JPH0347578B2 - - Google Patents

Info

Publication number
JPH0347578B2
JPH0347578B2 JP58203872A JP20387283A JPH0347578B2 JP H0347578 B2 JPH0347578 B2 JP H0347578B2 JP 58203872 A JP58203872 A JP 58203872A JP 20387283 A JP20387283 A JP 20387283A JP H0347578 B2 JPH0347578 B2 JP H0347578B2
Authority
JP
Japan
Prior art keywords
wire
bonding
strength
tensile strength
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58203872A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6095947A (ja
Inventor
Yasuo Fukui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP58203872A priority Critical patent/JPS6095947A/ja
Publication of JPS6095947A publication Critical patent/JPS6095947A/ja
Publication of JPH0347578B2 publication Critical patent/JPH0347578B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/015—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H01L2224/4321—Pulling
    • H10W72/50—
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
JP58203872A 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線 Granted JPS6095947A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58203872A JPS6095947A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58203872A JPS6095947A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Publications (2)

Publication Number Publication Date
JPS6095947A JPS6095947A (ja) 1985-05-29
JPH0347578B2 true JPH0347578B2 (cg-RX-API-DMAC10.html) 1991-07-19

Family

ID=16481105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58203872A Granted JPS6095947A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Country Status (1)

Country Link
JP (1) JPS6095947A (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3510039B2 (ja) * 1996-03-15 2004-03-22 株式会社デンソー 半導体装置およびその製造方法
US6703707B1 (en) 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
US6693350B2 (en) 1999-11-24 2004-02-17 Denso Corporation Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
JP4479121B2 (ja) 2001-04-25 2010-06-09 株式会社デンソー 半導体装置の製造方法
WO2025028382A1 (ja) * 2023-07-31 2025-02-06 田中電子工業株式会社 アルミニウム配線材及びその製造方法

Also Published As

Publication number Publication date
JPS6095947A (ja) 1985-05-29

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees