JPS62188655A - Device for grinding outer periphery of wafer - Google Patents

Abstract

PURPOSE:To rapidly replace a wafer and greatly reduce a machining cycle by providing two conveying devices which do not interfere with a vertically moving lower rotary table. CONSTITUTION:A U-shaped, cut-out and curvedly recessed part 12 which is larger than the radius of a lower rotary table 2 is provided on a feed arm 11. The belts 15, 15 of a belt conveyor 8 are positioned on both right and left ends of the lower rotary table 2, with which both the belt do not interfere. The lower rotary table 2 is lowered down to the lowering end and the feed arm 11 on which a wafer 3 is placed is advanced and, by stopping vacuum suction, as the table 2 is lifted up, the wafer 3 is placed on top of the table 2 and held in between upper and lower tables 1, 2. In this condition, the outer periphery of the wafer 3 is ground by a grinding device 4. Meanwhile, the feed arm 11 is returned to its original position and the next wafer is placed on it. When the machining is finished, the table 2 is lowered and the wafer 3 is translocated onto the belt conveyor 8 and sent out rearward.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a wafer peripheral grinding device equipped with a transfer device for inserting and removing a semiconductor wafer.

[Prior Art] Conventionally, as this type of grinding device, a peripheral grinding device as shown in FIG. 3 is known.

The outer circumferential grinding device shown in this figure has an upper rotary table l arranged with its axis directed in the vertical direction, and a lower rotary table arranged such that the upper rotary table l and the axis X coincide with each other and are arranged to be movable in the vertical direction. Table 2 and upper rotating table 1
and lower rotating table □], N・1・++17
IIh yob + JM fi・11Z ate glance' H・^ ・r ・1, ri lTy /+I
r) A grinding device 4 for grinding the semiconductor wafer 1, and a feeder 5 that is movable in the vertical direction and in the direction toward and away from the axis X, and the semiconductor wafer 3 is placed in the vacuum of the feeder 5. It is adsorbed and fixed on the pad 6 and transferred.
After placing this on the upper surface of the lower rotary table 2, the lower rotary table 2 is raised and the semiconductor wafer 3 is held between the upper and lower rotary tables 1.2, and while rotating these, the semiconductor wafer 3 is The outer periphery can be ground.

The ground semiconductor wafer 3 is taken out from the lower rotary table 2 by the feeder 5, and the unprocessed semiconductor wafer is placed on the upper surface of the lower rotary table 2 by the feeder 5. It is now possible to grind wafers continuously.

[Problems to be Solved by the Invention] However, in the peripheral grinding device having the above configuration, the semiconductor wafer is inserted and taken out by the feeder, which increases the number of operations of the feeder and increases the cycle time. There was a problem. That is, the feeder moves horizontally and vertically to take out processed semiconductor wafers placed on a lower rotary table while being fixed to a suction pad, and places unprocessed semiconductor wafers on the lower rotary table. This requires a series of operations, during which the grinding process must be stopped.

[Object of the Invention] This invention was made to solve the above problem, and it is possible to reduce the operation of the feeder, thereby quickly exchanging processed semiconductor wafers and unprocessed semiconductor wafers. It is an object of the present invention to provide a wafer outer peripheral grinding device that can reduce the cycle time of grinding processing.

[Means for Solving the Problems] The wafer peripheral grinding apparatus of the present invention places the wafer on the upper surface of the lower rotary table, and includes a transfer device for taking out the wafer from the upper surface of the lower rotary table. is placed thereon so as to be movable toward and away from the axis, and to prevent interference with the lower rotary table that moves up and down when positioned between the upper rotary table and the lower rotary table. A first conveying means whose portion intersecting the axis is open, and a first conveying means provided at a position intersecting the axis between the first conveying means and the lower rotary table so that the lower rotary table that moves up and down does not interfere with each other. and a second conveying means configured as shown in FIG.

[Embodiment] FIGS. 1 and 2 are diagrams showing an embodiment of the present invention. In the drawings, the same components as those of the conventional one are given the same reference numerals, and the explanation thereof will be omitted.

The wafer contour grinding device (not shown in these figures) places unprocessed semiconductor wafers on a lower rotary table, and also has a conveyor device for taking out processed semiconductor wafers from the lower rotary table, which is connected to a feeder 7 and a belt conveyor. (Second conveyance means) 8.

First, the feeder 7 will be explained. In the figure, reference numeral 9 is a frame serving as a skeleton. This frame 9 is provided with an axis lO whose axis is directed in the front-rear direction (left-right direction in the figure). A feed arm (first conveyance means) 11 is supported on the shaft 10 so as to be movable in the longitudinal direction of the shaft 10, which is located between the upper rotary table l and the lower rotary table 2 at the lower end. . The feed arm 11 is for transferring the semiconductor wafer 3 placed on its upper surface to the lower rotary table 2 side,
A large number of vacuum suction holes (not shown) for suctioning and fixing the semiconductor wafer 3 are opened on its upper surface.

Further, the feed arm 11 is formed with a concave curved surface portion 12 formed by cutting out the wall portion in a U-shape from the tip end to the rear end. The radius of curvature of this concave curved surface portion I2 is set larger than the radius of the lower rotary table 2. Then, at the forward end of the feed arm 11, the center of curvature of the concave curved surface portion 12 and the upper rotary table! The axis line X of the two lines coincides with each other. This prevents the feed arm 11 from interfering with the lower rotary table 2, which moves up and down.

Next, the belt conveyor 8 will be described. A driven shaft 13 whose axis is oriented in the left-right direction is rotatably supported at the tip of the frame 9. In addition, a driven shaft I4 located below the driven shaft 13 is provided at the downstream stage of the driven shaft 13.
is rotatably supported. Belts 5 and 15 are wound around both ends of these two driven shafts 13 and 14. In the attached state, these belts 15, 15 are attached to the feed arm l! at the forward end. and the lower rotary table 2 at the lower end. Also, each belt I5! 5 are located on both left and right sides of the lower rotary table 2. With this, the belt! 5 is designed not to interfere with the lower rotary table 2 which moves up and down. Further, a drive shaft (not shown) is disposed downstream of the driven shaft 14, and bells hlf3 and 16 are wound around both ends of the drive shaft and the driven shaft 14. This kind of heald conveyor 8 is a belt! It transports the semiconductor wafer 3 placed on the wafer 5/15 to the rear, and is designed to be constantly operated when grinding is performed.

In the wafer outer circumferential grinding apparatus configured as described above, in order to continuously grind the semiconductor wafer 3, first, the lower rotary table 2 is lowered to the lower end, and then
Feed arm 11 with semiconductor wafer 3 placed on the top surface
to its forward end. Next, feed arm l
! The vacuum suction is stopped, the semiconductor wafer 3 is left in a state where it is removed from the feed arm 11, and the lower rotary table 2 is raised. Then, the semiconductor wafer 3 is transferred to the upper surface of the lower rotary table 2, rises as it is, and is held between the upper and lower rotary tables 1.2. In this state, the upper and lower rotating table! , 2 are rotated while the outer periphery of the semiconductor wafer 3 is ground by the grinding device 4.

In the meantime, the feed arm 11 is retreated, and a semiconductor wafer to be processed next is placed on its upper surface. and,
When the grinding process of the semiconductor wafer 3 is completed, the lower rotary table 2 is lowered. Then, the processed semiconductor wafer 3 is transferred to the belt conveyor 8 and transported to the rear. During this time, the feed arm 11 is moved to its forward end. In this way, the semiconductor wafers 3 are sequentially ground.

In the wafer outer circumferential grinding apparatus having the above configuration, the semiconductor wafer 3 is transferred from the feed arm 11 by raising the lower rotary table 2, and the processed semiconductor wafer 3 is transferred to the belt conveyor 8 by lowering the lower rotary table 2. Since it is configured so that it can be transferred, the semiconductor wafer 3 can be inserted and removed only in the time required to move the lower rotary table 2 up and down, and the cycle time for grinding the outer periphery of the semiconductor wafer can be significantly shortened. I can do it.

In the embodiment on the flow side, the second conveying means is the belt conveyor 8, but the structure is not limited to this, and for example, a belt conveyor 8 having the same structure as the feeder 7 may be arranged.

[Effects of the Invention] As explained above, in the wafer peripheral grinding apparatus of the present invention, the wafer is placed on the upper surface of the lower rotary table, and the transfer device for taking out the wafer from the upper surface of the lower rotary table is mounted on the upper surface. The wafer is placed thereon and is provided so as to be movable toward and away from the axis, and to prevent interference with the lower rotary table that moves up and down when positioned between the upper rotary table and the lower rotary table. A first conveyance means whose portion intersecting the axis is open, and a lower rotary table which is provided at a position intersecting the axis between the first conveyance means and the lower rotary table and which moves up and down, does not interfere with each other. Since the second conveying means is configured as shown in FIG. This effect can be obtained.

[Brief explanation of drawings]

1 and 2 are diagrams showing one embodiment of the present invention, in which FIG. 1 is a sectional view taken along the line I-1 in FIG. FIG. 3 is a side sectional view showing an example of a conventional wafer outer peripheral grinding apparatus. ! ... Upper rotary table, 2. Lower rotary table, 3. Semiconductor wafer, 4. Grinding device, 5. Feeder (conveying device),

Claims (1)

[Claims] The upper rotary table is provided with its axis directed in the vertical direction, and the axis is aligned with this upper rotary table,
A lower rotary table that is movable in the vertical direction,
A grinding device that grinds the outer periphery of a wafer held between the lower rotary table and the upper rotary table, and a grinding device that places the wafer on the upper surface of the lower rotary table and takes out the wafer from the upper surface of the lower rotary table. A wafer outer peripheral grinding apparatus comprising a transport device, wherein the transport device has a wafer placed on its upper surface,
A portion that is movable toward and away from the axis, and that intersects with the axis so that the lower rotary table that moves up and down does not interfere when positioned between the upper rotary table and the lower rotary table. is provided at a position intersecting the above-mentioned axis line between the first conveying means with the first conveying means opened and the first conveying means and the lower rotary table, and intersects the axis line so that the lower rotary table that moves up and down does not interfere. A wafer outer peripheral grinding apparatus comprising a second conveying means having a partially open portion.