JPH0344414B2 - - Google Patents

Info

Publication number
JPH0344414B2
JPH0344414B2 JP60087853A JP8785385A JPH0344414B2 JP H0344414 B2 JPH0344414 B2 JP H0344414B2 JP 60087853 A JP60087853 A JP 60087853A JP 8785385 A JP8785385 A JP 8785385A JP H0344414 B2 JPH0344414 B2 JP H0344414B2
Authority
JP
Japan
Prior art keywords
protrusion
heat sink
ceramic substrate
header
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60087853A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61247040A (ja
Inventor
Shigeo Iki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60087853A priority Critical patent/JPS61247040A/ja
Publication of JPS61247040A publication Critical patent/JPS61247040A/ja
Publication of JPH0344414B2 publication Critical patent/JPH0344414B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/037—
    • H10W72/072—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/241—
    • H10W72/251—
    • H10W90/737—

Landscapes

  • Wire Bonding (AREA)
JP60087853A 1985-04-24 1985-04-24 半導体装置の製造方法 Granted JPS61247040A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60087853A JPS61247040A (ja) 1985-04-24 1985-04-24 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60087853A JPS61247040A (ja) 1985-04-24 1985-04-24 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61247040A JPS61247040A (ja) 1986-11-04
JPH0344414B2 true JPH0344414B2 (index.php) 1991-07-05

Family

ID=13926442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60087853A Granted JPS61247040A (ja) 1985-04-24 1985-04-24 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61247040A (index.php)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH071773B2 (ja) * 1987-01-14 1995-01-11 株式会社日立製作所 電子部品の接続構造
JP2745786B2 (ja) * 1990-06-15 1998-04-28 松下電器産業株式会社 Ｔａｂ半導体装置
US8399912B2 (en) * 2010-02-16 2013-03-19 International Rectifier Corporation III-nitride power device with solderable front metal
JP6012990B2 (ja) * 2012-03-19 2016-10-25 日本軽金属株式会社 放熱器一体型基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56107342A (en) * 1980-01-31 1981-08-26 Sanyo Electric Co Ltd Reciprocating type cassette recorder
JPS5844731A (ja) * 1981-09-10 1983-03-15 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPS61247040A (ja) 1986-11-04

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