JPH0347341Y2 - - Google Patents
Info
- Publication number
- JPH0347341Y2 JPH0347341Y2 JP1985194880U JP19488085U JPH0347341Y2 JP H0347341 Y2 JPH0347341 Y2 JP H0347341Y2 JP 1985194880 U JP1985194880 U JP 1985194880U JP 19488085 U JP19488085 U JP 19488085U JP H0347341 Y2 JPH0347341 Y2 JP H0347341Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed wiring
- electrode
- wiring film
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 101100434911 Mus musculus Angpt1 gene Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985194880U JPH0347341Y2 (US07714131-20100511-C00038.png) | 1985-12-18 | 1985-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985194880U JPH0347341Y2 (US07714131-20100511-C00038.png) | 1985-12-18 | 1985-12-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62103278U JPS62103278U (US07714131-20100511-C00038.png) | 1987-07-01 |
| JPH0347341Y2 true JPH0347341Y2 (US07714131-20100511-C00038.png) | 1991-10-08 |
Family
ID=31152260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985194880U Expired JPH0347341Y2 (US07714131-20100511-C00038.png) | 1985-12-18 | 1985-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0347341Y2 (US07714131-20100511-C00038.png) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60180186A (ja) * | 1984-02-22 | 1985-09-13 | 松下電器産業株式会社 | プリント基板 |
| JPS6236900A (ja) * | 1984-08-06 | 1987-02-17 | イビデン株式会社 | 複合プリント配線板の製造方法 |
| JPS62142398A (ja) * | 1985-12-17 | 1987-06-25 | シャープ株式会社 | プリント配線板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58182466U (ja) * | 1982-05-31 | 1983-12-05 | 株式会社セコニツク | 回路基板 |
-
1985
- 1985-12-18 JP JP1985194880U patent/JPH0347341Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60180186A (ja) * | 1984-02-22 | 1985-09-13 | 松下電器産業株式会社 | プリント基板 |
| JPS6236900A (ja) * | 1984-08-06 | 1987-02-17 | イビデン株式会社 | 複合プリント配線板の製造方法 |
| JPS62142398A (ja) * | 1985-12-17 | 1987-06-25 | シャープ株式会社 | プリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62103278U (US07714131-20100511-C00038.png) | 1987-07-01 |
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