JPH0346260B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a wafer peripheral grinding device equipped with a conveying device for inserting and removing a semiconductor wafer.

[Prior Art] Conventionally, as this type of grinding device, a peripheral grinding device as shown in FIG. 3 is known.

The outer circumferential grinding device shown in this figure has an upper rotary table 1 arranged with its axis directed in the vertical direction, and an axis X that is aligned with the upper rotary table 1, and
A lower rotary table 2 arranged to be movable in the vertical direction, a grinding device 4 for grinding the outer periphery of a semiconductor wafer 3 held between the upper rotary table 1 and the lower rotary table 2, and The feeder 5 is roughly constructed of a feeder 5 that is movable toward and away from the After placing the semiconductor wafer 3 on the upper surface, the lower rotary table 2 is raised and the semiconductor wafer 3 is placed on the upper and lower rotary tables 1 and 2.
The outer periphery of the semiconductor wafer 3 can be ground by the grinding device 4 while being held between the wafers and rotating the semiconductor wafers.

Then, the ground semiconductor wafer 3 is
The unprocessed semiconductor wafers are taken out from the lower rotary table 2 by the feeder 5, and the unprocessed semiconductor wafers are placed on the upper surface of the lower rotary table 2 by the feeder 5. In this way, a large number of semiconductor wafers are continuously ground. It is becoming possible to do so.

[Problems to be Solved by the Invention] However, in the outer periphery grinding device having the above configuration, the feeder is used to insert and take out semiconductor wafers, so the feeder has to operate frequently, which reduces the cycle time. There was a problem with the length of time. That is, the feeder moves horizontally and vertically to take out processed semiconductor wafers placed on a lower rotary table while fixing them to suction pads, and places unprocessed semiconductor wafers on the lower rotary table. This requires a series of operations, during which the grinding process must be stopped.

[Purpose of the Invention] This invention was made to solve the above problem, and it is possible to reduce the movement of the feeder, thereby quickly transferring processed semiconductor wafers and unprocessed semiconductor wafers. It is an object of the present invention to provide a wafer outer circumferential grinding device that can be replaced and can shorten the cycle time of grinding.

[Means for Solving the Problems] In the wafer outer circumferential grinding apparatus of the present invention, the transfer device that places the wafer on the upper surface of the lower rotary table and takes out the wafer from the upper surface of the lower rotary table has a wafer on the upper surface. A first conveying means on which a rotary table is placed and movable toward and away from the axis of each table, and a lower rotary a second conveying means having a pair of conveyor belts arranged parallel and symmetrically on both sides of the vertical axis of the table, and the first conveying means has an upper rotating table and a lower rotating table. The shape is such that the lower rotary table can pass in the vertical direction while being positioned between the table and the first conveying means can move backward when the first conveying means is in the position and the lower rotary table is raised. An opening is formed between each of the conveyor belts, and a space is provided between each of the conveyor belts through which the lower rotary table can pass in the vertical direction and where a wafer can be placed across the conveyor belts. Features.

[Embodiment] FIGS. 1 and 2 are diagrams showing an embodiment of the present invention. In the drawings, the same components as those of the conventional one are given the same reference numerals, and the explanation thereof will be omitted.

The wafer peripheral grinding device shown in these figures is
A transport device for placing unprocessed semiconductor wafers on the lower rotary table and taking out processed semiconductor wafers from the lower rotary table.
Feeder 7 and belt conveyor (second conveyance means)
It is composed of 8.

First, the feeder 7 will be explained. In the figure, reference numeral 9 is a frame serving as a skeleton. A shaft 10 is disposed on the frame 9 and has an axis oriented in the front-rear direction (left-right direction in the figure). A feed arm (first conveyance means) 11 located between the upper rotary table 1 and the lower rotary table 2 at the lower end is attached to the shaft 10.
It is supported so that it can move freely in the longitudinal direction. The feed arm 11 transfers the semiconductor wafer 3 placed on its upper surface to the lower rotary table 2 side, and has a large number of vacuum suction holes (not shown in the figure) for sucking and fixing the semiconductor wafer 3. figure)
is left open.

Further, the feed arm 11 has a concave curved surface section 12 formed by cutting out a U-shaped wall section from the tip end to the rear end. The radius of curvature of this concave curved surface portion (opening portion) 12 is set to be larger than the radius of the lower rotary table 2. and,
At the forward end of the feed arm 11, the center of curvature of the concave curved surface portion 12 and the axis X of the upper rotary table 1 are aligned. As a result, the feed arm 11 does not interfere with the lower rotary table 2 that moves up and down, and even when the lower rotary table 2 is raised, the feed arm 11 does not interfere with the lower rotary table 2.
It is possible to advance and retreat to the side.

Next, the belt conveyor 8 will be explained.
A driven shaft 13 whose axis is oriented in the left-right direction is rotatably supported at the tip of the frame 9 . Further, a driven shaft 14 positioned below the driven shaft 13 is rotatably supported downstream of the driven shaft 13. These two driven shafts 13,
Belts 15, 15 are wound around both ends of 14. In the attached state, these belts 15, 15 are attached to the feed arm 11 at the forward end.
and the lower rotary table 2 at the lower end. Further, each of the belts 15, 15 is located on both the left and right sides of the lower rotary table 2. This prevents the belt 15 from interfering with the lower rotary table 2, which moves up and down. Furthermore, a drive shaft (not shown) is provided downstream of the driven shaft 14.
is arranged, and belts 16, 16 are wound around both sides of the drive shaft and driven shaft 14. Such a belt conveyor 8 transports the semiconductor wafers 3 placed on the belts 15, 15 backward, and is constantly operated when performing grinding processing.

In order to continuously grind the semiconductor wafer 3 in the wafer outer circumferential grinding apparatus configured as described above, first, the semiconductor wafer 3 is placed on the upper surface while the lower rotary table 2 is lowered to the lower end. The feed arm 11 is moved to its forward end. Next, the vacuum suction of the feed arm 11 is stopped, and the semiconductor wafer 3 is transferred to the feed arm 1.
1, and raise the lower rotary table 2. Then, the semiconductor wafer 3 is transferred to the upper surface of the lower rotary table 2, rises as it is, and is held between the upper and lower rotary tables 1 and 2. In this state, the outer periphery of the semiconductor wafer 3 is ground by the grinding device 4 while rotating the upper and lower rotary tables 1 and 2.

In the meantime, the feed arm 11 is retreated, and the semiconductor wafer to be processed next is placed on its upper surface. Then, when the grinding of the semiconductor wafer 3 is completed, the lower rotary table 2 is lowered. Then, the processed semiconductor wafer 3 is transferred to the belt conveyor 8 and transported to the rear. During this time, the feed arm 11 is moved to its forward end. In this way, the semiconductor wafers 3 are sequentially ground.

In the wafer outer circumferential grinding apparatus having the above configuration, the semiconductor wafer 3 is transferred from the feed arm 11 by raising the lower rotary table 2,
Since the structure is such that the processed semiconductor wafer 3 is transferred to the belt conveyor 8 by lowering the lower rotary table 2, the lower rotary table 2
3 semiconductor wafers in the time required to move up and down
can be inserted and taken out, and the cycle time for grinding the outer periphery of semiconductor wafers can be significantly shortened.

Furthermore, since each belt 15 is tilted toward the wafer transport direction, even if the wafer 3 is stuck to the lower rotary table 2 due to the grinding fluid used for outer periphery grinding, when the lower rotary table 2 is lowered, , the wafer 3 is attached to each belt 15 from one end side.
The wafer 3 can be safely peeled off from the lower rotary table 2 without damaging the wafer 3 and transferred onto each belt 15.

[Effects of the Invention] As explained above, according to the wafer outer circumferential grinding device of the present invention, when the wafer is carried in, the first conveyance means carrying the wafer is advanced toward the table axis, and the lower rotary table by raising it through the opening of the first conveying means,
The wafer is transferred to the lower rotary table and is held between it and the upper rotary table. Further, when carrying out a wafer, the lower rotary table is simply lowered through the space between both conveyor belts, and the held wafer is transferred to the conveyor belt which is constantly running and conveyed to the next process.

That is, with this device, wafers can be loaded and unloaded simply by moving the lower rotary table up and down through the first and second transport means, and processed wafers and unprocessed wafers can be quickly exchanged. be able to. Furthermore, in both cases of loading and unloading, wafers are transferred between each section almost instantaneously, so the time required for one operation cycle can be shortened and processing speed can be increased. Furthermore, the second conveyance means only needs to run the conveyor belt continuously at all times and does not require any special operation control. Therefore, the operation control is required when exchanging wafers only for the first conveyance means. There are only forward and backward movements and lifting and lowering movements of the lower rotary table, so the equipment cost is low.

[Brief explanation of drawings]

1 and 2 are diagrams showing an embodiment of the present invention, in which FIG. 1 is a sectional view taken along the - line in FIG. 2 showing a wafer outer peripheral grinding device, and FIG. The direction arrow view and FIG. 3 are side sectional views showing an example of a conventional wafer outer peripheral grinding device. 1... Upper rotating table, 2... Lower rotating table, 3... Semiconductor wafer, 4... Grinding device,
7... Feeder (conveyance device), 8... Belt conveyor (second conveyance means), 11... Feed arm (first conveyance means).

Claims (1)

[Scope of Claims] 1. An upper rotary table whose axis is directed in the vertical direction, a lower rotary table whose axis coincides with the upper rotary table and which is movable in the vertical direction, and A grinding device that grinds the outer periphery of a wafer held between a table and the upper rotary table, and a conveying device that places the wafer on the upper surface of the lower rotary table and takes out the wafer from the upper surface of the lower rotary table. A wafer outer circumferential grinding apparatus comprising: a first conveying means on which the wafer is placed and movable in a direction toward and away from the axis; a second conveying means having a pair of conveying belts disposed parallel and symmetrically on both sides of the vertical axis of the lower rotary table between the first conveying means and the lowered position of the lower rotary table; The first conveyance means is configured such that the lower rotary table can pass in the vertical direction while the first conveyance means is positioned between the upper rotary table and the lower rotary table, and the first conveyance means is positioned between the upper rotary table and the lower rotary table. with the lower rotary table in the raised position.
An opening is formed in a shape that allows the transport means to retreat, and between each of the transport belts, the lower rotary table can pass in the vertical direction, and the wafer can be placed across the transport belts. A wafer peripheral grinding device characterized in that a wafer peripheral grinding device is provided with a space at which the wafers can be placed at intervals.