JPH0354873B2 - - Google Patents
Info
- Publication number
- JPH0354873B2 JPH0354873B2 JP14358184A JP14358184A JPH0354873B2 JP H0354873 B2 JPH0354873 B2 JP H0354873B2 JP 14358184 A JP14358184 A JP 14358184A JP 14358184 A JP14358184 A JP 14358184A JP H0354873 B2 JPH0354873 B2 JP H0354873B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- solder dam
- circuit board
- soldering
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001721 polyimide Polymers 0.000 claims description 30
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 28
- 238000007747 plating Methods 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 239000004642 Polyimide Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 14
- 229910052763 palladium Inorganic materials 0.000 claims description 14
- 239000009719 polyimide resin Substances 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 11
- 239000002243 precursor Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 21
- 239000000758 substrate Substances 0.000 description 14
- 239000000919 ceramic Substances 0.000 description 4
- 239000002966 varnish Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14358184A JPS6123390A (ja) | 1984-07-11 | 1984-07-11 | 回路基板およびその製造方法 |
| FR858510660A FR2567709B1 (fr) | 1984-07-11 | 1985-07-11 | Ensemble a paillette comprenant un substrat de cablage multi-couche |
| FR8615585A FR2590105A1 (fr) | 1984-07-11 | 1986-11-07 | Ensemble a paillette comprenant un substrat de cablage multicouche |
| US07/115,565 US4840924A (en) | 1984-07-11 | 1987-10-29 | Method of fabricating a multichip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14358184A JPS6123390A (ja) | 1984-07-11 | 1984-07-11 | 回路基板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6123390A JPS6123390A (ja) | 1986-01-31 |
| JPH0354873B2 true JPH0354873B2 (ko) | 1991-08-21 |
Family
ID=15342061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14358184A Granted JPS6123390A (ja) | 1984-07-11 | 1984-07-11 | 回路基板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6123390A (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07115217B2 (ja) * | 1986-08-25 | 1995-12-13 | カルソニック株式会社 | ピストンロツドの製造方法 |
| JPH03160786A (ja) * | 1989-11-20 | 1991-07-10 | Fujitsu Ltd | 薄膜印刷配線回路基板 |
-
1984
- 1984-07-11 JP JP14358184A patent/JPS6123390A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6123390A (ja) | 1986-01-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |