. | Electronic device of ceramic |
| US6692598B1 (en) * | 1999-10-18 | 2004-02-17 | Murata Manufacturing Co. Ltd | Method of producing ceramic green sheet and method of manufacturing multilayer ceramic electronic part |
| JP3528045B2 (ja) * | 2000-07-31 | 2004-05-17 | 株式会社村田製作所 | 積層セラミック電子部品の製造装置 |
| US6607620B2 (en) | 2001-01-08 | 2003-08-19 | International Business Machines Corporation | Greensheet carriers and processing thereof |
| US7819996B2 (en) * | 2006-10-27 | 2010-10-26 | Nippon Soken, Inc. | Method of manufacturing ceramic sheet and method of manufacturing gas sensing element |
| JP5293397B2 (ja) * | 2009-05-14 | 2013-09-18 | パナソニック株式会社 | 回路基板の製造方法 |
| JP5709732B2 (ja) * | 2011-11-28 | 2015-04-30 | 京セラ株式会社 | セラミック多層基板の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3505139A (en) * | 1965-10-20 | 1970-04-07 | Rca Corp | Method of making a laminated ferrite memory |
| US3770529A (en) * | 1970-08-25 | 1973-11-06 | Ibm | Method of fabricating multilayer circuits |
| JPS4831729A (https=) * | 1971-08-26 | 1973-04-26 | ||
| DE2315797C3 (de) * | 1973-03-29 | 1981-07-30 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung von Keramiksubstraten für Dünnschichtschaltungen |
| DE2727364A1 (de) * | 1977-06-16 | 1979-01-04 | Siemens Ag | Verfahren zur herstellung von keramiksubstraten |
| JPS55111207A (en) * | 1979-02-21 | 1980-08-27 | Hitachi Ltd | Preparation of ceramic raw sheet |
-
1982
- 1982-03-10 JP JP57037367A patent/JPS58154293A/ja active Granted
-
1983
- 1983-02-04 US US06/463,855 patent/US4497677A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4497677A (en) | 1985-02-05 |
| JPS58154293A (ja) | 1983-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0355282B2 (https=) | ||
| ATE82529T1 (de) | Verfahren zur herstellung mehrschichtiger halbleiterplatten. | |
| JP3351043B2 (ja) | 多層セラミック基板の製造方法 | |
| US7879169B2 (en) | Method for producing ceramic compact | |
| EP1405552B1 (en) | Method for manufacturing ceramic multilayer circuit board | |
| JPS61124197A (ja) | セラミツク多層基板の製造方法 | |
| JPH02166793A (ja) | 多層セラミック回路基板の製造方法 | |
| JP3166953B2 (ja) | セラミック電子部品の製造方法 | |
| CN113488335B (zh) | 一种制造多层陶瓷电容器的方法 | |
| JPS63100051A (ja) | 磁器シ−トの製造方法 | |
| JPS58197796A (ja) | セラミツク基板の製造方法 | |
| JP3336776B2 (ja) | 積層セラミック電子部品の製造方法 | |
| JPS59147486A (ja) | グリ−ンシ−トの穴充填法 | |
| JP3322027B2 (ja) | 積層セラミックス電子部品の製造方法 | |
| JPH10294561A (ja) | 高脱バインダ性多層配線基板およびその製法 | |
| JP2002299835A (ja) | 多層回路基板前駆体、および多層回路基板の製造方法 | |
| JPH02267990A (ja) | 回路基板の製造方法 | |
| JP2002299155A (ja) | 積層型電子部品前駆体、および積層型電子部品の製造方法 | |
| JP2005101281A (ja) | セラミック基板の製造方法 | |
| JPH0561797B2 (https=) | ||
| JP2002201077A (ja) | セラミック基板の製造方法 | |
| JPH03145111A (ja) | チップ部品の製造方法 | |
| JPH05235549A (ja) | 窒化アルミニウム多層基板の製造方法 | |
| JPH04196007A (ja) | 導電性ペーストと積層電子部品の製造方法 | |
| DE102004032533A1 (de) | Verfahren zur Herstellung eines mehrschichtigen Keramikverbundes mit innenliegenden metallischen Strukturen |