JP2000042885A - Wafer chamfering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve throughput by efficiently performing supply and recovery of wafers. SOLUTION: A slide block 104 traveling along a horizontal guide 102 is provided with a supply transfer arm 106 and a recovery transfer arm 108. A supply pad 112 is provided at the tip upper part of the supply transfer arm 106, and a recovery pad 120 is provided at the tip lower part of the recovery transfer arm 108. A wafer W finished with machining and held to a chucking table 60A is recovered by the recovery pad 120, and a wafer W held by the supply pad 112 is delivered to a centering unit 86. Supply and recovery of the wafers W to and from a machining part 18A can therefore be performed at the same time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer chamfering apparatus, and more particularly to a wafer chamfering apparatus for chamfering a peripheral edge of a wafer such as silicon used as a material of a semiconductor device.

[0002]

2. Description of the Related Art A wafer such as silicon, which is used as a material for a semiconductor device, is thinly sliced from a state of an ingot by a cutting machine such as a slicing machine, and then a peripheral edge is chamfered by a wafer chamfering device to prevent cracking and chipping. Is done. In this wafer chamfering apparatus, a rotating grindstone is pressed against the periphery of a wafer held and rotated on a chuck table, thereby grinding the periphery of the wafer with a grindstone to perform chamfering.

By the way, in order to chamfer a wafer accurately with this wafer chamfering apparatus, it is necessary to place and hold the wafer on the same axis as a chuck table. For this reason, the wafer chamfering device is provided with a positioning device, and after positioning the wafer at a predetermined position with the positioning device, the wafer is placed and held on the chuck table.

As described above, in the conventional wafer chamfering apparatus, first, the wafer is supplied to the positioning device, the wafer is positioned at a predetermined position by the positioning device, and then the wafer is placed on the chuck table. In a conventional wafer chamfering apparatus, a supply / transport apparatus for transporting and supplying a wafer to the positioning apparatus, and a recovery / transfer apparatus for recovering the processed wafer from the chuck table and transporting the processed wafer to the next step (cleaning step, etc.). However, each was provided separately.

[0005]

However, in such a wafer chamfering apparatus in which the supply transfer device and the recovery transfer device are separately provided, the operation of one device depends on the operation of the other device. However, there is a disadvantage that the supply and recovery of the wafer cannot be performed efficiently. In other words, while the supply / transport device is supplying the wafer to the positioning device, the collection / transport device cannot collect the processed wafer, and during that time, the recovery / transport device generates play time, and the wafer is efficiently evacuated. There is a drawback that the supply and recovery of waste cannot be performed.

Further, in a wafer chamfering apparatus in which a supply / transport device and a recovery / transport device are separately provided, a wafer supply section and a recovery section are inevitably configured separately, so that the apparatus becomes large and manufacturing cost increases. Also had the drawback of becoming expensive. Further, in a wafer chamfering apparatus in which a wafer supply section and a recovery section are separated from each other, there is a drawback in that two cassette carriers for the supply section and the recovery section are required for use in physical distribution.

[0007] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a wafer chamfering apparatus capable of efficiently supplying and recovering wafers and improving throughput.

[0008]

According to a first aspect of the present invention, in order to achieve the above object, a pre-alignment unit for pre-aligning a wafer to be chamfered and a peripheral edge of the wafer held on a chuck table are ground with a grindstone. A processing part to be chamfered and disposed above the processing part;
A positioning unit for positioning the wafer to be chamfered and mounted on the chuck table; a cleaning unit for cleaning the chamfered wafer; and a transport unit for transporting the wafer by moving between the respective units. In the wafer chamfering apparatus, the transfer unit includes a traveling body that travels along a transportation path, an arm provided on the traveling body, a supply pad provided at an upper end of the arm, and a lower part of the arm. A collection pad provided, and a pad elevating means for vertically moving the supply pad and the collection pad, and holding the wafer pre-aligned by the pre-alignment unit with the supply pad, and then setting the supply pad to The wafer is moved below the positioning unit, and the supply pad is raised to supply the wafer to be chamfered to the positioning unit. The collection pad is lowered to recover the wafer chamfering is completed from the chuck table, the recovered pad is moved toward the cleaning unit, characterized in that for conveying the wafer to the cleaning unit.

According to the present invention, first, the wafer pre-aligned by the pre-alignment unit is held by the suction pad. Next, the supply pad is moved below the positioning unit by moving the traveling body toward the processing unit. next,
The supply pad is raised to supply the wafer to be chamfered to the positioning unit. On the other hand, the recovery pad is lowered to recover the wafer having been chamfered from the chuck table. After the collection, the traveling body is caused to travel toward the cleaning unit, and the chamfered wafer is transported to the cleaning unit. As described above, since the supply and the recovery of the wafer to be chamfered can be performed at a time, the supply and the recovery of the wafer can be efficiently performed, and the throughput is improved.

According to a third aspect of the present invention, there is provided a pre-alignment unit for pre-aligning a wafer to be chamfered, and chamfering by grinding a peripheral edge of the wafer held on a chuck table with a grindstone. A processing unit to be disposed, a positioning unit disposed above the processing unit and positioning the wafer to be chamfered and mounted on the chuck table; a cleaning unit to clean the chamfered wafer; Transporting means for transporting the wafer by moving the wafer, wherein the transporting means comprises a traveling body traveling along a transport path, a supply arm provided on the traveling body, and the supply arm A supply pad provided at an upper portion of a tip, supply pad elevating means for moving the supply pad up and down, and a collection arm provided on the traveling body. A collection pad provided below the tip of the collection arm and arranged below the supply pad; and a collection pad elevating means for moving the collection pad up and down. After the held wafer is held by the supply pad, the supply pad is moved below the positioning portion, and the supply pad is raised to supply the wafer to be chamfered to the positioning portion, while the recovery pad is lowered. The chamfered wafer is collected from the chuck table, and the collection pad is moved toward the cleaning unit to transfer the wafer to the cleaning unit.

According to the present invention, first, the wafer pre-aligned by the pre-alignment unit is held by the suction pad. Next, the supply pad is moved below the positioning unit by moving the traveling body toward the processing unit. next,
The supply pad is raised to supply the wafer to be chamfered to the positioning unit. On the other hand, the recovery pad is lowered to recover the wafer having been chamfered from the chuck table. After the collection, the traveling body is caused to travel toward the cleaning unit, and the chamfered wafer is transported to the cleaning unit. As described above, since the supply and the recovery of the wafer to be chamfered can be performed at a time, the supply and the recovery of the wafer can be efficiently performed, and the throughput is improved.

According to a fifth aspect of the present invention, in order to achieve the above object, a pre-alignment section for pre-aligning a wafer to be chamfered, and a peripheral edge of the wafer held on a chuck table ground by a grindstone. A processing unit to be disposed, a positioning unit disposed above the processing unit and positioning the wafer to be chamfered and mounted on the chuck table; a cleaning unit to clean the chamfered wafer; Transfer means for transferring the wafer by moving the, the wafer chamfering apparatus, the transfer means, a supply traveling body traveling along a supply transport path, a supply arm provided in the supply traveling body,
A supply pad provided at an upper end of the supply arm,
Supply pad elevating means for moving the supply pad up and down,
A collection traveling body that travels along the collection conveyance path, a collection arm provided on the collection traveling body, and a collection pad provided at a lower end of the collection arm and disposed at a position below the supply pad, And a collection pad elevating means for moving the collection pad up and down. After the wafer pre-aligned by the pre-alignment unit is held by the supply pad, the supply pad is moved below the positioning unit to supply the wafer. While raising the pad and supplying the wafer to be chamfered to the positioning portion,
The supply pad is moved above the chuck table, the recovery pad is lowered to collect the chamfered wafer from the chuck table, and the recovery pad is moved toward the cleaning unit to move the wafer. It is transported to the washing section.

According to the present invention, first, the wafer pre-aligned by the pre-alignment unit is held by the suction pad. Next, the supply traveling body is moved toward the processing unit to move the supply pad below the positioning unit, and the collection traveling body is moved toward the processing unit to move the collection pad above the chuck table. Next, the supply pad is raised to supply the wafer to be chamfered to the positioning unit. On the other hand, the recovery pad is lowered to recover the wafer having been chamfered from the chuck table. After the collection, only the collection traveling body is caused to travel toward the cleaning unit, and the chamfered wafer is transferred to the cleaning unit. As described above, since the supply and the recovery of the wafer to be chamfered can be performed at a time, the supply and the recovery of the wafer can be efficiently performed, and the throughput is improved.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a wafer chamfering apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing the overall configuration of a wafer chamfering apparatus according to the present invention. As shown in FIG. 1, a wafer chamfering apparatus 10 according to the present invention includes a supply unit 14 for supplying a wafer W to be chamfered, a pre-alignment unit 16 for performing pre-measurement and pre-alignment of the wafer W to be chamfered, Two processing parts 18A and 18B for chamfering W, and the two processing parts 18A and 18B
A positioning unit 20 for positioning the wafer W to be supplied to the 8B, a cleaning unit 22 for cleaning the chamfered wafer W, and a wafer W pre-aligned by the pre-alignment unit 16 to the positioning unit 20; A wafer transfer unit 24 that transfers the wafer W chamfered by the processing units 18A and 18B to the cleaning unit 22; and a post-measurement unit 26 that performs post-measurement of the chamfered wafer W.
And a collection unit 28 that collects the wafer W.

First, the configuration of the supply unit 14 will be described. As shown in FIG. 1, the supply unit 14 includes the supply cassette 3
And a supply cassette 3 positioned at a predetermined wafer supply position by the supply cassette positioning device 32.
The wafer W is taken out from the pre-alignment unit 16
And a wafer supply robot 34 that supplies the wafers to the wafer.

The supply cassette positioning device 32 has six supply cassette tables 33, 33,... The six supply cassette tables 33, 33,... Are arranged in series on the left side of the apparatus main body 12. The supply cassettes 30, 30,...
.. Are set at predetermined positions.

On the other hand, the wafer supply robot 34 has an arm 36 provided with a pair of suction pads at the lower end of the tip. The arm 36 moves back and forth along a guide 40 laid on the turntable 38, and turns as the turntable 38 rotates. Also, the slide movement of the turntable 38 causes the slide movement along the six supply cassette tables 33, 33,..., And the vertical movement of the turntable 38 by the vertical movement of the turntable 38.

In the supply unit 14 configured as described above,
The wafer W is supplied to the pre-alignment unit 16 as follows. First, the turntable 38 slides and the arm 36 stops in front of the predetermined supply cassette 30. Next, when the turntable 38 is raised by a predetermined amount, the arm 36 stops at a position at the same height as the height of the wafer W to be taken out from the supply cassette 30. Next, the arm 36 moves forward and enters the supply cassette 30, and sucks and holds the wafer W in the supply cassette 30. Next, the arm 36 retreats and takes out the wafer W from the supply cassette 30. Next, when the turntable 38 is lowered by a predetermined amount, the arm 36 returns to the original height position. Next, the turntable 38 is rotated by 180 °, and the arm 3 is rotated.
6 changes direction. Next, the turntable 38 slides and the arm 36 moves to a predetermined wafer delivery position. Then, the wafer W is transferred to the wafer transfer robot 42 of the pre-alignment unit 16.

As described above, the wafer W to be chamfered is supplied from the supply cassette 30 of the supply unit 14 to the pre-alignment unit 16. The supply of the wafers W is performed in units of cassettes. When all the wafers W stored in one supply cassette 30 are supplied, the wafers W are supplied from the next supply cassette 30.

Next, the configuration of the pre-alignment unit 16 will be described. As shown in FIG. 1, the pre-alignment unit 16 includes a wafer transfer robot 42 and a pre-alignment device 44. The wafer transfer robot 42 has an arm 4 having a pair of suction pads at the upper end.
6. This arm 46 is a turntable 48
It moves back and forth along the guide 50 laid on it, and turns as the turntable 38 rotates.

On the other hand, the pre-alignment device 44 comprises a thickness measuring sensor 52, a measuring table 54, and an orientation flat / notch detecting sensor 56. Thickness sensor 52
Is composed of a pair of upper and lower capacitance sensors. The pair of capacitance sensors are arranged so as to face each other at a predetermined interval, and measure the distance to the front surface and the back surface of the wafer W located therebetween. The measurement result of the capacitance sensor is output to an arithmetic unit (not shown), and this arithmetic measure measures the thickness of the wafer W by arithmetic processing.

On the other hand, the orientation flat notch detection sensor 56
Is constituted by an infrared sensor, and detects a position of a notch or an orientation flat of the rotating wafer W held by the measurement table 54. The measurement table 54 can rotate and move up and down while holding the center of the wafer W by suction.

The pre-alignment unit 16 configured as described above measures the thickness of the wafer W and performs pre-alignment as follows. In the initial state, the arm 46 of the wafer transfer robot 42 is waiting at a predetermined standby position (the position shown in FIG. 1). Wafer supply robot 34
When the arm 36 moves to the wafer transfer position, the arm 46 of the wafer transfer robot 42 turns so as to face the arm 36. Next, the wafer transfer robot 4
The second arm 46 advances to receive the wafer W from the arm 36 of the wafer supply robot 34. Next, the arm 46 of the wafer transfer robot 42 retreats and turns. Thus, the arm 46 of the wafer transfer robot 42 faces the thickness measurement sensor 52 of the pre-alignment device 44.

Next, the arm 46 moves forward by a predetermined distance toward the thickness detection sensor 52. Accordingly, the center of the wafer W held by the arm 46 is located at the measurement position of the thickness detection sensor 52, so that the thickness of the center of the wafer W is measured first. When the measurement of the thickness of the central portion of the wafer W is completed, the arm 46 retreats by a predetermined distance. As a result, the center of the wafer W coincides with the center of the measurement table 54. Next, the measurement table 54 moves up a predetermined distance, and receives the wafer W from the arm 46. The arm 46 that has delivered the wafer W retreats by a predetermined distance and returns to the standby position.

On the other hand, the measurement table 54 that has received the wafer W rotates the wafer W at a predetermined speed. Then, when the rotation of the wafer W is stabilized, the orientation flat / notch detection sensor 56 detects the position of the notch or orientation flat formed on the wafer W. At the same time, the thickness measurement sensor 52 measures the thickness of the outer peripheral portion of the wafer W.

When the measurement is completed, the rotation of the measurement table 54 stops. At this time, the measurement table 54 stops based on the detection result of the notch or orientation flat position so that the notch or orientation flat faces in a predetermined direction. That is, in the case of a notched wafer, the wafer is stopped so that the notch faces in the Y direction, and in the case of the wafer with orientation flat, the orientation flat is stopped so as to be parallel to the X direction.

