JPH0317216B2 - - Google Patents

Info

Publication number
JPH0317216B2
JPH0317216B2 JP58203881A JP20388183A JPH0317216B2 JP H0317216 B2 JPH0317216 B2 JP H0317216B2 JP 58203881 A JP58203881 A JP 58203881A JP 20388183 A JP20388183 A JP 20388183A JP H0317216 B2 JPH0317216 B2 JP H0317216B2
Authority
JP
Japan
Prior art keywords
wire
bonding
added
strength
tensile strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58203881A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6095956A (ja
Inventor
Shozo Hayashi
Shinji Shirakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP58203881A priority Critical patent/JPS6095956A/ja
Publication of JPS6095956A publication Critical patent/JPS6095956A/ja
Publication of JPH0317216B2 publication Critical patent/JPH0317216B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/015—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H01L2224/4321—Pulling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
    • H10W72/50—
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
JP58203881A 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線 Granted JPS6095956A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58203881A JPS6095956A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58203881A JPS6095956A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Publications (2)

Publication Number Publication Date
JPS6095956A JPS6095956A (ja) 1985-05-29
JPH0317216B2 true JPH0317216B2 (cg-RX-API-DMAC10.html) 1991-03-07

Family

ID=16481261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58203881A Granted JPS6095956A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Country Status (1)

Country Link
JP (1) JPS6095956A (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPS6095956A (ja) 1985-05-29

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