JPH0320065B2 - - Google Patents

Info

Publication number
JPH0320065B2
JPH0320065B2 JP58203875A JP20387583A JPH0320065B2 JP H0320065 B2 JPH0320065 B2 JP H0320065B2 JP 58203875 A JP58203875 A JP 58203875A JP 20387583 A JP20387583 A JP 20387583A JP H0320065 B2 JPH0320065 B2 JP H0320065B2
Authority
JP
Japan
Prior art keywords
bonding
added
wire
small
corrosion resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58203875A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6095950A (ja
Inventor
Shozo Hayashi
Shinji Shirakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP58203875A priority Critical patent/JPS6095950A/ja
Publication of JPS6095950A publication Critical patent/JPS6095950A/ja
Publication of JPH0320065B2 publication Critical patent/JPH0320065B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/015—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H01L2224/4321—Pulling
    • H10W72/01551—
    • H10W72/075—
    • H10W72/50—
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
JP58203875A 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線 Granted JPS6095950A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58203875A JPS6095950A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58203875A JPS6095950A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Publications (2)

Publication Number Publication Date
JPS6095950A JPS6095950A (ja) 1985-05-29
JPH0320065B2 true JPH0320065B2 (cg-RX-API-DMAC10.html) 1991-03-18

Family

ID=16481158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58203875A Granted JPS6095950A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Country Status (1)

Country Link
JP (1) JPS6095950A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60198851A (ja) * 1984-03-23 1985-10-08 Hitachi Ltd 半導体用高耐食高硬度ボール付アルミニウム合金ワイヤ
JPH0615700B2 (ja) * 1986-03-19 1994-03-02 日本軽金属株式会社 アルミニウム細線

Also Published As

Publication number Publication date
JPS6095950A (ja) 1985-05-29

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