As described above, the thickness measurement and the pre-alignment of the central portion and the peripheral portion of the wafer W are performed. Then, the wafer W having undergone the thickness measurement and the pre-alignment is transferred to the processing units 18A and 18B by the transfer unit 100 of the wafer transfer unit 24 described later. Next, the configuration of the processing units 18A and 18B will be described. As shown in FIG. 1, two processing parts 18A and 18B
Are arranged in parallel on the front surface of the apparatus body 12. As shown in FIGS. 2 and 3 (only the configuration of one processing unit 18A is shown in FIGS. 2 and 3), the processing units 18A and 18B mainly include the wafer feeding devices 60A and 60B.
And the outer peripheral grinding devices 62A and 62B and the notch grinding device 6
4A and 64B.

The wafer feeding devices 60A and 60B are provided with chuck tables 66A and 66B for holding the wafer W by suction.
The chuck tables 66A and 66B have
Driven by driving means (not shown), the front-back direction (Y-axis direction), the left-right direction (X-axis direction), and the up-down direction (Z-axis direction)
, And driven by a motor (not shown) to rotate around a central axis (θ-axis).

The outer peripheral grinding devices 62A and 62B are driven by an outer peripheral motor (not shown) to rotate the outer peripheral spindle 70.
A, 70B, and the outer peripheral spindle 70A,
Outer peripheral grinding wheels 72A and 72B for chamfering the outer periphery of the wafer W are mounted on 70B. Outer peripheral grinding wheel 72A,
A groove corresponding to the chamfered shape required for the wafer W is formed on the outer peripheral surface of the wafer 72B (form grindstone). By pressing the outer periphery or the orientation flat of the wafer W against the groove, the outer periphery or the orientation flat is chamfered. Is done.

The notch grinding devices 64A and 64B have notch spindles 76A and 76B which are driven to rotate by notch motors 74A and 74B, respectively. 78A and 78B are mounted. The notch grinding wheels 78A and 78B have grooves formed on the outer peripheral surface corresponding to the chamfered shape required for the notch (form-shaped grindstone), and the notch of the wafer W is chamfered by pressing the notch of the wafer W against the groove. Processed.

The processing sections 18A, 1
In 8B, the wafer W is chamfered as follows. Note that the wafer W has an outer periphery (circular portion) and
In the case of processing the orientation flat or the notch, the processing methods are different from each other. First, the case of chamfering the outer periphery of the wafer W will be described. First, the wafer W is held on the chuck tables 66A and 66B. Next, the outer peripheral grinding wheels 72A and 72B are rotated at a high speed. Next, the chuck tables 66A, 66B are moved to the outer peripheral grinding wheels 72A, 7A.
The wafer W is moved toward 2B, and the outer periphery of the wafer W is pressed against the grooves of the outer peripheral grinding wheels 72A and 72B. Next, the chuck tables 66A and 66B are rotated. Thereby, the outer periphery of the wafer W is ground into the outer peripheral grinding wheels 72A and 72B, and chamfering is performed.

Next, the case where the orientation flat of the wafer W is chamfered will be described. First, the outer peripheral grinding wheel 72
A and 72B are rotated at high speed. Next, the chuck tables 66A and 66B are moved toward the outer peripheral grinding wheels 72A and 72B, and the portion of the orientation flat is removed from the outer peripheral grinding wheels 72A and 72B.
Press against groove B. Next, the chuck table 66A,
66B is moved along the orientation flat. Thereby, the orientation flat of the wafer W is ground into the outer peripheral grinding wheels 72A and 72B, and is chamfered.

Next, a case where a notch formed on the wafer W is chamfered will be described. First, the notch grinding wheels 78A and 78B are rotated at a high speed. Next, the chuck tables 66A and 66B are notched with grinding wheels 78A,
The notch is moved toward the groove 78B, and the notch is pressed against the grooves of the notch grinding wheels 78A and 78B. As a result, the notch of the wafer W is ground by the notch grinding wheels 78A and 78B and chamfered.

Next, the configuration of the positioning section 20 will be described. The positioning unit 20 positions the wafer W pre-aligned by the pre-alignment unit 16 at a predetermined position (fine alignment) and performs chuck chuck 66
A, 66B. This positioning unit 20
As shown in FIGS. 1 and 2, a horizontal guide 80, a horizontal slide block 82 that slides along the horizontal guide 80, a vertical guide 83 disposed on the horizontal slide block 82, An elevating block 84 that moves up and down along a guide 83;
4 and is detachably attached to the processing section 18A, 18
And a centering unit 86 disposed above B.

As shown in FIG. 1, the horizontal guide 80 is disposed along two processing portions 18A and 18B arranged in parallel, and a slide block 82 is not shown along the horizontal guide 80. It is slid by being driven by the driving means. On the other hand, as shown in FIG. 2, the vertical guide 83 is disposed so as to be orthogonal to the horizontal guide 80, and the elevating block 84 is driven by driving means (not shown) along the vertical guide 83 to move up and down. I do. Therefore, the centering unit 86 attached to the elevating block 84 vertically moves above and below the processing parts 18A and 18B by the elevating block 84 moving up and down, and the horizontal slide block 82 slides. It moves horizontally above the processing units 18A and 18B.

The centering unit 86
There are two types, one for wafers with orientation flats and the one for notched wafers, which are replaced by an operator according to the wafer to be chamfered. As shown in FIG. 4, the centering unit 86 for a wafer with an orientation flat has a pair of nipping rollers 88, 88 and a pair of positioning reference pieces 90, 90. Scale toward O. The wafer with the orientation flat is connected to the pair of nipping rollers 88, 88.
It is centered by being pinched by the pair of positioning reference pieces 90, 90, and is positioned at a predetermined position by the pair of positioning reference pieces 90, 90 abutting the orientation flat.

On the other hand, as shown in FIG. 5, the centering unit 86 for a notched wafer has a pair of nipping rollers 92, 92 and one positioning reference piece 94, each of which is driven by driving means (not shown). And expand and contract toward the center O. The notched wafer is made up of the pair of nipping rollers 92 and 92 and one positioning reference piece 9.
4, the centering is performed, and the positioning reference piece 94 enters the notch to be positioned at a predetermined position.

Next, the configuration of the cleaning unit 22 will be described. As shown in FIG. 1, the cleaning unit 22 includes two processing units 18.
A, 18B. This cleaning unit 22
Is provided with a spin cleaning device 96. The spin cleaning device 96 rotates the wafer W held on the cleaning table 98, and sprays a cleaning liquid onto the surface of the rotating wafer W, thereby forming a spin cleaning device 96 on the surface of the wafer W. The adhered dirt is peeled and removed.

Next, the configuration of the wafer transfer section 24 will be described. The transfer unit 100 is provided in the wafer transfer unit 24, and the transfer unit 100 transfers the wafer W pre-aligned by the pre-alignment unit 16 to the centering unit 86 of the positioning unit 20. 18
The wafer W chamfered in B is transferred onto the cleaning table 98 of the cleaning unit 22. The transfer unit 100 includes a horizontal guide 10 as shown in FIGS.
2, a slide block 104 that slides along the horizontal guide 102, and the slide block 10
4, a supply transfer arm 106 provided on
A recovery transfer arm 108 is also provided on the slide block 104.

