JPH0346260B2 - - Google Patents

Info

Publication number
JPH0346260B2
JPH0346260B2 JP61027233A JP2723386A JPH0346260B2 JP H0346260 B2 JPH0346260 B2 JP H0346260B2 JP 61027233 A JP61027233 A JP 61027233A JP 2723386 A JP2723386 A JP 2723386A JP H0346260 B2 JPH0346260 B2 JP H0346260B2
Authority
JP
Japan
Prior art keywords
rotary table
lower rotary
wafer
grinding device
vertical direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61027233A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62188655A (ja
Inventor
Akira Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP61027233A priority Critical patent/JPS62188655A/ja
Publication of JPS62188655A publication Critical patent/JPS62188655A/ja
Publication of JPH0346260B2 publication Critical patent/JPH0346260B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP61027233A 1986-02-10 1986-02-10 ウエ−ハの外周研削装置 Granted JPS62188655A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61027233A JPS62188655A (ja) 1986-02-10 1986-02-10 ウエ−ハの外周研削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61027233A JPS62188655A (ja) 1986-02-10 1986-02-10 ウエ−ハの外周研削装置

Publications (2)

Publication Number Publication Date
JPS62188655A JPS62188655A (ja) 1987-08-18
JPH0346260B2 true JPH0346260B2 (cs) 1991-07-15

Family

ID=12215353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61027233A Granted JPS62188655A (ja) 1986-02-10 1986-02-10 ウエ−ハの外周研削装置

Country Status (1)

Country Link
JP (1) JPS62188655A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106808344B (zh) * 2015-12-01 2021-06-15 保文明 平转石材线条双用连续磨机

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59183328U (ja) * 1983-05-17 1984-12-06 不二越機械工業株式会社 研削装置
JPS6059110A (ja) * 1983-09-12 1985-04-05 Kanebo Silk Eregansu Kk 繰糸装置

Also Published As

Publication number Publication date
JPS62188655A (ja) 1987-08-18

Similar Documents

Publication Publication Date Title
US4465416A (en) Wafer handling mechanism
TWI636858B (zh) Substrate transfer robot and substrate processing system
KR0165350B1 (ko) 반도체웨이퍼 공급장치
JPS6236943B2 (cs)
JP3661138B2 (ja) アライメント高速処理機構
JPH11171334A (ja) 複合加工ラインにおけるワーク旋回方法及びその装置
JPH0346260B2 (cs)
JPH0314723B2 (cs)
TWM540388U (zh) 晶圓裝卸裝置
JPH09162264A (ja) 基板搬送装置
JPH04196531A (ja) 洗浄装置
JPH0346261B2 (cs)
JPH0735393Y2 (ja) 縦型プラズマ処理機のウエハー搬送装置
JP4564695B2 (ja) ウェーハカセット並びに半導体ウェーハの搬入方法及び搬出方法
JPS57211746A (en) Wafer conveying apparatus
JP2003266266A (ja) 半導体ウエーハの搬送装置
CN221928022U (zh) 一种晶圆传送装置
JP7162551B2 (ja) 加工装置
JP2973068B2 (ja) ワーク抜き取り装置
CN216004387U (zh) 一种晶圆下片设备
JP2000158309A (ja) 端面研磨装置における周面研磨部の搬送部材配列
JP2581085B2 (ja) ウエ−ハアライメント装置
JP3091469B2 (ja) 半導体装置の製造方法
JPH0580659U (ja) ポリッシングマシンにおけるキャリアプレートの搬送装置
JP2017069488A (ja) 搬送機構