JPH06163670A - Substrate transfer apparatus in substrate processing apparatus - Google Patents

Substrate transfer apparatus in substrate processing apparatus

Info

Publication number
JPH06163670A
JPH06163670A JP18074393A JP18074393A JPH06163670A JP H06163670 A JPH06163670 A JP H06163670A JP 18074393 A JP18074393 A JP 18074393A JP 18074393 A JP18074393 A JP 18074393A JP H06163670 A JPH06163670 A JP H06163670A
Authority
JP
Japan
Prior art keywords
substrate
cassette
transfer
substrate transfer
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18074393A
Other languages
Japanese (ja)
Other versions
JP2824951B2 (en
Inventor
Yusuke Muraoka
祐介 村岡
Junichi Yonemura
潤一 米村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP5180743A priority Critical patent/JP2824951B2/en
Publication of JPH06163670A publication Critical patent/JPH06163670A/en
Application granted granted Critical
Publication of JP2824951B2 publication Critical patent/JP2824951B2/en
Anticipated expiration legal-status Critical
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Links

Abstract

PURPOSE:To prevent contamination of a processed substrate with a substrate delivery tool when the substrate is transferred between the inside of a cassette and a substrate conveying robot. CONSTITUTION:A substrate mounting part 18 of a substrate delivery tool 17 is constituted of a first substrate mounting part 38 and a second substrate mounting part 39, which hold a substrate 9 in the uprightly aligned state, respectively. The first substrate mounting part 38 and the second substrate mounting part 39 are constituted so that the lifting and lowering of the parts can be relatively changed with a driving device. The substrate 9 is held with one substrate mounting part at the lifted position. The first substrate mounting part 38 and the second substrate mounting part 39 are switched for the delivery of the substrate 9, which is not processed yet, and the delivery of the processed substrate 9. Thus, the contamination of the processed substrate 9 is prevented.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体基板、ガラス基
板等の基板(以下、単に「基板」という)を処理する基
板処理装置における基板受け渡し装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer apparatus in a substrate processing apparatus for processing a substrate such as a semiconductor substrate or a glass substrate (hereinafter simply referred to as "substrate").

【0002】[0002]

【従来技術】基板処理装置の従来技術として、図12及
び図13に示すものがある。これは図12に示すよう
に、複数の基板109を起立整列状態で収容するカセッ
ト108を載置するカセット載置テーブル111と、基
板受け渡し具117と、複数の処理槽を有する基板処理
部105と、カセット載置テーブル111と基板処理部
105との間を移動する基板搬送ロボット104とを備
え、カセット載置テーブル111にカセット108の下
開口部115に臨む受け渡し具挿通孔116をあけ、こ
の受け渡し具挿通孔116の下方に基板受け渡し具11
7を起立状に設け、この基板受け渡し具117の上端部
に複数の基板109を起立整列状態で保持する基板載置
部118を設け、この基板受け渡し具117とカセット
載置テーブル111とを相対的に昇降させて、基板受け
渡し具117の基板載置部118で複数の基板109を
起立整列状態のまま保持して、カセット108内と基板
搬送ロボット104との間で複数の基板109を一括し
て受け渡し可能に構成してある。尚、図12において、
符号114は回転駆動装置、図13において、符号10
1はカセット搬出入ステージ、102はカセット搬送ロ
ボット、110はカセット搬入位置、112はカセット
搬出位置である。
2. Description of the Related Art A conventional substrate processing apparatus is shown in FIGS. As shown in FIG. 12, a cassette mounting table 111 for mounting a cassette 108 for accommodating a plurality of substrates 109 in an upright alignment state, a substrate transfer tool 117, and a substrate processing section 105 having a plurality of processing tanks. And a substrate transfer robot 104 that moves between the cassette mounting table 111 and the substrate processing unit 105, and a transfer tool insertion hole 116 that faces the lower opening 115 of the cassette 108 is opened in the cassette mounting table 111, and this transfer is performed. The board transfer tool 11 is provided below the tool insertion hole 116.
7 is provided in an upright shape, and a substrate placing section 118 for holding a plurality of substrates 109 in an upright alignment state is provided at an upper end portion of the substrate delivering tool 117, and the substrate delivering tool 117 and the cassette placing table 111 are relatively arranged. The substrate mounting unit 118 of the substrate transfer tool 117 holds the plurality of substrates 109 in the upright alignment state, and the plurality of substrates 109 are collectively packaged between the cassette 108 and the substrate transfer robot 104. It is configured to be handable. In addition, in FIG.
Reference numeral 114 is a rotary drive device, and in FIG.
1 is a cassette loading / unloading stage, 102 is a cassette carrying robot, 110 is a cassette loading position, and 112 is a cassette loading position.

【0003】この種の基板処理装置では、基板処理前
は、未処理基板109を収容したカセット108をカセ
ット載置テーブル111に載置し、カセット載置テーブ
ル111を基板受け渡し具117に対して相対的に下降
させて、受け渡し具挿通孔116とカセット108の下
開口部115とを貫通してきた基板受け渡し具117の
基板載置部118に未処理基板109を保持して、未処
理基板109をカセット108の上方に取り出し、これ
を基板搬送ロボット104に受け渡して、基板処理部1
05まで搬送し、処理槽内の処理液に浸漬してその処理
を行うことができる。そして、基板処理後は、処理済み
基板109を基板搬送ロボット104で基板処理部10
5からカセット載置テーブル111まで搬送し、洗浄済
みカセット108の上方に位置させた基板受け渡し具1
17の基板載置部118に保持させ、カセット載置テー
ブル111を基板受け渡し具117に対して相対的に上
昇させて、予めカセット載置テーブル111に載置して
おいた洗浄済みカセット108に処理済み基板109を
収容する。
In this type of substrate processing apparatus, before the substrate processing, the cassette 108 containing the unprocessed substrate 109 is placed on the cassette placing table 111, and the cassette placing table 111 is placed relative to the substrate transfer tool 117. The unprocessed substrate 109 is held by the substrate placing portion 118 of the substrate transfer tool 117 that has passed through the transfer tool insertion hole 116 and the lower opening 115 of the cassette 108, and the unprocessed substrate 109 is cassette. The substrate processing unit 1 is taken out above the substrate 108 and transferred to the substrate transfer robot 104.
It is possible to carry out the treatment by carrying it to 05 and immersing it in the treatment liquid in the treatment tank. Then, after the substrate processing, the processed substrate 109 is transferred to the substrate processing unit 10 by the substrate transfer robot 104.
5 to the cassette mounting table 111, and the substrate transfer tool 1 positioned above the cleaned cassette 108
17, the cassette mounting table 111 is raised relative to the substrate transfer tool 117, and processed into the cleaned cassette 108 previously mounted on the cassette mounting table 111. The completed substrate 109 is accommodated.

【0004】ところで、この従来の基板処理装置では、
未処理基板109の受け渡しと処理済み基板109の受
け渡しは、いずれもこれらを基板受け渡し具117の基
板載置部118の同一箇所に保持して行うようになって
いる。
By the way, in this conventional substrate processing apparatus,
Delivery of the unprocessed substrate 109 and delivery of the processed substrate 109 are both carried out by holding them at the same position on the substrate platform 118 of the substrate delivery tool 117.

【0005】[0005]

【発明が解決しようとする課題】上記従来技術では、未
処理基板109の受け渡しと処理済み基板109の受け
渡しは、いずれもこれらを基板受け渡し具117の基板
載置部118の同一箇所に保持して行うようになってい
るため、未処理基板109に付着していた汚染物質が基
板受け渡し具117の基板載置部118を介して処理済
み基板109に付着する。このため、処理済み基板10
9が汚染される。
In the above-mentioned conventional technique, the unprocessed substrate 109 and the processed substrate 109 are both delivered at the same position on the substrate placing portion 118 of the substrate delivery tool 117. Since this is done, the contaminants attached to the unprocessed substrate 109 attach to the processed substrate 109 via the substrate platform 118 of the substrate transfer tool 117. Therefore, the processed substrate 10
9 are contaminated.

【0006】また、酸化拡散工程の前処理洗浄において
は、既に洗浄された基板を洗浄することになるので、上
記のような汚染の問題はないが、洗浄後の濡れた基板を
保持した基板載置部118で乾いた基板を保持すると、
基板の種類によってはウォータマークが発生するという
弊害が生ずる。上記基板の汚染やウォータマークの発生
は、いずれも製品の歩留まりを低下させる。本発明は、
基板受け渡し具による処理済み基板の汚染やウォータマ
ークの発生を防止できる基板処理装置における基板受け
渡し装置を提供することをその課題とする。
Further, in the pre-treatment cleaning in the oxidation diffusion step, since the already cleaned substrate is cleaned, there is no problem of contamination as described above, but the substrate mounting holding the wet substrate after cleaning is carried out. When a dry substrate is held by the holder 118,
Depending on the type of substrate, the adverse effect of generating a watermark occurs. The contamination of the substrate and the generation of watermarks both reduce the yield of products. The present invention is
It is an object of the present invention to provide a substrate transfer device in a substrate processing apparatus that can prevent contamination of a processed substrate and generation of a watermark by a substrate transfer tool.

【0007】[0007]

【課題を解決するための手段】本発明では、複数の基板
を起立整列状態で収容するカセットを載置するカセット
載置テーブルと、基板受け渡し具と、基板処理部と、基
板搬送ロボットとを備え、上記カセット載置テーブルに
上記カセットの下開口部に臨む受け渡し具挿通孔をあ
け、この受け渡し具挿通孔の下方に上記基板受け渡し具
を起立状に設け、この基板受け渡し具の上端部に複数の
基板を起立整列状態で保持する基板載置部を設け、この
基板受け渡し具とカセット載置テーブルとを相対的に昇
降させて、上記基板受け渡し具の基板載置部で複数の基
板を起立整列状態のまま保持して、上記カセット内と上
記基板搬送ロボットとの間で複数の基板を一括して受け
渡し可能に構成した基板処理装置において、次のように
したことを特徴とする。
According to the present invention, there is provided a cassette mounting table for mounting a cassette for accommodating a plurality of substrates in an upright alignment state, a substrate transfer tool, a substrate processing section, and a substrate transfer robot. , The cassette mounting table is provided with a transfer tool insertion hole facing the lower opening of the cassette, the substrate transfer tool is provided upright below the transfer tool insertion hole, and a plurality of substrate transfer tools are provided at the upper end of the substrate transfer tool. A substrate placing section for holding the substrates in an upright aligned state is provided, and the substrate transfer tool and the cassette placing table are moved up and down relatively, and a plurality of substrates are upright aligned in the substrate placing section of the substrate transfer tool. In the substrate processing apparatus, which is configured to be held as it is, and is capable of collectively transferring a plurality of substrates between the inside of the cassette and the substrate transfer robot, it is characterized as follows. .

【0008】上記基板受け渡し具の基板載置部は、それ
ぞれ基板を起立整列状態で保持する第1の基板載置部分
と第2の基板載置部分とから構成する。そして、上記第
1の基板載置部分と第2の基板載置部分とを駆動装置に
より相対的に昇降切り換え可能に構成し、上昇位置にあ
る一方の基板載置部分により基板を保持するように構成
する。
The substrate mounting portion of the substrate transfer tool is composed of a first substrate mounting portion and a second substrate mounting portion which respectively hold the substrates in an upright aligned state. Then, the first substrate mounting portion and the second substrate mounting portion are configured to be relatively switchable up and down by a driving device, and the substrate is held by the one substrate mounting portion in the raised position. Constitute.

【0009】[0009]

【作用】本発明では、カセット内から未処理基板を取り
出す場合と、洗浄済みカセット内に処理済み基板を収容
する場合とで、基板受け渡し具の第1の基板載置部分と
第2の基板載置部分とを使い分ける。例えば、カセット
内から未処理基板を取り出す場合には、第1の基板載置
部分が上昇位置にあり、当該基板載置部分により複数の
基板を一括保持して持ち上げ、基板搬送ロボットに引き
渡す。また、洗浄済みカセット内に処理済み基板を収容
する場合には、第2の基板載置部分が上昇位置にあり、
基板搬送ロボットから複数の基板を一括して受け取る。
この場合、処理済み基板は第1の基板載置部分に触れる
ことはないので、未処理基板に付着している汚染物質が
第1の基板載置部分を介して処理済み基板を汚染するこ
とがない。これにより、処理済み基板の汚染が防止され
る。同様に、濡れた基板と乾燥した基板とで、基板受け
渡し具の第1の基板載置部分と第2の基板載置部分とを
使い分けることにより、ウォータマークの発生を防止で
きる。
According to the present invention, the first substrate mounting portion and the second substrate mounting portion of the substrate transfer tool are used when the unprocessed substrate is taken out from the cassette and when the processed substrate is accommodated in the cleaned cassette. Use the table and the part. For example, in the case of taking out an unprocessed substrate from the cassette, the first substrate mounting portion is in the raised position, and the plurality of substrates are collectively held and lifted by the substrate mounting portion and delivered to the substrate transfer robot. Further, when the processed substrate is stored in the cleaned cassette, the second substrate mounting portion is in the raised position,
Receive a plurality of substrates at once from the substrate transfer robot.
In this case, since the processed substrate does not come into contact with the first substrate mounting portion, contaminants adhering to the unprocessed substrate may contaminate the processed substrate via the first substrate mounting portion. Absent. This prevents contamination of the processed substrate. Similarly, by using a wet substrate and a dry substrate for the first substrate mounting portion and the second substrate mounting portion of the substrate transfer tool, it is possible to prevent the generation of the watermark.

【0010】[0010]

【実施例】本発明の実施例を図面に基づいて説明する。
図11に示すように、この実施例に係る基板処理装置
は、カセット搬出入ステージ1と、カセット搬送ロボッ
ト2と、基板移載部3と、基板搬送ロボット4と、基板
処理部5と、基板乾燥部6と、カセット洗浄器7とを備
えている。この実施例で用いるカセット8は、内部に基
板整列収容溝を備え、複数の基板9を起立整列状態で収
容できるようになっている。
Embodiments of the present invention will be described with reference to the drawings.
As shown in FIG. 11, the substrate processing apparatus according to this embodiment includes a cassette loading / unloading stage 1, a cassette transfer robot 2, a substrate transfer unit 3, a substrate transfer robot 4, a substrate processing unit 5, and a substrate. A drying unit 6 and a cassette cleaning device 7 are provided. The cassette 8 used in this embodiment has a substrate alignment accommodating groove therein so that a plurality of substrates 9 can be accommodated in an upright alignment state.

【0011】この基板処理装置では、基板処理装置外か
ら未処理基板9を収容したカセット8がカセット搬出入
ステージ1の搬入位置10に搬入されると、このカセッ
ト8を二個、カセット搬送ロボット2で基板移載部3の
カセット載置テーブル11に搬送し、ここでカセット8
二個分の未処理基板9をカセット8内から基板搬送ロボ
ット4に移載する。
In this substrate processing apparatus, when the cassette 8 accommodating the unprocessed substrate 9 is carried from the outside of the substrate processing apparatus to the carry-in position 10 of the cassette carry-in / carry-out stage 1, two cassettes 8 and the cassette carrying robot 2 are provided. The substrate 8 is transferred to the cassette mounting table 11 of the substrate transfer unit 3, and the cassette 8
Two unprocessed substrates 9 are transferred from the cassette 8 to the substrate transfer robot 4.

【0012】次に、基板搬送ロボット4に移載された未
処理基板9を基板処理部5に搬送し、基板処理部5で処
理し、処理済み基板9を基板搬送ロボット4で基板乾燥
部6に搬送して乾燥させた後、基板搬送ロボット4で基
板移載部3に搬送する。一方、先に基板移載部3で未処
理基板9を取り出された空のカセット8はカセット搬送
ロボット4でカセット洗浄器7に搬送して洗浄する。そ
して、この洗浄済みカセット8をカセット搬送ロボット
2で基板移載部3のカセット載置テーブル11に搬送す
る。次に、基板移載部3で処理済み基板9を洗浄済みカ
セット8に移載し、このカセット8をカセット搬送ロボ
ット2でカセット搬出入ステージ1の搬出位置12に搬
送し、ここから基板処理装置外に搬出する。
Next, the unprocessed substrate 9 transferred to the substrate transfer robot 4 is transferred to the substrate processing unit 5, processed by the substrate processing unit 5, and the processed substrate 9 is transferred to the substrate drying unit 6 by the substrate transfer robot 4. After being transported to and dried, the substrate transport robot 4 transports the substrate to the substrate transfer unit 3. On the other hand, the empty cassette 8 from which the unprocessed substrate 9 has been taken out by the substrate transfer unit 3 is transferred to the cassette cleaning device 7 by the cassette transfer robot 4 and cleaned. Then, the cleaned cassette 8 is transferred to the cassette mounting table 11 of the substrate transfer section 3 by the cassette transfer robot 2. Next, the processed substrate 9 is transferred to the cleaned cassette 8 by the substrate transfer unit 3, and the cassette 8 is transferred to the carry-out position 12 of the cassette carry-in / carry-out stage 1 by the cassette carrying robot 2. Take it out.

【0013】このように、この基板処理装置では、カセ
ット搬送ロボット2により、カセット8をカセット搬出
入ステージ1とカセット載置テーブル11との間で搬送
するようにしてあるが、図2に示すように、カセット搬
出入ステージ1で搬出入姿勢をとるカセット8内では、
基板9の収容姿勢が基板処理部5での基板9の処理姿勢
に対して平面視で直交する方向になっている。また、カ
セット搬送ロボット2は、カセット載置テーブル11と
カセット搬出入ステージ1との間でカセット8を180
゜反転させて搬送する機構のものを用いている。
As described above, in this substrate processing apparatus, the cassette transfer robot 2 transfers the cassette 8 between the cassette loading / unloading stage 1 and the cassette mounting table 11, as shown in FIG. In the cassette 8 which is in the loading / unloading posture at the cassette loading / unloading stage 1,
The accommodation attitude of the substrate 9 is a direction orthogonal to the processing attitude of the substrate 9 in the substrate processing section 5 in a plan view. Further, the cassette transfer robot 2 moves the cassette 8 between the cassette mounting table 11 and the cassette loading / unloading stage 1 by 180.
Uses a mechanism that reverses and conveys.

【0014】このため、基板処理前に、カセット搬出入
ステージ1の搬入位置10で搬入姿勢をとるカセット8
をカセット搬送ロボット2でカセット載置テーブル11
に搬送すると、カセット載置テーブル11上のカセット
8内の未処理基板9の収容姿勢が処理姿勢に対して平面
視で直交する姿勢になり、このままの姿勢では基板9を
処理姿勢と平行な姿勢に保持して搬送を行う基板搬送ロ
ボット4に未処理基板9を受け渡すことができない。ま
た、基板処理後に、カセット搬送ロボット2でカセット
8をカセット載置テーブル11からカセット搬出入ステ
ージ1の搬出位置12に搬送する際、搬出位置12でカ
セット8が搬出姿勢となるようにするためには、カセッ
ト載置テーブル11上のカセット8を搬出姿勢に対して
180゜反転した姿勢にしておく必要があるが、このよ
うな姿勢でカセット載置テーブル11上に洗浄済みカセ
ット8を載置した場合には、洗浄済みカセット8の基板
収容方向が処理姿勢に対して平面視で直交する方向にな
るため、このままの姿勢では基板9を処理姿勢と平行な
姿勢に保持して搬送を行う基板搬送ロボット4から洗浄
済みカセット8に処理済み基板9を受け入れることがで
きない。
Therefore, before the substrate processing, the cassette 8 is set in the loading position 10 of the cassette loading / unloading stage 1.
The cassette loading table 11 by the cassette transfer robot 2.
When the substrate 9 is conveyed to, the storage posture of the unprocessed substrate 9 in the cassette 8 on the cassette mounting table 11 becomes a posture orthogonal to the processing posture in plan view, and in this posture, the substrate 9 is parallel to the processing posture. The unprocessed substrate 9 cannot be delivered to the substrate transfer robot 4 which is held and transferred. In addition, when the cassette 8 is transferred from the cassette mounting table 11 to the carry-out position 12 of the cassette carry-in stage 1 by the cassette carrying robot 2 after the substrate processing, the cassette 8 has a carry-out posture at the carry-out position 12. Requires the cassette 8 on the cassette mounting table 11 to be in a posture that is 180 ° inverted with respect to the carrying-out posture. In this posture, the cleaned cassette 8 is placed on the cassette mounting table 11. In this case, since the substrate accommodation direction of the cleaned cassette 8 is orthogonal to the processing posture in a plan view, the substrate 9 is conveyed while holding the substrate 9 in a posture parallel to the processing posture in this posture. The processed substrate 9 cannot be received from the robot 4 into the cleaned cassette 8.

【0015】このため、この基板処理装置では、基板移
載部3のカセット載置テーブル11にターンテーブル1
3を設けてある。基板移載部3の構成は次の通りであ
る。すなわち、図2に示すように、カセット載置テーブ
ル11の二箇所のカセット載置箇所に二個のターンテー
ブル13を設け、このターンテーブル13を後述する回
転駆動装置14に連動連結して、このターンテーブル1
3を90゜だけ回転させるようにしてある。図1に示す
ように、このターンテーブル13の中央部にはカセット
8の下開口部15に臨む受け渡し具挿通孔16をあけ、
この受け渡し具挿通孔16の下方に基板受け渡し具17
を起立状に設け、この基板受け渡し具17の上端部に複
数の基板9を起立整列状態で保持する基板載置部18を
設けている。この基板受け渡し具17は、昇降駆動手段
85(昇降駆動モータ)に連動した縦送りネジ軸19に
連動連結した昇降台20上に設け、基板受け渡し具17
の昇降により、基板載置部18で複数の基板9を起立整
列状態のまま保持して、カセット8内と基板搬送ロボッ
ト4との間で複数の基板9を一括して受け渡し可能に構
成してある。
Therefore, in this substrate processing apparatus, the turntable 1 is mounted on the cassette mounting table 11 of the substrate transfer unit 3.
3 is provided. The structure of the substrate transfer unit 3 is as follows. That is, as shown in FIG. 2, two turntables 13 are provided at two cassette mounting positions of the cassette mounting table 11, and the turntables 13 are interlockingly connected to a rotary drive device 14 which will be described later. Turntable 1
3 is rotated by 90 °. As shown in FIG. 1, a transfer tool insertion hole 16 facing the lower opening 15 of the cassette 8 is formed in the center of the turntable 13,
A board transfer tool 17 is provided below the transfer tool insertion hole 16.
Is provided in an upright shape, and a substrate placing portion 18 for holding a plurality of substrates 9 in an upright alignment state is provided at an upper end portion of the substrate transfer tool 17. The substrate transfer tool 17 is provided on the lift table 20 that is interlocked with the vertical feed screw shaft 19 that is interlocked with the lifting drive means 85 (elevation drive motor).
By raising and lowering, the plurality of substrates 9 are held in the upright aligned state on the substrate mounting portion 18, and the plurality of substrates 9 can be collectively transferred between the cassette 8 and the substrate transfer robot 4. is there.

【0016】この基板移載部3では、図2に示すよう
に、基板処理前に、カセット搬出入ステージ1の搬入位
置10からカセット搬送ロボット2でターンテーブル1
3に搬送されてきたカセット8の姿勢を、ターンテーブ
ル13のa方向の回転により90゜方向変換し、カセッ
ト8内の未処理基板9の収容姿勢を基板処理部5での基
板9の処理姿勢と平行として、図1に示す、基板受け渡
し具17の上昇により、基板載置部18に未処理基板9
を保持した状態で、カセット8上方に未処理基板9を取
り出し、基板受け渡し具17を回転させることなしに、
カセット8内の未処理基板9を基板搬送ロボット4に受
け渡す。
In the substrate transfer section 3, as shown in FIG. 2, the turntable 1 is moved by the cassette transfer robot 2 from the loading position 10 of the cassette loading / unloading stage 1 before the substrate processing.
The orientation of the cassette 8 transferred to the substrate 3 is changed by 90 ° by the rotation of the turntable 13 in the a direction, so that the accommodation orientation of the unprocessed substrate 9 in the cassette 8 is the orientation of processing the substrate 9 in the substrate processing unit 5. In parallel with the above, as the substrate transfer tool 17 shown in FIG.
In the state where the substrate is held, the unprocessed substrate 9 is taken out above the cassette 8 and the substrate transfer tool 17 is not rotated.
The unprocessed substrate 9 in the cassette 8 is transferred to the substrate transfer robot 4.

【0017】また、基板処理後には、図11に示すカセ
ット洗浄器7からカセット搬送ロボット2でターンテー
ブル13に搬送されてきた洗浄済みカセット8を、図2
の図示の姿勢からターンテーブル13のa方向の回転に
より90゜方向変換し、その基板収容方向を処理姿勢と
平行として、図1に示すように、洗浄済みカセット8の
下方に位置させた基板受け渡し具17の基板載置部18
を上昇させて、基板搬送ロボット4で搬送されてきた処
理済み基板9を保持させ、この状態で基板受け渡し具1
7を下降させて、基板受け渡し具17を回転させること
なしに、処理済み基板9を洗浄済みカセット8内に受け
渡す。そして、図2に示すように、処理済み基板9を収
容した洗浄済みカセット8を、ターンテーブル13のb
方向の回転により90゜方向変換して、図示の姿勢に
し、カセット搬送ロボット2でカセット搬出入ステージ
1の搬出位置12に搬送すると、このカセット8が搬出
位置12で搬出姿勢となる。
After the substrate processing, the cleaned cassette 8 transferred from the cassette cleaning device 7 shown in FIG. 11 to the turntable 13 by the cassette transfer robot 2 is shown in FIG.
The orientation shown in FIG. 1 is changed by 90 ° by rotating the turntable 13 in the direction a, and the substrate receiving direction is set below the cleaned cassette 8 as shown in FIG. Substrate placement section 18 of tool 17
And the processed substrate 9 transferred by the substrate transfer robot 4 is held, and in this state the substrate transfer tool 1
The processed substrate 9 is transferred into the cleaned cassette 8 without lowering the substrate transfer tool 17 by rotating the substrate transfer tool 17. Then, as shown in FIG. 2, the cleaned cassette 8 containing the processed substrate 9 is placed on the turntable 13 b.
When the cassette 8 is conveyed to the carry-out position 12 of the cassette carry-in / carry-out stage 1 by changing the direction by 90 ° by the rotation of the direction and brought to the illustrated posture, the cassette 8 becomes the carry-out posture at the carry-out position 12.

【0018】このように、この基板移載部3では、図1
に示すように、基板9をカセット8内と基板搬送ロボッ
ト4との間で受け渡すに当たり、基板受け渡し具17を
回転させる必要がないので、基板受け渡し具17の基板
載置部18に保持した基板9の姿勢がずれない。そのう
え、基板9を向け替えるに当たっては、基板9をカセッ
ト8に安定に収容保持したまま、ターンテーブル13を
回転させることにより行うので、基板9の姿勢のずれを
おそれることなくターンテーブル13の回転速度を高く
設定できる。
As described above, in the substrate transfer section 3, as shown in FIG.
As shown in FIG. 5, when transferring the substrate 9 between the cassette 8 and the substrate transfer robot 4, it is not necessary to rotate the substrate transfer tool 17, so that the substrate held by the substrate mounting part 18 of the substrate transfer tool 17 is not used. The posture of 9 does not shift. In addition, when the substrate 9 is redirected, the turntable 13 is rotated while the substrate 9 is stably accommodated and held in the cassette 8. Therefore, the rotation speed of the turntable 13 can be adjusted without fear of misalignment of the substrate 9. Can be set high.

【0019】この基板移載部3のターンテーブル13及
びその回転駆動装置14の具体的構成は次のとおりであ
る。図3(A)に示すように、ターンテーブル13はカ
セット載置テーブル11のベース板21にベアリング2
2を介して回転自在に取り付けてある。このターンテー
ブル13を回転させる回転駆動装置14には、回転駆動
モータを用い、この出力軸23に固定したピニオンギヤ
24をターンテーブル13に外嵌固定したリングギヤ2
5に噛み合わせ、図3(C)に示すように、回転角度を
90゜に設定して、ターンテーブル13を回転させるよ
うにしてある。
The specific structure of the turntable 13 of the substrate transfer section 3 and its rotation driving device 14 is as follows. As shown in FIG. 3 (A), the turntable 13 has a base plate 21 of the cassette mounting table 11 and a bearing 2
It is rotatably attached via 2. A rotary drive motor is used as a rotary drive device 14 for rotating the turntable 13, and a ring gear 2 in which a pinion gear 24 fixed to the output shaft 23 is externally fitted and fixed to the turntable 13.
5, the turntable 13 is rotated by setting the rotation angle to 90 ° as shown in FIG. 3 (C).

【0020】また、図3(B)に示すように、ターンテ
ーブル13上には、矩形の受け渡し具挿通孔16の周縁
の三方に沿ってカセット位置決め枠26を平面視でコの
状に形成するとともに、この周縁の残り一方にカセット
クランプ27を設け、ターンテーブル13上でカセット
8を適性位置に位置決め固定できるようにしてある。こ
の実施例では、回転駆動装置14に回転駆動モータを用
いているが、これに代えて、図3(D)・(E)に示す
ように、回転駆動装置14に回転駆動用エアシリンダを
用いてもよい。図3(D)のものでは、回転駆動用シリ
ンダのピストン28にラックギヤ29を取り付け、この
ラックギヤ29をターンテーブル13に外嵌固定したリ
ングギヤ25に噛み合わせてある。また図3(E)のも
のでは、回転駆動用エアシリンダのピストン28をター
ンテーブル13に外嵌固定したリング30に枢着してあ
る。
Further, as shown in FIG. 3B, a cassette positioning frame 26 is formed on the turntable 13 along the three sides of the periphery of the rectangular delivery tool insertion hole 16 in a U shape in plan view. At the same time, a cassette clamp 27 is provided on the other side of the peripheral edge so that the cassette 8 can be positioned and fixed on the turntable 13 at an appropriate position. In this embodiment, a rotary drive motor is used for the rotary drive device 14, but instead of this, as shown in FIGS. 3D and 3E, a rotary drive air cylinder is used for the rotary drive device 14. May be. In FIG. 3D, a rack gear 29 is attached to the piston 28 of the rotary drive cylinder, and the rack gear 29 is meshed with the ring gear 25 fitted and fixed to the turntable 13. In FIG. 3 (E), the piston 28 of the air cylinder for rotational drive is pivotally attached to the ring 30 fitted and fixed to the turntable 13.

【0021】上記基板受け渡し具17は、図4(A)に
示すように、パイプ支持台31に立設したパイプ32の
上端部に箱体33を取り付け、基板載置部18は上記箱
体33の上面に設けられている。この基板載置部18
は、それぞれ複数の基板を起立整列状態で保持する第1
の基板載置部分38と第2の基板載置部分39とから構
成されいてる。そして第1の基板載置部分38は二個の
昇降載置部38aにより、また、第2の基板載置部分3
9は三個の固定載置部39bにより構成されている。各
固定載置部39bは箱体33の上面の中央及び両側に固
設した各固定座34に取り付け、各昇降載置部38aは
上記固定座34同士の間に配置した二個の昇降座35に
取り付けてある。
As shown in FIG. 4 (A), the substrate transfer tool 17 has a box 33 attached to the upper end of a pipe 32 erected on a pipe support 31, and the substrate mounting portion 18 has the box 33. Is provided on the upper surface of. This substrate rest 18
Respectively hold a plurality of substrates in a standing alignment state.
The substrate mounting portion 38 and the second substrate mounting portion 39 are included. The first substrate mounting portion 38 is formed by the two elevating and lowering mounting portions 38a, and the second substrate mounting portion 3 is formed.
9 is composed of three fixed mounting portions 39b. Each of the fixed mounting portions 39b is attached to each of the fixed seats 34 fixed to the center and both sides of the upper surface of the box body 33, and each of the elevating mounting portions 38a is provided with the two elevating seats 35 arranged between the fixed seats 34. It is attached to.

【0022】この昇降座35は、パイプ32内を貫通さ
せた昇降杆36の上端部に固定し、昇降杆36はパイプ
支持台31に取り付けた昇降駆動装置37に連動連結し
てある。上記昇降駆動装置37として昇降用シリンダを
用いている。つまり、昇降載置部38aより成る第1の
基板載置部分38は、固定載置部39bより成る第2の
基板載置部分39の上方位置に突出する上昇位置と、第
2の基板載置部分39より低位置に沈む下降位置とに切
り替え可能に構成してある。例えば図1において、カセ
ット8内から基板搬送ロボット4に未処理基板9を受け
渡す場合には、第1の基板載置部分38を上昇位置と
し、基板搬送ロボット4から洗浄済みカセット8内に処
理済み基板9を受け渡す場合には、第1の基板載置部分
38を下降位置とする。
The elevating seat 35 is fixed to the upper end of an elevating rod 36 penetrating the pipe 32, and the elevating rod 36 is interlocked with an elevating drive device 37 attached to the pipe support 31. A lifting cylinder is used as the lifting drive device 37. That is, the first substrate mounting portion 38 including the elevating and lowering mounting portion 38a has a raised position protruding above the second substrate mounting portion 39 including the fixed mounting portion 39b, and the second substrate mounting portion 38a. It is configured such that it can be switched to a lower position where the portion 39 is lowered to a lower position. For example, in FIG. 1, when the unprocessed substrate 9 is transferred from the cassette 8 to the substrate transport robot 4, the first substrate mounting portion 38 is set to the raised position and the substrate transport robot 4 processes the cleaned cassette 8 into the cleaned cassette 8. When transferring the finished substrate 9, the first substrate mounting portion 38 is set to the lowered position.

【0023】上記構成によれば、未処理基板9の受け渡
しに際しては、未処理基板9が第1の基板載置部分38
に保持され、第2の基板載置部分39に触れないので、
第2の基板載置部分39が未処理基板9に付着している
汚染物質で汚染されることがない。そして、処理済み基
板9の受け渡しに際しては、汚染されていない第2の基
板載置部分39に処理済み基板9が保持されるので、処
理済み基板9の汚染が防止される。逆に、第1の基板載
置部分38を下降位置として第2の基板載置部分39で
未処理基板9を受け渡し、第1の基板載置部分38を上
昇位置として処理済み基板9を受け渡すことも可能であ
り、この場合にも同様に処理済み基板9の汚染を防止す
ることができる。
According to the above configuration, when the unprocessed substrate 9 is delivered, the unprocessed substrate 9 is placed on the first substrate mounting portion 38.
Since the second substrate mounting portion 39 is not touched,
The second substrate mounting portion 39 is not contaminated by the contaminants attached to the unprocessed substrate 9. When the processed substrate 9 is delivered, the processed substrate 9 is held on the second substrate mounting portion 39 which is not contaminated, so that the processed substrate 9 is prevented from being contaminated. Conversely, the unprocessed substrate 9 is transferred by the second substrate mounting portion 39 with the first substrate mounting portion 38 in the lowered position, and the processed substrate 9 is transferred by the first substrate mounting portion 38 in the raised position. It is also possible to prevent contamination of the processed substrate 9 in this case as well.

【0024】なお、第1の基板載置部分38及び第2の
基板載置部分39には、図4(B)に示すように、そこ
に載置する基板9の主面方向(図4における紙面に垂直
な方向)にカセット8が有する基板整列収容溝と同一ピ
ッチの基板整列保持溝90が設けられており、また、こ
の基板整列保持溝90の解放上側縁部92は、基板の保
持を円滑にするためハの字状の面取りがしてある。ま
た、二個の昇降載置部38aと三個の固定載置部39b
とは、図5に示すように、一体加工された通常の基板載
置部18を一点鎖線部分で切断することにより容易に製
作できる。
The first substrate mounting portion 38 and the second substrate mounting portion 39, as shown in FIG. 4B, are in the main surface direction of the substrate 9 mounted thereon (in FIG. 4). A substrate alignment holding groove 90 having the same pitch as the substrate alignment holding groove of the cassette 8 is provided in a direction (perpendicular to the paper surface), and the release upper edge 92 of the substrate alignment holding groove 90 holds the substrate. C-shaped chamfer is used for smoothness. In addition, two lifting and placing parts 38a and three fixed and placing parts 39b are provided.
As shown in FIG. 5, it can be easily manufactured by cutting the integrally processed ordinary substrate mounting portion 18 along the dashed line.

【0025】上記昇降載置部38aと固定載置部39b
には、図5で示すように、そこに保持する基板9の外周
に沿う形状の基板整列保持溝90が切設されており、こ
の基板整列保持溝90は、基板9のオリエンテーション
フラットに対応する直線部95とそれ以外の湾曲部96
とから成る。即ち、中央の固定載置部39bとその両側
の昇降載置部38a・38aとにかけて、基板9のオリ
エンテーションフラットに対応する直線部95が切設さ
れ、当該昇降載置部38aからその外側の固定載置部3
9bにかけて湾曲部96が切設されている。つまり、第
1の基板載置部分38を構成する昇降載置部38a・3
8aが直線部分95と湾曲部96とを有し、かつ、第2
の基板載置部分39を構成する固定載置部39bが直線
部分95と湾曲部96とを有することにより、第1の基
板載置部分38又は第2の基板載置部分39のいずれか
により基板9を保持した場合であっても、基板9の回転
を防止することができる。
The elevating and placing section 38a and the fixed placing section 39b.
As shown in FIG. 5, a substrate alignment holding groove 90 having a shape along the outer periphery of the substrate 9 held therein is cut, and the substrate alignment holding groove 90 corresponds to the orientation flat of the substrate 9. Straight portion 95 and curved portion 96 other than that
It consists of and. That is, a straight line portion 95 corresponding to the orientation flat of the substrate 9 is cut between the central fixed placing portion 39b and the elevating placing portions 38a, 38a on both sides thereof, and the outside of the elevating placing portion 38a is fixed. Placement part 3
A curved portion 96 is cut to 9b. That is, the elevating / lowering mounting portions 38 a, 3 which form the first substrate mounting portion 38.
8a has a straight line portion 95 and a curved portion 96, and
Since the fixed mounting portion 39b constituting the substrate mounting portion 39 of FIG. 1 has the straight portion 95 and the curved portion 96, the substrate is mounted by either the first substrate mounting portion 38 or the second substrate mounting portion 39. Even when 9 is held, the rotation of the substrate 9 can be prevented.

【0026】上記実施例では、第1の基板載置部分38
が昇降し、第2の基板載置部分39が固定されたものと
して説明したが、これに代えて図6で示すように、両者
を昇降可能に構成することもできる。即ち、第1の基板
載置部分38は、二つの昇降載置部38aを昇降ロッド
34aを介して第1の昇降ベース35aで支持し、また
第2の基板載置部分39は、同様に三つの昇降載置部3
9bを昇降ロッド34bを介して第2の昇降ベース35
bで支持し、それらの昇降ベース35a・35bを揺動
アーム36に連動連結し、駆動用アクチュエータ37に
より上記揺動アーム36をその揺動支軸Pで昇降揺動す
ることにより、両者を相対的に昇降切り換え可能に構成
してある。そして上昇位置にある一方の基板載置部分に
より基板を保持するように構成する。
In the above embodiment, the first substrate mounting portion 38
Although it was described that the second substrate mounting portion 39 was fixed by moving up and down, instead of this, as shown in FIG. 6, it is also possible to raise and lower both. That is, the first substrate mounting portion 38 supports the two elevating and lowering mounting portions 38a by the first elevating base 35a via the elevating rods 34a, and the second substrate mounting portion 39 similarly has three parts. Three lifting and placing parts 3
9b to the second lifting base 35 via the lifting rod 34b.
b, the elevating bases 35a and 35b are interlockingly connected to the swing arm 36, and the swing arm 36 is vertically swung by the swing support shaft P by the driving actuator 37, so that the two are relatively moved. It is configured to be vertically switchable. Then, the substrate is held by the one substrate mounting portion in the raised position.

【0027】ところで、図7に示すように、この基板受
け渡し具17は、二個のカセット8内と基板搬送ロボッ
ト4との間で基板9の受け渡しを行うため、二個設けら
れており、この二個の基板受け渡し具17は幅寄せ装置
42で幅寄せ可能にしてある。この幅寄せ装置42の構
成は次の通りである。図8(A)に示すように、両パイ
プ支持台31を昇降台20上のガイドレール43にスラ
イド自在に支持し、両パイプ支持台31を幅寄せリンク
機構44で連結してある。幅寄せリンク機構44は、図
8(A)に示すように、昇降台20の中央部から垂設し
た支軸82にリンクアーム83の中央部を枢着し、リン
クアーム83の両端部と両パイプ支持台31との間にリ
ンクロッド84を介設して構成してある。そして、図8
(B)に示すように、昇降台20に取り付けた幅寄せ駆
動用シリンダ45に一方のパイプ支持台31を連動連結
してある。
By the way, as shown in FIG. 7, two substrate transfer tools 17 are provided in order to transfer the substrate 9 between the two cassettes 8 and the substrate transfer robot 4. The two substrate transfer tools 17 can be width-shifted by the width-shifting device 42. The structure of the width aligning device 42 is as follows. As shown in FIG. 8 (A), both pipe support bases 31 are slidably supported by guide rails 43 on the lifting base 20, and both pipe support bases 31 are connected by a width-shifting link mechanism 44. As shown in FIG. 8A, the width-shifting link mechanism 44 pivotally attaches the center portion of the link arm 83 to a support shaft 82 that is vertically provided from the center portion of the lift table 20, and connects both end portions of the link arm 83 and both ends. A link rod 84 is provided between the pipe support 31 and the pipe support 31. And FIG.
As shown in (B), one pipe support base 31 is interlockingly connected to the width-shifting drive cylinder 45 attached to the lift base 20.

【0028】この幅寄せ装置42では、幅寄せ駆動用シ
リンダ45を縮小させると、これに連結した一方のパイ
プ支持台31が昇降台20の中央側に寄ると同時に、幅
寄せリンク機構44を介して他方のパイプ支持台31も
昇降台20の中央側に寄り、双方の基板受け渡し具17
が幅寄せされる。また、幅寄せ駆動用シリンダ45を伸
長させると、双方の基板受け渡し具17が相互に遠ざか
る。この幅寄せ装置42では、図7に示すように、基板
処理前に、二個のカセット8内から二群の未処理基板9
を基板搬送ロボット4に受け渡すに当たり、二個の基板
受け渡し具17の基板載置部18にそれぞれ各群の未処
理基板9を保持させ、双方の基板受け渡し具17を幅寄
せにより近づけ、二群の未処理基板9の間に大きな隙間
を作ることなく、これらを基板搬送ロボット4に受け渡
す。また、基板処理後に、カセット8二個分の処理済み
基板9を基板搬送ロボット4から二個の洗浄済みカセッ
ト8に受け渡すに当たり、基板搬送ロボット4で搬送さ
れてきた処理済み基板9を、カセット8の上方で幅寄せ
しておいた二個の基板受け渡し具17の両基板載置部1
8に保持させ、両基板受け渡し具17を遠ざけて、処理
済み基板9を二群に分離し、各群を二個の洗浄済みカセ
ット8に収容する。
In the width-shifting device 42, when the width-shifting drive cylinder 45 is contracted, one pipe support 31 connected to the width-shifting cylinder 45 approaches the center of the lift table 20 and at the same time, the width-shifting link mechanism 44 is used. And the other pipe support 31 is also closer to the center of the lift table 20, and both board transfer tools 17
Are width-shifted. Further, when the width-shifting drive cylinder 45 is extended, both substrate transfer tools 17 are moved away from each other. In this width-shifting device 42, as shown in FIG. 7, two groups of unprocessed substrates 9 from inside the two cassettes 8 are processed before substrate processing.
In transferring the substrate to the substrate transfer robot 4, the unprocessed substrates 9 of each group are respectively held by the substrate mounting portions 18 of the two substrate transfer tools 17, and both the substrate transfer tools 17 are moved closer to each other, and the two groups are transferred. These are delivered to the substrate transfer robot 4 without forming a large gap between the untreated substrates 9. In addition, after transferring the processed substrates 9 for two cassettes 8 from the substrate transfer robot 4 to the two cleaned cassettes 8 after the substrate processing, the processed substrates 9 transferred by the substrate transfer robot 4 are transferred to the cassettes. Both substrate mounting parts 1 of the two substrate transfer tools 17 that have been width-shifted above 8
8, the substrate transfer tools 17 are moved away from each other, the processed substrates 9 are separated into two groups, and each group is housed in the two cleaned cassettes 8.

【0029】次に、基板搬送ロボット4の構成を説明す
る。図1に示すように、この基板搬送ロボット4は、走
行部本体46と、この走行部本体46から略水平に突出
した左右一対のアーム回転軸47と、この一対のアーム
回転軸47を回転させる軸回転手段48と、各アーム回
転軸47に固定され、複数の基板9を起立整列状態で一
括保持する基板チャック49とを備えている。一対の基
板チャック49は、一対の対向面50同士と、その裏面
51同士とに、それぞれカセット8が有する基板整列収
容溝と同一ピッチの基板整列保持溝52・53を有し、
アーム回転軸47の回転により、基板チャック49をそ
の一対の対向面50同士及びその裏面51同士がそれぞ
れ対向する逆ハの字状の基板保持姿勢に切り替え可能に
構成してある。
Next, the structure of the substrate transfer robot 4 will be described. As shown in FIG. 1, the substrate transfer robot 4 rotates a traveling unit main body 46, a pair of left and right arm rotating shafts 47 protruding substantially horizontally from the traveling unit main body 46, and the pair of arm rotating shafts 47. It is provided with a shaft rotating means 48 and a substrate chuck 49 fixed to each arm rotating shaft 47 and collectively holding a plurality of substrates 9 in a standing aligned state. The pair of substrate chucks 49 has substrate alignment holding grooves 52 and 53, which have the same pitch as the substrate alignment accommodating grooves of the cassette 8, on the pair of opposing surfaces 50 and the rear surfaces 51 thereof.
By rotating the arm rotation shaft 47, the substrate chuck 49 can be switched to an inverted C-shaped substrate holding posture in which the pair of facing surfaces 50 and the back surfaces 51 thereof face each other.

【0030】この基板搬送ロボット4では、未処理基板
9を搬送する場合には、基板チャック49の一対の対向
面50同士が対向する姿勢にし、処理済み基板9を搬送
する場合には、裏面51同士が対向する姿勢にする。こ
のようにすると、未処理基板9の搬送に際しては、未処
理基板9が一対の対向面50同士の基板整列保持溝52
に保持され、未処理基板9が裏面51の基板整列保持溝
53に触れないので、裏面51の基板整列保持溝53が
未処理基板9に付着した汚染物質で汚染されることがな
い。そして、処理済み基板9の搬送に際しては、処理済
み基板9が汚染されていない裏面51の基板整列保持溝
53に保持されるので、処理済み基板9の汚染が防止さ
れる。
In this substrate transfer robot 4, when the unprocessed substrate 9 is transferred, the pair of opposed surfaces 50 of the substrate chuck 49 are placed in a posture in which they face each other, and when the processed substrate 9 is transferred, the back surface 51. Position them so that they face each other. With this configuration, when the unprocessed substrate 9 is conveyed, the unprocessed substrate 9 has the substrate alignment holding groove 52 of the pair of opposed surfaces 50.
The substrate alignment holding groove 53 on the back surface 51 is not contaminated by the contaminants adhering to the unprocessed substrate 9 because the substrate alignment holding groove 53 on the back surface 51 is held in the substrate alignment holding groove 53 on the back surface 51. Then, when the processed substrate 9 is transported, the processed substrate 9 is held in the substrate alignment holding groove 53 of the back surface 51 which is not contaminated, so that the processed substrate 9 is prevented from being contaminated.

【0031】基板チャック49の具体的構成は次の通り
である。図9(A)に示すように、基板チャック49
は、板状のチャック本体54の両端にエンドプレート5
5を備え、チャック本体54の中央部とエンドプレート
55の中央部とにアーム回転軸47を挿通して固定して
ある。エンドプレート55間には一対の補強パイプ59
を平行に架設し、これをチャック本体54内に挿通して
固定してある。図9(B)に示すように、チャック本体
54の基板整列保持溝52・53は、いずれも基板9の
周縁に沿う円弧状に形成してある。また、図9(C)に
示すように、この基板整列保持溝52・53の解放縁部
57はハの字状に面取りしてある。この基板チャック4
9は、図9(D)・(E)に示すように、基板整列保持
溝52・53を一連に周設した溝形成パイプ58を補強
パイプ59に外嵌して構成してもよい。この場合、補強
パイプ59にエンドプレート55をネジ止めすることに
より、両エンドプレート55間で溝形成パイプ58を挟
圧固定することができる。
The specific structure of the substrate chuck 49 is as follows. As shown in FIG. 9A, the substrate chuck 49
Is attached to both ends of the plate-shaped chuck body 54.
5, the arm rotation shaft 47 is inserted through and fixed to the central portion of the chuck body 54 and the central portion of the end plate 55. A pair of reinforcing pipes 59 is provided between the end plates 55.
Are installed in parallel, and are inserted and fixed in the chuck body 54. As shown in FIG. 9B, the substrate alignment holding grooves 52 and 53 of the chuck body 54 are both formed in an arc shape along the peripheral edge of the substrate 9. Further, as shown in FIG. 9C, the release edge portions 57 of the substrate alignment holding grooves 52 and 53 are chamfered in a V shape. This substrate chuck 4
As shown in FIGS. 9 (D) and 9 (E), 9 may be configured by externally fitting a groove forming pipe 58 in which substrate alignment holding grooves 52/53 are provided in series around a reinforcing pipe 59. In this case, by screwing the end plate 55 to the reinforcing pipe 59, the groove forming pipe 58 can be clamped and fixed between the end plates 55.

【0032】また、図10(A)に示すように、アーム
回転軸47を回転させる軸回転手段48には、一対の軸
回転用モータを用いている。この軸回転用モータは走行
部本体46に固定し、各出力軸60にアーム回転軸47
を軸継ぎ手61で連結し、両アーム回転軸47をそれぞ
れ個別に回転連動するようにしてある。また、走行部本
体46の走行駆動手段62には、走行駆動モータを用い
ている。この走行駆動モータは、固定機枠63に固定
し、その出力軸64に駆動プーリ65を取り付け、固定
機枠63に枢着した遊動プーリ(図外)と駆動プーリ6
5との間に連動ベルト66を巻き掛け、この連動ベルト
66に走行部本体46を取り付けてある。また、図10
(B)に示すように、走行部本体46は、固定機枠63
上に設けたガイドレール67上にスライド自在に取り付
けてある。
Further, as shown in FIG. 10A, a pair of shaft rotating motors are used as the shaft rotating means 48 for rotating the arm rotating shaft 47. This shaft rotation motor is fixed to the traveling unit main body 46, and the arm rotation shaft 47 is attached to each output shaft 60.
Are connected by a shaft joint 61, and both arm rotation shafts 47 are individually rotatably interlocked. A travel drive motor is used as the travel drive means 62 of the travel section main body 46. This traveling drive motor is fixed to a fixed machine frame 63, a drive pulley 65 is attached to its output shaft 64, and an idle pulley (not shown) pivotally attached to the fixed machine frame 63 and the drive pulley 6 are attached.
The interlocking belt 66 is wound around the interlocking belt 5, and the traveling portion main body 46 is attached to the interlocking belt 66. In addition, FIG.
As shown in (B), the traveling unit main body 46 includes the stationary machine frame 63.
It is slidably mounted on a guide rail 67 provided above.

【0033】この基板搬送ロボット4は、図10(C)
に示すように、軸回転手段48に一個の軸回転用モータ
を用い、その出力軸60に取り付けた駆動ギヤ68に反
転ギヤ69を噛み合わせ、一方のアーム回転軸47に取
り付けた入力ギヤ70を駆動ギヤ68に、他方のアーム
回転軸47に取り付けた入力ギヤ71を反転ギヤ69に
それぞれ噛み合わせる構成としてもよい。また、図10
(D)に示すように、走行駆動手段62である走行駆動
モータを走行部本体46に取り付け、その出力軸64に
取り付けたピニオンギヤ72を固定機枠63に取り付け
たラックギヤ73に噛み合わせ、走行部本体46を自走
式にしてもよい。
This substrate transfer robot 4 is shown in FIG.
As shown in FIG. 7, one shaft rotation motor is used as the shaft rotation means 48, the reversing gear 69 is meshed with the drive gear 68 attached to the output shaft 60 thereof, and the input gear 70 attached to the one arm rotation shaft 47 is attached. The drive gear 68 and the input gear 71 attached to the other arm rotation shaft 47 may be in mesh with the reversing gear 69. In addition, FIG.
As shown in (D), a traveling drive motor, which is the traveling drive means 62, is attached to the traveling portion main body 46, and the pinion gear 72 attached to the output shaft 64 of the traveling portion is engaged with the rack gear 73 attached to the stationary machine frame 63. The body 46 may be self-propelled.

【0034】基板処理部5の構成は次の通りである。図
1に示すように、基板処理部5は、三個の処理槽74を
備え、この処理槽74にはそれぞれ基板9を支持する処
理基板載置部75を設けてある。この処理基板載置部7
5は図2または図11に示す昇降駆動手段76に連動連
結して、昇降可能としてある。すなわち、図1に示すよ
うに、前記基板移載部3の基板載置部18に保持した基
板9を基板搬送ロボット4に受け渡す位置を第一の基板
受け渡し位置77とし、各処理槽74の処理基板載置部
75に保持した基板9を基板搬送ロボット4に受け渡す
位置を第二の基板受け渡し位置78(図1においては、
中央の処理槽74について図示している)とすると、処
理基板載置部75の昇降により、ここに保持した基板9
を、第二の基板受け渡し位置78と、処理槽74内に浸
漬してその処理を行う基板処理位置79との間で昇降で
きるようにしてある。そして、前記基板搬送ロボット4
は、第一の基板受け渡し位置77と第二の基板受け渡し
位置78との間で走行させるようにしてある。
The structure of the substrate processing section 5 is as follows. As shown in FIG. 1, the substrate processing unit 5 includes three processing baths 74, and the processing baths 74 are provided with processing substrate mounting portions 75 that support the substrates 9, respectively. This processing substrate placing section 7
Reference numeral 5 is interlockingly connected to the elevating and lowering drive means 76 shown in FIG. That is, as shown in FIG. 1, the position at which the substrate 9 held on the substrate placing part 18 of the substrate transferring part 3 is delivered to the substrate transfer robot 4 is the first substrate delivering position 77, and each of the processing tanks 74 A second substrate transfer position 78 (in FIG. 1, a position at which the substrate 9 held by the processing substrate platform 75 is transferred to the substrate transfer robot 4 is
The central processing tank 74 is shown in the drawing), and the substrate 9 held here is lifted up and down by the processing substrate mounting portion 75.
Can be moved up and down between a second substrate transfer position 78 and a substrate processing position 79 where the substrate is immersed in the processing bath 74 to perform the processing. Then, the substrate transfer robot 4
Runs between the first substrate transfer position 77 and the second substrate transfer position 78.

【0035】この基板処理部5を備えた基板処理装置で
は、基板処理前に、基板移載部3でカセット8内の未処
理基板9を基板搬送ロボット4に受け渡すに当たり、基
板移載部3の基板載置部18に未処理基板9を保持し、
これを第一の基板受け渡し位置77に上昇させて、基板
搬送ロボット4に受け渡す。そして、この未処理基板9
を基板搬送ロボット4で第二の基板受け渡し位置78ま
で搬送し、上昇してきた処理基板載置部75に未処理基
板9を受け渡し、処理基板載置部75を下降させて、未
処理基板9を処理槽74の基板処理位置79に位置さ
せ、処理液80に浸漬して処理を行う。そして、処理槽
74での基板処理が終了すると、処理基板載置部75を
上昇させて、処理済み基板9を第二の基板受け渡し位置
78に位置させて、基板搬送ロボット4に受け渡す。そ
して、この処理済み基板9を基板搬送ロボット4で第一
の基板受け渡し位置77まで搬送し、上昇してきた基板
移載部3の基板載置部18に保持させ、基板移載部3の
基板載置部18を下降させて、処理済み基板9を基板収
容位置81に位置させ、洗浄済みカセット8内に収容す
る。
In the substrate processing apparatus having the substrate processing section 5, the substrate transfer section 3 transfers the unprocessed substrate 9 in the cassette 8 to the substrate transfer robot 4 before the substrate processing. Holding the unprocessed substrate 9 on the substrate rest 18 of
This is raised to the first substrate transfer position 77 and transferred to the substrate transfer robot 4. And this untreated substrate 9
The substrate transfer robot 4 transfers the unprocessed substrate 9 to the second substrate transfer position 78, transfers the unprocessed substrate 9 to the ascended processed substrate placement part 75, and lowers the processed substrate placement part 75 to remove the unprocessed substrate 9. It is located at the substrate processing position 79 of the processing bath 74 and is immersed in the processing liquid 80 for processing. Then, when the substrate processing in the processing bath 74 is completed, the processed substrate placing portion 75 is raised to position the processed substrate 9 at the second substrate transfer position 78 and transfers it to the substrate transfer robot 4. Then, the processed substrate 9 is transferred to the first substrate transfer position 77 by the substrate transfer robot 4 and held by the substrate mounting unit 18 of the substrate transfer unit 3 that has moved up, and the substrate transfer unit 3 transfers the substrate. The placement unit 18 is lowered to position the processed substrate 9 at the substrate accommodation position 81 and accommodate it in the cleaned cassette 8.

【0036】このように、未処理基板9を基板処理部5
の処理基板載置部75に保持して昇降させることによ
り、基板9を保持する基板搬送ロボット4の基板チャッ
ク49を処理槽74の処理液80に浸漬する必要がなく
なり、基板チャック49に付着した汚染物質が処理槽7
4内に持ち込まれることがない。そのうえ、基板チャッ
ク49を処理槽74に侵入させる必要がないため、基板
チャック49の寸法を短くでき、基板搬送中に基板チャ
ック49が振動しにくくなり、基板9と基板チャック4
9の基板整列保持溝52・53との摺動によるパーティ
クルの発生が軽減され、処理槽74へのパーティクルの
侵入が軽減される。なお、本発明に係る基板処理装置
は、酸化拡散工程前の前処理装置として適用することも
可能であり、この場合には、基板の汚染は問題とならな
いので、未処理基板と処理済み基板とで基板載置部18
を使い分けなくてもよい。むしろ、乾いた基板を保持す
る場合と濡れた基板を保持する場合とで、第1の基板載
置部分38と第2の基板載置部分39とを使い分けるこ
とにより、ウォータマークの発生を防止するようにすれ
ばよい。
In this way, the unprocessed substrate 9 is transferred to the substrate processing unit 5
The substrate chuck 49 of the substrate transfer robot 4 holding the substrate 9 does not need to be immersed in the treatment liquid 80 in the treatment tank 74 by holding the substrate on the treatment substrate placing part 75 and raising and lowering it. Pollutant is treated tank 7
Not brought into 4 In addition, the substrate chuck 49 does not need to enter the processing bath 74, so that the size of the substrate chuck 49 can be shortened and the substrate chuck 49 is less likely to vibrate during the transfer of the substrate.
Generation of particles due to sliding with the substrate alignment holding grooves 52 and 53 of 9 is reduced, and invasion of particles into the processing bath 74 is reduced. The substrate processing apparatus according to the present invention can also be applied as a pretreatment apparatus before the oxidation diffusion step. In this case, since the contamination of the substrate does not pose a problem, it is possible to treat the untreated substrate and the treated substrate. At the substrate rest part 18
Does not have to be used properly. Rather, by using the first substrate mounting portion 38 and the second substrate mounting portion 39 properly depending on whether to hold a dry substrate or a wet substrate, it is possible to prevent the occurrence of watermarks. You can do it like this.

【0037】上述した実施例においては、基板受け渡し
具17から受け取った複数の基板9を、基板搬送ロボッ
ト4により基板処理部5に搬送する基板処理装置につい
て述べたが、本発明は、基板受け渡し具17から受け取
った複数の基板9を、基板搬送ロボット4により処理専
用カセットに移し替え、この処理専用カセットをカセッ
ト搬送ロボットにより基板処理部に搬送する基板処理装
置にも同様に適用できる。
In the above-described embodiment, the substrate processing apparatus for transferring the plurality of substrates 9 received from the substrate transfer tool 17 to the substrate processing section 5 by the substrate transfer robot 4 has been described. However, the present invention is not limited to this. The plurality of substrates 9 received from 17 are transferred to the processing-specific cassette by the substrate transfer robot 4, and the substrate processing apparatus that transfers the processing-specific cassette to the substrate processing unit by the cassette transfer robot can be similarly applied.

【0038】[0038]

【発明の効果】未処理基板の受け渡しと処理済み基板の
受け渡しとで、昇降載置部の姿勢を変えることにより、
未処理基板に付着した汚染物質が基板受け渡し具の基板
載置部を介して処理済み基板に転移することによる処理
済み基板の汚染を防止できる。あるいは、濡れた基板と
乾燥した基板とで、基板受け渡し具の第1の基板載置部
分と第2の基板載置部分とを使い分ることにより、ウォ
ータマークによる弊害を有効に防止することができる。
これにより製品の歩留まりを高めることができる。
EFFECT OF THE INVENTION By changing the posture of the elevating and lowering part between the transfer of the unprocessed substrate and the transfer of the processed substrate,
It is possible to prevent contamination of the processed substrate due to transfer of contaminants adhering to the unprocessed substrate to the processed substrate via the substrate placing portion of the substrate transfer tool. Alternatively, it is possible to effectively prevent the harmful effects of the watermark by using the first substrate mounting portion and the second substrate mounting portion of the substrate transfer tool for the wet substrate and the dried substrate. it can.
As a result, the yield of products can be increased.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例に係る基板処理装置の縦断正面
図である。
FIG. 1 is a vertical sectional front view of a substrate processing apparatus according to an embodiment of the present invention.

【図2】図1の基板処理装置の平面図である。FIG. 2 is a plan view of the substrate processing apparatus of FIG.

【図3】図1の基板処理装置で用いるターンテーブルの
説明図で、同図(A)は縦断面図、同図(B)は平面
図、同図(C)は同図(A)のC−C線断面図、同図
(D)はターンテーブルの回転駆動機構の第1変更例の
同図(C)相当図、同図(E)はターンテーブルの回転
駆動機構の第2変更例の同図(C)相当図である。
3A and 3B are explanatory views of a turntable used in the substrate processing apparatus of FIG. 1, where FIG. 3A is a vertical sectional view, FIG. 3B is a plan view, and FIG. C-C line sectional drawing, the same figure (D) the same figure (C) equivalent figure of the 1st modification of the rotary drive mechanism of the turntable, the same figure (E) the 2nd modification of the rotary drive mechanism of the turntable. It is a figure equivalent to the same figure (C).

【図4】図1の基板処理装置で用いる基板受け渡し具を
説明する図で、同図(A)は縦断面図、同図(B)は基
板載置部の一部断面図である。
4A and 4B are views for explaining a substrate transfer tool used in the substrate processing apparatus of FIG. 1, where FIG. 4A is a vertical sectional view and FIG. 4B is a partial sectional view of a substrate mounting portion.

【図5】基板受け渡し具の基板載置部の要部縦断面図で
ある。
FIG. 5 is a longitudinal sectional view of an essential part of a substrate placing portion of the substrate transfer tool.

【図6】基板受け渡し具の基板載置部の変形例を示す要
部縦断面図である。
FIG. 6 is a longitudinal cross-sectional view of essential parts showing a modified example of the substrate platform of the substrate transfer tool.

【図7】図1のV−V線断面図である。7 is a cross-sectional view taken along line VV of FIG.

【図8】図1の基板処理装置で用いる幅寄せリンク機構
の説明図で、同図(A)は縦断面図、同図(B)は平面
図である。
8A and 8B are explanatory views of a width-shifting link mechanism used in the substrate processing apparatus of FIG. 1, in which FIG. 8A is a vertical sectional view and FIG. 8B is a plan view.

【図9】図1の基板処理装置で用いる基板搬送ロボット
の基板チャックを説明する図で、同図(A)は斜視図、
同図(B)は同図(A)のB−B線断面図、同図(C)
は同図(B)のC−C線断面図、同図(D)は基板チャ
ックの変更例の縦断面図、同図(E)は同図(D)のE
−E線断面図である。
9 is a diagram for explaining a substrate chuck of a substrate transfer robot used in the substrate processing apparatus of FIG. 1, FIG.
FIG. 3B is a sectional view taken along line BB of FIG.
Is a cross-sectional view taken along the line CC of FIG. 6B, FIG. 6D is a vertical cross-sectional view of a modified substrate chuck, and FIG.
It is a -E line sectional view.

【図10】図1の基板処理装置で用いる基板搬送ロボッ
トの基板チャック回転機構と走行部本体の走行機構を説
明する図で、同図(A)は斜視図、同図(B)は同図
(A)の側面図、同図(C)は変更例の斜視図、同図
(D)は同図(C)の側面図である。
10A and 10B are views for explaining a substrate chuck rotation mechanism and a traveling mechanism of a traveling unit main body of a substrate transfer robot used in the substrate processing apparatus of FIG. 1, in which FIG. 10A is a perspective view and FIG. (A) is a side view, (C) is a perspective view of a modification, and (D) is a side view of (C).

【図11】図1の基板処理装置の斜視図である。11 is a perspective view of the substrate processing apparatus of FIG.

【図12】従来技術に係る基板処理装置の図1相当図で
ある。
FIG. 12 is a diagram corresponding to FIG. 1 of a substrate processing apparatus according to a conventional technique.

【図13】図12の基板処理装置の平面図である。13 is a plan view of the substrate processing apparatus of FIG.

【符号の説明】[Explanation of symbols]

4…基板搬送ロボット、 5…基板処理部、8
…カセット、 9…基板、11…カセ
ット載置テーブル、 15…下開口部、16…受け渡
し具挿通孔、 17…基板受け渡し具、18…基
板載置部、 37…昇降駆動装置、38…
第1の基板載置部分、 39…第2の基板載置部
分。
4 ... Substrate transfer robot, 5 ... Substrate processing unit, 8
... cassette, 9 ... substrate, 11 ... cassette mounting table, 15 ... lower opening, 16 ... transfer tool insertion hole, 17 ... substrate transfer tool, 18 ... substrate mount, 37 ... lifting drive device, 38 ...
1st board | substrate mounting part, 39 ... 2nd board | substrate mounting part.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 複数の基板を起立整列状態で収容するカ
セットを載置するカセット載置テーブルと、基板受け渡
し具と、基板処理部と、基板搬送ロボットとを備え、上
記カセット載置テーブルに上記カセットの下開口部に臨
む受け渡し具挿通孔をあけ、この受け渡し具挿通孔の下
方に上記基板受け渡し具を起立状に設け、この基板受け
渡し具の上端部に複数の基板を起立整列状態で保持する
基板載置部を設け、この基板受け渡し具とカセット載置
テーブルとを相対的に昇降させて、上記基板受け渡し具
の基板載置部で複数の基板を起立整列状態のまま保持し
て、上記カセット内と上記基板搬送ロボットとの間で複
数の基板を一括して受け渡し可能に構成した基板処理装
置において、 上記基板受け渡し具の基板載置部は、それぞれ基板を起
立整列状態で保持する第1の基板載置部分と第2の基板
載置部分とから成り、 上記第1の基板載置部分と第2の基板載置部分とを駆動
装置により相対的に昇降切り換え可能に構成し、上昇位
置にある一方の基板載置部分により基板を保持するよう
に構成したことを特徴とする基板処理装置における基板
受け渡し装置。
1. A cassette mounting table for mounting a cassette for accommodating a plurality of substrates in an upright alignment state, a substrate transfer tool, a substrate processing section, and a substrate transfer robot. A transfer tool insertion hole facing the lower opening of the cassette is opened, and the substrate transfer tool is provided upright below the transfer tool insertion hole, and a plurality of substrates are held in an upright aligned state at the upper end of the substrate transfer tool. A substrate placing section is provided, and the substrate delivering tool and the cassette placing table are moved up and down relatively, and the substrate placing section of the substrate delivering tool holds a plurality of substrates in an upright alignment state, and the cassette In a substrate processing apparatus configured to collectively transfer a plurality of substrates between the inside of the substrate transfer robot and the substrate transfer robot, the substrate placing unit of the substrate transfer tool raises and lowers each substrate. It is composed of a first substrate placing portion and a second substrate placing portion that are held in a state, and the first substrate placing portion and the second substrate placing portion can be relatively switched up and down by a driving device. And a substrate transfer device in a substrate processing apparatus, characterized in that the substrate is held by one of the substrate mounting portions in the raised position.
JP5180743A 1992-09-25 1993-06-25 Substrate delivery device in substrate processing equipment Expired - Lifetime JP2824951B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5180743A JP2824951B2 (en) 1992-09-25 1993-06-25 Substrate delivery device in substrate processing equipment

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7296992 1992-09-25
JP4-72969 1992-09-25
JP5180743A JP2824951B2 (en) 1992-09-25 1993-06-25 Substrate delivery device in substrate processing equipment

Publications (2)

Publication Number Publication Date
JPH06163670A true JPH06163670A (en) 1994-06-10
JP2824951B2 JP2824951B2 (en) 1998-11-18

Family

ID=26414105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5180743A Expired - Lifetime JP2824951B2 (en) 1992-09-25 1993-06-25 Substrate delivery device in substrate processing equipment

Country Status (1)

Country Link
JP (1) JP2824951B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6368040B1 (en) 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
KR100648208B1 (en) * 1999-11-10 2006-11-24 비오이 하이디스 테크놀로지 주식회사 LCD glass loader/unloader for developer
JP2011238945A (en) * 2007-03-09 2011-11-24 Dainippon Screen Mfg Co Ltd Substrate processing apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130238U (en) * 1984-01-19 1985-08-31 東京エレクトロン相模株式会社 Fine movement and rotation device for wafer transfer
JPS61166037A (en) * 1984-05-30 1986-07-26 レスタ−・ア−ル・ジヨンソン Semiconductor wafer transfer apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130238U (en) * 1984-01-19 1985-08-31 東京エレクトロン相模株式会社 Fine movement and rotation device for wafer transfer
JPS61166037A (en) * 1984-05-30 1986-07-26 レスタ−・ア−ル・ジヨンソン Semiconductor wafer transfer apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6368040B1 (en) 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
US6755603B2 (en) 1998-02-18 2004-06-29 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
DE19906805B4 (en) * 1998-02-18 2005-07-07 Tokyo Electron Ltd. Apparatus and method for transporting substrates to be processed
KR100648208B1 (en) * 1999-11-10 2006-11-24 비오이 하이디스 테크놀로지 주식회사 LCD glass loader/unloader for developer
JP2011238945A (en) * 2007-03-09 2011-11-24 Dainippon Screen Mfg Co Ltd Substrate processing apparatus

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