JPH0355282B2 - - Google Patents

Info

Publication number
JPH0355282B2
JPH0355282B2 JP57037367A JP3736782A JPH0355282B2 JP H0355282 B2 JPH0355282 B2 JP H0355282B2 JP 57037367 A JP57037367 A JP 57037367A JP 3736782 A JP3736782 A JP 3736782A JP H0355282 B2 JPH0355282 B2 JP H0355282B2
Authority
JP
Japan
Prior art keywords
green sheet
temperature
dimensional stabilization
pressing
multilayer ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57037367A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58154293A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57037367A priority Critical patent/JPS58154293A/ja
Priority to US06/463,855 priority patent/US4497677A/en
Publication of JPS58154293A publication Critical patent/JPS58154293A/ja
Publication of JPH0355282B2 publication Critical patent/JPH0355282B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Producing Shaped Articles From Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP57037367A 1982-03-10 1982-03-10 グリ−ンシ−トの寸法安定化法 Granted JPS58154293A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP57037367A JPS58154293A (ja) 1982-03-10 1982-03-10 グリ−ンシ−トの寸法安定化法
US06/463,855 US4497677A (en) 1982-03-10 1983-02-04 Method for manufacturing ceramic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57037367A JPS58154293A (ja) 1982-03-10 1982-03-10 グリ−ンシ−トの寸法安定化法

Publications (2)

Publication Number Publication Date
JPS58154293A JPS58154293A (ja) 1983-09-13
JPH0355282B2 true JPH0355282B2 (enExample) 1991-08-22

Family

ID=12495549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57037367A Granted JPS58154293A (ja) 1982-03-10 1982-03-10 グリ−ンシ−トの寸法安定化法

Country Status (2)

Country Link
US (1) US4497677A (enExample)
JP (1) JPS58154293A (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944797A (ja) * 1982-09-07 1984-03-13 増田　閃一 物体の静電的処理装置
US4755631A (en) * 1985-04-11 1988-07-05 International Business Machines Corporation Apparatus for providing an electrical connection to a metallic pad situated on a brittle dielectric substrate
US4672739A (en) * 1985-04-11 1987-06-16 International Business Machines Corporation Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate
US4808365A (en) * 1986-10-24 1989-02-28 International Business Machines Corporation Method for reducing edge curl on green sheets
US4799983A (en) * 1987-07-20 1989-01-24 International Business Machines Corporation Multilayer ceramic substrate and process for forming therefor
JPH03123010A (ja) * 1989-10-05 1991-05-24 Murata Mfg Co Ltd 積層電子部品の製造方法
JPH07120857B2 (ja) * 1990-02-14 1995-12-20 日本碍子株式会社 セラミック回路基板の製造方法
US5178260A (en) * 1991-02-26 1993-01-12 Aluminum Company Of America Pallet for drying ceramic cards
US5302219A (en) * 1991-04-03 1994-04-12 Coors Electronic Package Company Method for obtaining via patterns in ceramic sheets
US5207968A (en) * 1991-05-16 1993-05-04 Aluminum Company Of America Method for making a dimensionally stable green ceramic sheet
JP3185249B2 (ja) * 1991-06-26 2001-07-09 株式会社村田製作所 セラミックグリーンブロックのカット方法
KR0127666B1 (ko) * 1992-11-25 1997-12-30 모리시다 요이찌 세라믹전자부품 및 그 제조방법
US5821846A (en) * 1995-05-22 1998-10-13 Steward, Inc. High current ferrite electromagnetic interference suppressor and associated method
US5948200A (en) * 1996-07-26 1999-09-07 Taiyo Yuden Co., Ltd. Method of manufacturing laminated ceramic electronic parts
US6194053B1 (en) * 1998-02-26 2001-02-27 International Business Machines Corporation Apparatus and method fabricating buried and flat metal features
TW470981B (en) * 1999-09-22 2002-01-01 Matsushita Electric Industrial Co Ltd Method for manufacturing ceramic electronic component
US6692598B1 (en) * 1999-10-18 2004-02-17 Murata Manufacturing Co. Ltd Method of producing ceramic green sheet and method of manufacturing multilayer ceramic electronic part
JP3528045B2 (ja) * 2000-07-31 2004-05-17 株式会社村田製作所 積層セラミック電子部品の製造装置
US6607620B2 (en) 2001-01-08 2003-08-19 International Business Machines Corporation Greensheet carriers and processing thereof
US7819996B2 (en) * 2006-10-27 2010-10-26 Nippon Soken, Inc. Method of manufacturing ceramic sheet and method of manufacturing gas sensing element
JP5293397B2 (ja) * 2009-05-14 2013-09-18 パナソニック株式会社 回路基板の製造方法
JP5709732B2 (ja) * 2011-11-28 2015-04-30 京セラ株式会社 セラミック多層基板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3505139A (en) * 1965-10-20 1970-04-07 Rca Corp Method of making a laminated ferrite memory
US3770529A (en) * 1970-08-25 1973-11-06 Ibm Method of fabricating multilayer circuits
JPS4831729A (enExample) * 1971-08-26 1973-04-26
DE2315797C3 (de) * 1973-03-29 1981-07-30 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Keramiksubstraten für Dünnschichtschaltungen
DE2727364A1 (de) * 1977-06-16 1979-01-04 Siemens Ag Verfahren zur herstellung von keramiksubstraten
JPS55111207A (en) * 1979-02-21 1980-08-27 Hitachi Ltd Preparation of ceramic raw sheet

Also Published As

Publication number Publication date
JPS58154293A (ja) 1983-09-13
US4497677A (en) 1985-02-05

Similar Documents

Publication Publication Date Title
JPH0355282B2 (enExample)
US5601672A (en) Method for making ceramic substrates from thin and thick ceramic greensheets
JP3351043B2 (ja) 多層セラミック基板の製造方法
US7879169B2 (en) Method for producing ceramic compact
JPH0213472B2 (enExample)
EP1405552B1 (en) Method for manufacturing ceramic multilayer circuit board
CN113488335B (zh) 一种制造多层陶瓷电容器的方法
JPS61124197A (ja) セラミツク多層基板の製造方法
JPH02166793A (ja) 多層セラミック回路基板の製造方法
JP3166953B2 (ja) セラミック電子部品の製造方法
JPS63100051A (ja) 磁器シ−トの製造方法
JPS58197796A (ja) セラミツク基板の製造方法
JP3336776B2 (ja) 積層セラミック電子部品の製造方法
JPS59147486A (ja) グリ−ンシ−トの穴充填法
JP3322027B2 (ja) 積層セラミックス電子部品の製造方法
JP6841246B2 (ja) 積層電子部品の製造ライン及び積層電子部品の製造方法
JPH10294561A (ja) 高脱バインダ性多層配線基板およびその製法
JPH02267990A (ja) 回路基板の製造方法
JP2002299155A (ja) 積層型電子部品前駆体、および積層型電子部品の製造方法
JPH0561797B2 (enExample)
JP2002299835A (ja) 多層回路基板前駆体、および多層回路基板の製造方法
JP2002201077A (ja) セラミック基板の製造方法
JPH04196007A (ja) 導電性ペーストと積層電子部品の製造方法
DE102004032533A1 (de) Verfahren zur Herstellung eines mehrschichtigen Keramikverbundes mit innenliegenden metallischen Strukturen
JPH0738257A (ja) 多層セラミック基板の積層方法