The horizontal guide 102 is, as shown in FIG.
The horizontal guide 102 is disposed along the two processing sections 18A and 18B and the cleaning section 22 arranged in parallel.
The slide block 104 is driven by driving means (not shown) and slides along. As shown in FIG. 6, the supply transfer arm 106 has a U-shaped wafer tray 110 at the tip. This wafer tray 11
A pair of suction pads 112, 112 are provided on the upper surface of the “0”, and the supply transfer arm 106 transports the wafer W while holding the wafer W with the suction pads 112, 112. The supply transfer arm 106 has a base end fixed to an output shaft of an arm turning motor 116 provided in the first lifting block 114, and turns by driving the arm turning motor 116. Further, the first lifting / lowering block 114 provided with the arm rotation motor 116 is slidably supported by a first column 118 vertically provided on the slide block 104, and is driven by a cylinder (not shown). To move up and down. Therefore, the supply transfer arm 106 is connected to the first lifting block 114
Is moved up and down by moving up and down. Also, when the slide block 104 slides, X in FIG.
Slide in the axial direction.

On the other hand, the recovery transfer arm 108
Has a suction pad 120 at the lower end of the tip as shown in FIG. The recovery transfer arm 108 transports the wafer W while holding the wafer W with the suction pad 120. The base end of the recovery transfer arm 108 is supported by the second lifting block 122.
The elevating block 122 is slidably supported by a second support 124 which stands upright on the slide block 104. The second lifting block 122 is moved up and down by being driven by a cylinder (not shown), and as a result, the recovery transfer arm 108 moves up and down. The collection transfer arm 108 slides in the X-axis direction in FIG. 1 together with the supply transfer arm 106 as the slide block 104 slides.

In the transfer unit 100 configured as described above, the supply transfer arm 106 and the recovery transfer arm 108 are driven by the slide block 104 to move horizontally as shown in FIG. , "The first centering delivery position", "second centering delivery position", "standby position", and "cleaning table delivery position" to transfer the wafer W.

Next, the configuration of the post-measurement section 26 will be described. The rear measurement unit 26 measures the diameter of the chamfered wafer W. The post-measurement unit 26 includes a diameter measuring device 126 for measuring the diameter of the wafer W as shown in FIG. 1 and a measurement table 128 for holding and rotating and moving the wafer W up and down. The diameter of the rotating wafer W held by the
Measure using

The transfer of the wafer W from the cleaning table 98 of the cleaning section 22 to the measurement table 128 of the post-measurement section 26 is performed by the wafer collection robot 13 of the collection section 28 described below.
4 does. Next, the configuration of the collection unit 28 will be described.
As shown in FIG. 1, the collection unit 28 includes a collection cassette 130.
Cassette positioning device 1 for positioning the paper in a predetermined position
32 and a wafer collection robot 1 that stores wafers W in a collection cassette 130 positioned at a predetermined wafer collection position by the collection cassette positioning device 132.
34.

The collecting cassette positioning device 132 has six collecting cassette tables 136, 136,... These six collection cassette tables 136, 136,
Are arranged in series on the right side of the apparatus main body 12. Are set at predetermined positions by being set on the six collection cassette tables 136, 136,.... On the other hand, the wafer collection robot 134 has an arm 138 provided with a pair of suction pads at the lower end of the tip. This arm 138
Moves forward and backward along a guide 142 laid on the turntable 140, and turns as the turntable 140 rotates. Also, turntable 1
.. Slides along the six collection cassette tables 136, 136,..., And moves up and down as the turntable 140 moves up and down.

In the recovery unit 28 configured as described above,
The wafer W is collected as follows. First, the turntable 140 slides and stops in front of the measurement table 162 of the rear measurement unit 26. Next, arm 13
8 moves forward and is positioned below the wafer W held on the measurement table 162. Next, the measurement table 16
2 is lowered, and the wafer W is transferred to the arm 138. Next, the arm 138 retreats and turns 180 °.
Next, the turntable 140 slides and stops in front of the predetermined collection cassette 130. Next, the turntable 140 moves up a predetermined distance, and the arm 138 moves to the storage position of the wafer W. Next, the arm 138 advances to store the wafer W in the collection cassette 130 and release the suction of the wafer W. Next, the arm 138 is retracted. Then, when the turntable 140 is lowered by a predetermined distance, the arm 138 returns to the original height position. Thus, the collection of the wafer W ends.

The collection of wafers W is performed in cassette units. When one collection cassette 130 becomes full, the wafer W is collected in the next collection cassette 130. The operation of the wafer chamfering apparatus 10 according to the present embodiment configured as described above is as follows. In the following description,
The processing portion 18A on the left side in FIG. 1 is referred to as a “first processing portion 18A” and the processing portion 18B on the right side is referred to as a “second processing
8B ".

As shown in FIG. 1, first, one of the six supply cassettes 30, 30,.
The wafers W are taken out by the wafer supply robot 34. The taken-out wafer W is transferred by the wafer supply robot 34 to the wafer transfer robot 42 of the pre-alignment unit 16. The wafer transfer robot 42 that has received the wafer W transfers the wafer W to the pre-alignment device 44. On the other hand, the wafer supply robot 34 that has delivered the wafer W takes out the next wafer W to be processed from the supply cassette 30 and stands by at a predetermined wafer delivery position (the position indicated by a solid line in FIG. 1).

The pre-alignment device 44 measures the thickness of the wafer W transferred from the wafer transfer robot 42 and performs pre-alignment. When the thickness measurement and the pre-alignment are completed by the pre-alignment device 44, FIG.
As shown in FIG. 8, the supply transfer arm 106 and the recovery transfer arm 108 are positioned at the wafer receiving position (FIG. 8).
To the position indicated by the solid line). Then, the supply transfer arm 106 receives the pre-aligned wafer W from the measurement table 54 of the pre-alignment device 44.

Here, the supply transfer arm 106
Receives the wafer W from the measurement table 54 as follows. As shown in FIG. 8, when the supply transfer arm 106 and the recovery transfer arm 108 move to the wafer receiving position, the supply transfer arm 10
6 pivots about 90 ° clockwise. As a result, the wafer receiving tray 110 of the supply transfer arm 106 is positioned below the wafer W held on the measurement table 54, as indicated by the two-dot broken line in FIG.

Next, the supply transfer arm 106 moves up a predetermined distance. As a result, the suction pads 112, 112 provided on the wafer
The suction pads 112, 112
The wafer W is held by suction. Next, measurement table 5
4 releases the suction of the wafer W and descends by a predetermined distance.
As a result, the wafer W is transferred from the measurement table 54 to the supply transfer arm 106. When the supply transfer arm 106 receives the wafer W, the supply transfer arm 106 turns about 90 ° in a counterclockwise direction, returns to the wafer receiving position, and then descends by a predetermined distance.

Thus, the delivery of the wafer W is completed. When the wafer W is received by the supply transfer arm 106, the wafer W to be processed next is transferred to the pre-alignment device 4 by the wafer transfer robot 42.
4, the pre-alignment device 44 performs the thickness measurement and pre-alignment of the transferred wafer W in advance.

When the supply transfer arm 106 receives a wafer, the supply transfer arm 106 and the recovery transfer arm 108 move to the first centering transfer position shown in FIG. A centering unit 86 is on standby in advance above the first centering transfer position, and a chuck table 66A of the first processing unit 18A is on standby below. Supply transfer arm 1
In step 06, the wafer W is moved up by a predetermined distance and transferred to the centering unit 86.

Here, the centering unit 86 performs centering and positioning of the wafer W in the process of receiving the wafer W. That is, in the case of the wafer W with the orientation flat, the wafer W is centered by holding and receiving the wafer W between the pair of holding rollers 88, 88 and the pair of positioning reference pieces 90, 90. Then, the wafer W is positioned at a predetermined position by bringing the pair of positioning reference pieces 90, 90 into contact with the orientation flat (positioning the orientation flat in a predetermined direction).

On the other hand, in the case of the notched wafer W, a pair of nipping rollers 92, 92 and one positioning reference piece 94
The wafer W is centered by holding and receiving the wafer W. And positioning reference piece 9
The wafer W is positioned at a predetermined position by fitting 4 into the notch (the notch is positioned in a predetermined direction).

The wafer W transferred from the supply transfer arm 106 to the centering unit 86
Are pre-aligned in the pre-alignment unit 16 so that the supply transfer arm 106
If the wafer W delivered from the above is held as it is, a pair of positioning reference pieces 1
50 and 150 automatically come into contact with the orientation flat, and in the case of a notched wafer W, the positioning reference piece 154 is automatically fitted into the notch.

When the centering device 146 receives the wafer W, the supply transfer arm 106 descends by a predetermined distance and returns to the original position. Then, it moves to the standby position together with the recovery transfer arm 108. On the other hand, after the supply transfer arm 106 and the recovery transfer arm 108 move to the standby position, the centering unit 86 descends by a predetermined distance and places the wafer W on the chuck table 66A of the first processing unit 18A.

The centering unit 86 having the wafer W placed on the chuck table 66A rises again by a predetermined distance and returns to the position where the wafer W has been received. Then, it moves a predetermined distance in the horizontal direction and moves above the second centering delivery position. On the other hand, after the centering unit 86 moves up, the first processing unit 18A starts chamfering the transferred wafer W.

When the chamfering of the wafer W by the first processing section 18A starts, the supply transfer arm 106
Then, the collection transfer arm 108 moves to the wafer receiving position again. Then, the pre-alignment device 44
The supply transfer arm 106 receives the wafer W that has already been pre-aligned. When the supply transfer arm 106 receives the wafer W, the supply transfer arm 106
8 and moves to the second centering delivery position. As described above, the centering unit 86 moves in advance and waits above the second centering delivery position, and the chuck table 66B of the second processing unit 18B waits below.

The supply transfer arm 106 ascends a predetermined distance and transfers the wafer W to the centering unit 86 in the same manner as described above.
In the process of receiving the wafer W, centering and positioning of the wafer W are performed. Supply transfer arm 10
When 6 transfers the wafer W to the centering unit 86, the supply transfer arm 106 moves down a predetermined distance. Then, it moves to the standby position again together with the collection transfer arm 108.

On the other hand, the centering unit 86 to which the wafer W has been delivered from the supply transfer arm 106
After the supply transfer arm 106 and the recovery transfer arm 108 move to the standby position, the wafer W is lowered by a predetermined distance and placed on the chuck table 66A of the second processing unit 18B. Then, the wafer W rises by a predetermined distance and returns to the position where the wafer W has been received. After moving up, the centering unit 86 moves in the horizontal direction again and moves above the first centering delivery position.

The second processing unit 18 to which the wafer W has been delivered
B starts chamfering of the transferred wafer W after the centering unit 86 moves up. In the above steps, the wafers W are supplied to the two processing units 18A and 18B, respectively, and the wafer W is chamfered at two locations. During the chamfering of the wafer W in the first processing unit 18A and the second processing unit 18B, the supply transfer arm 106 and the recovery transfer arm 108 move to the wafer receiving position. And
The wafer W that has been pre-aligned is supplied from the pre-alignment device 44.
6 receives.

When the supply transfer arm 106 receives the wafer W, the supply transfer arm 106 and the recovery transfer arm 108 move to the first centering transfer position and wait. In addition, a centering unit 86 is waiting in advance above the first centering delivery position. When a predetermined time elapses after the chamfering of the wafer W is started in the first processing part 18A, the chamfering of the wafer W is finished in the first processing part 18A. When the chamfering of the wafer W is completed,
The chuck table 66A of the first processing unit 18A moves to a position below the first centering delivery position.

When the chuck table 66A moves to a position below the first centering delivery position, the supply transfer arm 106, which has been waiting at the first centering delivery position, rises a predetermined distance and receives the wafer W on the centering unit 86. hand over. At the same time, the recovery transfer arm 108 descends by a predetermined distance to receive the chamfered wafer W held on the chuck table 66A. The supply transfer arm 106
After delivering the wafer W to the centering unit 86, the wafer W is lowered by a predetermined distance and returns to the original position. In addition, the recovery transfer arm 108 is also a chuck table 66A.
After the wafer W held by the suction pad 120 is suction-held by the suction pad 120, the wafer W is raised by a predetermined distance and returns to the original position.

Thereafter, the supply transfer arm 106 and the recovery transfer arm 108 are slid in the horizontal direction and moved to the washing table delivery position shown in FIG. Then, when the supply transfer arm 106 and the recovery transfer arm 108 are located at the cleaning table transfer position, the recovery transfer arm 108 moves down a predetermined distance and transfers the wafer W to the cleaning table 98 of the spin cleaning device 96. The collection transfer arm 108 that has transferred the wafer W moves up a predetermined distance and moves to the standby position together with the supply transfer arm 106. The spin cleaning device 96 is provided with the recovery transfer arm 1.
After the rise of 08, the received wafer W is cleaned by spin cleaning.

On the other hand, the centering unit 86 receiving the wafer W from the supply transfer arm 106
After the supply transfer arm 106 and the recovery transfer arm 108 move toward the cleaning table delivery position, the wafer W is placed on the chuck table 66A of the first processing unit 18A by descending a predetermined distance. And
The centering unit 86 rises again by a predetermined distance and moves to the position where the wafer W has been received, and then moves horizontally to move above the second centering transfer position.

On the other hand, the first processing section 18A to which the wafer W has been transferred starts chamfering the transferred wafer W after the centering unit 86 is raised. As described above, in each of the processing units 18A and 18B, the supply and the recovery of the wafer W from the second wafer W are performed simultaneously. When the cleaning of the wafer W supplied to the spin cleaning device 96 is completed, the wafer recovery robot 134 of the recovery unit 28 moves the cleaning unit 98 from the cleaning table 98 of the spin cleaning device 96 to the post-measurement unit 26.
The wafer W is transferred onto the measurement table 162 of FIG. The rear measurement unit 26 measures the diameter of the wafer W transferred onto the measurement table 162 by the diameter measurement device 126.
After that, when the measurement of the diameter is completed by the measuring unit 26,
The wafer collection robot 134 collects the wafer W from the measurement table 162 and stores it in the collection cassette 130 as it is.

In the above series of steps, the operations from supply of one wafer W to pre-measurement, chamfering, cleaning, post-measurement, and collection are completed. The same operation is performed on the supply cassettes 30, 3
0,... Are performed on all the wafers W stored therein. Then, when all the wafers W are collected in the collection cassette 130, the chamfering operation by the wafer chamfering device 10 ends.

As described above, according to the wafer chamfering apparatus 10 of the present embodiment, the supply and recovery of the wafers W to the processing units 18A and 18B can be performed at the same time, so that the wafers W can be processed efficiently, and the throughput can be improved Is improved. In addition, in the wafer chamfering apparatus 10 of the present embodiment, the supply and the recovery of the wafer W are performed by separate transfer arms, respectively, but a single transfer arm may be shared. That is,
As shown in FIG. 9, a U-shaped wafer tray 110 is set at the tip of the supply transfer arm 106 described above,
A pair of pads 180A, 180
0B is provided, and the upper wafer 180A holds the supply wafer W, and the lower pad 180B holds the recovery wafer W. With this, the supply and the recovery of the wafer W can be performed at the same time as in the above-described embodiment.

Further, in the wafer chamfering apparatus 10 of the present embodiment, the supply transfer arm 106 and the recovery transfer arm 108 have the same slide block 1.
10, the supply transfer arm 106 and the recovery transfer arm 108 are separated from each other by separate slide blocks 104A and 104A, as shown in FIG.
04B, and may be configured to be able to move independently. However, even in such a case that the collection pad 120 can be moved independently, the collection pad 120 is configured to be located below the supply pad 112 as in the above-described embodiment.

As shown in FIG. 10, the supply transfer arm 106 and the recovery transfer arm 108
In the case of a mechanism that can move independently, the following effects can be obtained. That is, in the case of the above-described embodiment, for example,
When the wafers W collected by the processing units 18A and 18B are transported to the cleaning unit 22 by the recovery transfer arm 108, the supply transfer arm 106 must also move to the cleaning unit 22 at the same time. Recovery transfer arm 108
Is a mechanism that can be moved independently, only the recovery transfer arm 108 can be moved. Therefore, if the wafer W to be chamfered by the supply transfer arm 106 is transported from the pre-alignment unit 16 while the wafer W after processing by the recovery transfer arm 108 is transported to the cleaning unit 22, the processing time Can be reduced, and the throughput can be further improved.

In the case of this example, each slide block 1
04A and 104B may move on the same horizontal guide, or may move on separate horizontal guides. Further, in wafer chamfering apparatus 10 of the present embodiment, by moving supply transfer arm 106 and collection transfer arm 108 up and down, the pads (supply pad 112 and collection pad 120) provided at each end are moved up and down. However, the transfer arm may be fixed and the pads may be individually moved up and down by a cylinder or the like.

Further, in the wafer chamfering apparatus 10 of the present embodiment, it is possible to connect a plurality of main units except for the supply unit 14 and the recovery unit 28 in the horizontal direction.
It is possible to construct a wafer chamfering apparatus having a configuration capable of processing a large number of wafers W at one time. FIG. 11 is a plan view showing the configuration of the second embodiment of the wafer chamfering apparatus according to the present invention.

In the above-described wafer chamfering apparatus 10 according to the first embodiment, the wafer W to be chamfered is supplied to the supply unit 1.
4, and the processed wafer W is configured to be collected by the collection unit 28. The wafer chamfering apparatus 200 according to the second embodiment is configured to supply and collect the wafer W at the same location. The specific configuration is as follows.

As shown in FIG. 11, a wafer chamfering apparatus 200 according to the second embodiment mainly includes a
02, pre-alignment unit 204, processing unit 206A,
06B, a positioning unit 208, a cleaning unit 210, and a wafer transfer unit 212. The basic configuration of each part is the same as the wafer chamfering apparatus 1 of the first embodiment described above.
Same as 0. However, the configuration of the cleaning unit 22 is slightly different.

Although only the spin cleaning device 96 is provided in the cleaning unit 22 of the first embodiment, the spin cleaning device 96 and the wafer lifting / lowering device are provided in the cleaning unit 210 of the second embodiment. 214 are provided. The wafer elevating device 214 has an arm 216 that can be moved up and down. The wafer W is held by a pad 218 provided at the lower end of the arm 216, and the cleaned wafer W is moved to a predetermined height. Transport.

The structure of the supply / recovery section 202 is the same as that of the supply section 14 of the first embodiment described above. Also,
Members that are the same as or similar to those of the wafer chamfering apparatus 10 according to the first embodiment are given the same reference numerals, and descriptions thereof are omitted. The operation of the wafer chamfering apparatus 200 according to the second embodiment configured as described above is as follows.

The steps from the chamfering of the wafer W to the cleaning are the same as those of the wafer chamfering apparatus 10 of the first embodiment described above. The steps up to collection at 202 will be described. The arm 218 of the wafer elevating device 214 is normally connected to the cleaning table 9 of the spin cleaning device 96.
8 (arm waiting position).

When the cleaning of the wafer W is completed by the spin cleaning device 96 of the cleaning unit 210, the arm 216 of the wafer lifting device 214 is lowered by a predetermined amount. Then, the cleaned wafer W is suction-held by the pad 218 provided at the tip. The arm 216 holding the wafer W rises again and returns to the original arm standby position. On the other hand, while the spin cleaning device 96 is cleaning the wafer W, the supply transfer arm 106 transfers the wafer W to the centering unit 86 and the collection transfer arm 108 transfers the chuck table 66, as in the first embodiment.
The wafer W is received from A or 66B.

When the arm 216 of the wafer lifting device 214 returns to the arm standby position, the supply transfer arm 106 and the recovery transfer arm 108 move to the cleaning table transfer position. As a result, the wafer tray 110 of the supply transfer arm 106 is located below the wafer W held by the arm 216 of the wafer elevating device 214.

Next, the recovery transfer arm 108 is lowered by a predetermined amount, and the cleaning table 98 of the spin cleaning device 96 is moved.
At the same time as transferring the wafer W, the supply transfer arm 106 moves up by a predetermined amount, and receives the wafer W from the arm 216 of the wafer elevating device 214. The supply transfer arm 106 that has received the wafer W descends by a predetermined amount, and moves to the wafer receiving position together with the collection transfer arm 108.

When the supply transfer arm 106 moves to the wafer receiving position, the arm 46 of the wafer transfer robot 42 turns clockwise by about 90 °. As a result, the arm 46 of the wafer transfer robot 42 is positioned so as to face the wafer tray 110 of the supply transfer arm 106. Next, the wafer transfer robot 42
Arm 46 advances by a predetermined amount. As a result, the arm 46 of the wafer transfer robot 42 is located below the wafer tray 110 of the supply transfer arm 106. Thereafter, the arm 46 of the wafer transfer robot 42 is raised by a predetermined amount, and the wafer W is
Receive. At this time, the arm 46 of the wafer transfer robot 42 receives the wafer W through a space between the pair of supply pads 112 of the U-shaped wafer tray 110.

The arm 46 of the wafer transfer robot 42 that has received the wafer W is lowered after retreating by a predetermined amount.
Then, it turns 180 ° in the clockwise direction. At the point where the arm 46 of the wafer transfer robot 42 turns,
The wafer supply robot 40 of the supply / recovery unit 202 is already on standby, and the wafer transfer robot 42 transfers the wafer W to the wafer supply robot 40. And
The wafer supply robot 40 receiving the wafer W,
The same supply cassette 30 as when the wafer W was supplied.
The wafer W is stored.

On the other hand, the supply transfer arm 106, which has delivered the wafer W to the wafer transfer robot 42,
After the arm 46 of the wafer transfer robot 42 retreats, it turns about 90 °. As a result, the wafer pan 110
Are located below the measurement table 54 of the pre-alignment device 44. The wafer W which has been pre-aligned is held on the measurement table 54 and is on standby.
The supply transfer arm 106 receives the wafer W on the measurement table 54. Then, the wafer W turns again in the counterclockwise direction, and transfers the wafer W to the centering unit 86 on the first processing unit 18A or the second processing unit 18B.

As described above, according to the wafer chamfering apparatus 200 of the second embodiment, by using the transfer unit 100 of the present embodiment, the wafer W
Supply and recovery can be performed in the same place. As a result, the size of the device can be reduced, and the manufacturing cost of the device can be reduced.

Further, by supplying and recovering the wafer W at the same place as in the present embodiment, the number of cassette carriers used for physical distribution can be reduced to half. In this embodiment, the wafer transfer robot 42 is configured to directly receive the cleaned wafer W from the supply transfer arm 106. However, the cleaned wafer W is once stored on the measurement table 54 of the pre-alignment apparatus 44. The wafer transfer robot 42 may receive the cleaned wafer W via the measurement table 54.

In this embodiment, by configuring the wafer transfer robot 42 to receive the cleaned wafer W directly from the supply transfer arm 106, the apparatus can be made compact without lowering the throughput. be able to. That is, the wafer W to be chamfered is pre-aligned by directly transferring the cleaned wafer W from the supply transfer arm 106 to the wafer transfer robot 42 without passing through the measurement table 54. Table 5
4 can be kept waiting on the wafer W efficiently.
Can be supplied.

In this embodiment, the arm 46 of the wafer transfer robot 42 is composed of only one arm. However, as shown in FIG. 12, two upper and lower arms 46A, With the configuration using 46B, the throughput can be further improved. That is, first, the wafer W that has been cleaned by the upper arm 46A is received from the supply transfer arm 106. Next, the wafer W to be chamfered next is received by the lower arm 46B from the wafer supply robot 40. Then, the cleaned wafer W held by the upper arm 46A is transferred to the wafer supply robot 40. This allows
Supply and recovery of the wafer W can be performed at the same time, and the throughput can be improved.

The arms 46A and 46B shown in FIG.
Has a common drive mechanism, and simultaneously performs up and down, front and back, and turning. Also, in the figure, reference numerals 47, 47 denote vacuum suction holes, which hold the wafer W by sucking air from the vacuum suction holes 47, 47. In the case of the present embodiment,
No post-measurement unit is installed, but when performing post-measurement,
Proceed as follows.

That is, the supply transfer arm 10
6 is a wafer W to be chamfered from above the measurement table 54
After receiving the wafer W, the wafer transfer robot 42 places the cleaned wafer W received from the supply transfer arm 106 on the measurement table 54. The orientation flat / notch detection sensor 5 of the pre-alignment device 44
6, the diameter of the wafer W is measured. After the measurement is completed, the wafer W is collected by the wafer supply robot 40,
It is stored in the supply cassette 30.

Thus, the post-measurement can be performed also in the wafer chamfering apparatus 200 of the present embodiment. Also in the present embodiment, a single transfer arm for transferring the wafer W may be used in common, or the supply transfer arm 106 and the recovery transfer arm 108 may be configured to be individually movable. You may.

Further, in the wafer chamfering apparatus 200 according to the present embodiment, a plurality of main units other than the supply / recovery unit 202 can be connected in a lateral direction.
It is possible to construct a wafer chamfering apparatus having a configuration capable of processing a large number of wafers W at one time. Further, in the above-described wafer chamfering apparatuses 10 and 200, the processing section is installed at two locations, but may be configured at only one location, or at a plurality of locations such as three locations or four locations. It may be installed and configured.

In addition, the above-described wafer chamfering device 10,
Although the centering unit 200 is configured so that one centering unit 86 is shared by the two processing units 18A and 18B, the centering unit 86 may be separately installed for each processing unit.

[0094]

As described above, according to the present invention,
Supply and recovery of the wafer to be chamfered can be performed simultaneously. As a result, the wafer can be efficiently supplied and collected, and the throughput is improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a first embodiment of a wafer chamfering apparatus according to the present invention.

FIG. 2 is a side view showing a configuration of a processing unit.

FIG. 3 is a perspective view showing a configuration of a main part of a processing unit.

FIG. 4 is a perspective view showing a schematic configuration of a centering unit (for a wafer with an orientation flat).

FIG. 5 is a perspective view showing a schematic configuration of a centering unit (for a notched wafer).

FIG. 6 is a side view showing the configuration of a supply transfer arm.

FIG. 7 is a side view showing the configuration of a recovery transfer arm.

FIG. 8 is a plan view showing a configuration of a transfer unit.

FIG. 9 is a side view showing the configuration of another embodiment of the transfer unit.

FIG. 10 is a plan view showing the configuration of another embodiment of the transfer unit.

FIG. 11 is a plan view showing a configuration of a wafer chamfering apparatus according to a second embodiment of the present invention.

FIG. 12 is a perspective view showing the configuration of another embodiment of the arm of the wafer transfer robot.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Wafer chamfering device 12 ... Equipment main body 14 ... Supply part 16 ... Pre-alignment part 18A ... First processing part 18B ... Second processing part 20 ... Positioning part 22 ... Washing part 24 ... Wafer transfer part 28 ... Recovery part 34 ... Wafer Supply robot 42 ... Wafer transfer robot 44 ... Pre-alignment device 66A, 66B ... Chuck table 70A, 70B ... Outer peripheral spindle 72A, 72B ... Outer peripheral grinding wheel 76A, 76B ... Notch spindle 78A, 78B ... Notch grinding wheel 86 ... Centering unit 96 ... Spin cleaning apparatus 100 transfer unit 106 supply transfer arm 108 recovery transfer arm 134 wafer recovery robot W wafer

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[Procedure amendment]

[Submission date] November 1, 1999 (1999.11.
1)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction contents]

[0008]

According to the first aspect of the present invention, there is provided a pre-alignment unit for pre-aligning a wafer to be chamfered, and a wafer supply for supplying the wafer to be chamfered to the pre-alignment unit. Means, a processing section for grinding and chamfering the periphery of the wafer held by the chuck table with a grindstone, and a wafer to be chamfered disposed above the processing section and positioned on the chuck table. Positioning part, a cleaning part for cleaning the chamfered wafer, and a transport means for transporting the wafer by moving between the respective parts, the transport means, a traveling body traveling along a transport path, An arm provided on the traveling body, a supply pad provided on an upper end of the arm, and a rotation arm provided on a lower end of the arm. A pad, a pad elevating means for vertically moving said collection pad and the feed pad consists,
After the wafer pre-aligned by the pre-alignment unit is held by the supply pad, the supply pad is moved below the positioning unit, and the supply pad is raised to supply a wafer to be chamfered to the positioning unit. On the other hand, the collecting pad is lowered to collect the chamfered wafer from the chuck table, and the collecting pad is moved toward the cleaning unit to transfer the wafer to the cleaning unit. .

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

According to a third aspect of the present invention, in order to achieve the above object, a pre-alignment unit for pre-aligning a wafer to be chamfered, a wafer supply unit for supplying the wafer to be chamfered to the pre-alignment unit, and a chuck table. A processing unit for grinding and chamfering the periphery of the held wafer with a grindstone; a positioning unit disposed above the processing unit for positioning the wafer to be chamfered and mounting the wafer on the chuck table; A cleaning unit that cleans the processed wafer, and a transport unit that transports the wafer by moving between the units, the transport unit is provided on the traveling body that travels along a transport path, and provided on the traveling body. Supply arm provided, a supply pad provided at the upper end of the supply arm, and a supply pad elevating device for moving the supply pad up and down. A step, a collecting arm provided on the traveling body, a collecting pad provided below the tip of the collecting arm and arranged below the supply pad, and a collecting pad lifting / lowering means for moving the collecting pad up and down After holding the wafer pre-aligned by the pre-alignment unit with the supply pad, moving the supply pad below the positioning unit, raising the supply pad, and chamfering the positioning unit. While collecting the wafer, the collecting pad is lowered to collect the chamfered wafer from the chuck table, and the collecting pad is moved toward the cleaning unit to transfer the wafer to the cleaning unit. It is characterized by the following.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction contents]

According to a fifth aspect of the present invention, in order to achieve the above object, a pre-alignment unit for pre-aligning a wafer to be chamfered, a wafer supply means for supplying a wafer to be chamfered to the pre-alignment unit, and a chuck table are provided. A processing unit for grinding and chamfering the periphery of the held wafer with a grindstone; a positioning unit disposed above the processing unit for positioning the wafer to be chamfered and mounting the wafer on the chuck table; A cleaning unit that cleans the processed wafer; and a transport unit that transports the wafer by moving between the units, the transport unit includes a supply traveling unit that travels along a supply transport path, and the supply traveling unit. A supply arm provided on the body, a supply pad provided on an upper end of the supply arm, and a supply pad for moving the supply pad up and down. A pad elevating means, a collection traveling body that travels along a collection conveyance path, a collection arm provided on the collection traveling body, and provided at a lower end of the tip of the collection arm, and arranged at a position below the supply pad. Collecting pad, and a collecting pad elevating means for moving the collecting pad up and down. After holding the wafer pre-aligned by the pre-alignment unit with the supply pad, the supply pad is placed below the positioning unit. While moving, the supply pad is raised to supply the wafer to be chamfered to the positioning portion, while the collection pad is moved above the chuck table, and the collection pad is lowered to perform chamfering from the chuck table. The completed wafer is collected, and the collection pad is moved toward the cleaning section to remove the wafer. The characterized in that it transported to the cleaning section.

Claims (8)

[Claims] 1. A pre-alignment unit for pre-aligning a wafer to be chamfered, a processing unit to grind the periphery of a wafer held on a chuck table with a grindstone, and a processing unit disposed above the processing unit; A positioning unit for positioning the wafer to be chamfered and mounted on the chuck table; a cleaning unit for cleaning the chamfered wafer; and a transport unit for transporting the wafer by moving between the respective units. In the wafer chamfering apparatus, the transfer means includes: a traveling body traveling along a transportation path; an arm provided on the traveling body; a supply pad provided on an upper end of the arm; and a lower part of the tip of the arm. A collecting pad provided, and a pad elevating means for vertically moving the supply pad and the collecting pad. After holding the wafer that has been pre-aligned at the feeding portion with the supply pad, the supply pad is moved below the positioning portion, and the supply pad is raised to supply the wafer to be chamfered to the positioning portion, Lowering the collecting pad to collect the chamfered wafer from the chuck table, moving the collecting pad toward the cleaning unit, and transporting the wafer to the cleaning unit. apparatus. 2. The wafer according to claim 1, wherein the arm is pivotally provided on the traveling body, and pivots at a predetermined wafer receiving position to receive a pre-aligned wafer from the pre-alignment unit. Chamfering device. 3. A pre-alignment unit for pre-aligning a wafer to be chamfered, a processing unit to grind a peripheral edge of the wafer held on a chuck table with a grindstone, and a processing unit disposed above the processing unit; A positioning unit for positioning the wafer to be chamfered and mounted on the chuck table; a cleaning unit for cleaning the chamfered wafer; and a transport unit for transporting the wafer by moving between the respective units. In the wafer chamfering apparatus, the transfer unit includes: a traveling body that travels along a transportation path; a supply arm provided on the travel body; a supply pad provided at an upper end of the supply arm; and a supply pad. Supply pad elevating means for moving up and down, a collection arm provided on the traveling body, A collection pad disposed below the supply pad; and a collection pad raising / lowering means for moving the collection pad up and down. After the wafer pre-aligned by the pre-alignment unit is held by the supply pad, Moving the supply pad below the positioning portion, raising the supply pad to supply the wafer to be chamfered to the positioning portion, and lowering the collection pad to complete the chamfering from the chuck table. A wafer chamfering apparatus, wherein a wafer is collected, the collection pad is moved toward the cleaning unit, and the wafer is transferred to the cleaning unit. 4. The apparatus according to claim 3, wherein the supply arm is pivotally provided on the traveling body, and pivots at a predetermined wafer receiving position to receive a pre-aligned wafer from the pre-alignment unit. Wafer chamfering equipment. 5. A pre-alignment unit for pre-aligning a wafer to be chamfered, a processing unit to grind the periphery of the wafer held on the chuck table with a grindstone, and a processing unit disposed above the processing unit; A positioning unit for positioning a wafer to be chamfered and mounted on the chuck table, a cleaning unit for cleaning the chamfered wafer, and a transfer unit for transferring the wafer by moving between the respective units. In the wafer chamfering apparatus, the transfer unit includes: a supply traveling body that travels along a supply transportation path; a supply arm provided on the supply traveling body; a supply pad provided on an upper end of the supply arm; A supply pad elevating means for moving the supply pad up and down, a collection traveling body traveling along a collection conveyance path, and A collection arm, a collection pad provided below the tip of the collection arm and disposed below the supply pad, and a collection pad elevating means for vertically moving the collection pad. After the pre-aligned wafer is held by the supply pad, the supply pad is moved below the positioning portion, and the supply pad is raised to supply the wafer to be chamfered to the positioning portion, while the supply pad Is moved above the chuck table, the recovery pad is lowered to collect the chamfered wafer from the chuck table, and the recovery pad is moved toward the cleaning unit to clean the wafer. Wafer chamfering device, characterized in that it is transported to a wafer. 6. The supply arm according to claim 5, wherein the supply arm is pivotally provided on the supply traveling body, and pivots at a predetermined wafer receiving position to receive a pre-aligned wafer from the pre-alignment unit. Wafer chamfering equipment. 7. The wafer chamfering device supplies a wafer to be chamfered from a cassette, and collects the chamfered wafer into the cassette, and a wafer supply / collection unit to chamfer the wafer from the wafer supply / collection unit. Transporting the wafer to the pre-alignment unit, and a wafer supply / recovery / transport unit for transporting the chamfered wafer from the pre-alignment unit to the wafer supply / recovery unit. The wafer transferred from the wafer supply / recovery section to the pre-alignment section, and the wafer pre-aligned by the pre-alignment section is held by the supply pad and transferred to the positioning section, while the chamfered wafer is finished from the chuck table. The collection And transported to the cleaning unit, and transported to the pre-alignment unit while retaining the wafer cleaned in the cleaning unit by the supply pad, and transported the wafer transported to the pre-alignment unit to the wafer. 7. The wafer chamfering apparatus according to claim 1, wherein the wafer is collected by being conveyed to the wafer supply / collection unit by a supply / collection / conveyance unit. 8. The wafer chamfering device supplies a wafer to be chamfered from a cassette, and collects the chamfered wafer into the cassette; and a wafer supply / collection unit for chamfering the wafer from the wafer supply / collection unit. And a wafer supply / recovery / transport unit that transports the chamfered wafer to the wafer supply / recovery unit while transporting the wafer to the pre-alignment unit. From the chuck table to the pre-alignment unit, the wafer pre-aligned in the pre-alignment unit is held by the supply pad and conveyed to the positioning unit, while the chamfered wafer from the chuck table is processed by the collection pad. Hold to the cleaning section Transporting, holding the wafers cleaned by the cleaning unit with the supply pad, transporting the wafers to the wafer supply / recovery transport unit, and transporting the wafers to the wafer supply / recovery unit by the wafer supply / recovery transport unit to collect them. The wafer chamfering apparatus according to claim 2, 4 or 6, wherein: