JPH0343766U - - Google Patents
Info
- Publication number
- JPH0343766U JPH0343766U JP10519389U JP10519389U JPH0343766U JP H0343766 U JPH0343766 U JP H0343766U JP 10519389 U JP10519389 U JP 10519389U JP 10519389 U JP10519389 U JP 10519389U JP H0343766 U JPH0343766 U JP H0343766U
- Authority
- JP
- Japan
- Prior art keywords
- land
- printed wiring
- wiring board
- flow direction
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000007796 conventional method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は第１の考案によるプリント配線基板の
一実施例を示す略線的平面図、第２図は第２の考
案によるプリント配線基板の一実施例を示す略線
的平面図、第３図はぼて盛りされた半田フイレツ
トの説明に供する略線的断面図、第４図は従来の
問題点の説明に供する略線的平面図である。
１，１０，２０……プリント配線基板、１１，
２１……基板、２，１３Ａ，１３Ｂ，２３Ａ，２
３Ｂ……チツプ部品、３，１４Ａ，１４Ｂ，２４
Ａ，２４Ｂ……電極接続用ランド、４……半田フ
イレツト、５，１２Ａ〜１２Ｄ，２２Ａ〜２２Ｃ
……信号線パターン、１５Ａ〜１５Ｄ，２５Ａ〜
２５Ｃ……半田付着部。
FIG. 1 is a schematic plan view showing an embodiment of the printed wiring board according to the first invention, FIG. 2 is a schematic plan view showing an embodiment of the printed wiring board according to the second invention, and FIG. The figure is a schematic cross-sectional view for explaining the solder fillet which has been raised in a pattern, and FIG. 4 is a schematic plan view for explaining the problems of the conventional technique. 1, 10, 20... printed wiring board, 11,
21...Substrate, 2, 13A, 13B, 23A, 2
3B...Chip parts, 3, 14A, 14B, 24
A, 24B... Land for electrode connection, 4... Solder fillet, 5, 12A to 12D, 22A to 22C
...Signal line pattern, 15A~15D, 25A~
25C...Solder attachment part.
Claims (1)
号線パターンを有するプリント配線基板において
、 上記電子部品接続用ランドに対して、フロー方
向の後方側の上記信号線パターン上に、上記フロ
ー方向からみて上記電子部品接続用ランドと完全
には重なり合わないような半田付着部 を具えることを特徴とするプリント配線基板。 (2) 基板の電子部品接続用ランドに近接して複
数の信号線パターンを有するプリント配線基板に
おいて、 上記電子部品接続用ランドに対して、フロー方
向の後方側の上記複数の信号線パターン上に、上
記フロー方向からみて半田盛り上がり部が互いに
重なり合わないような半田付着部 を具えることを特徴とするプリント配線基板。[Scope of Claim for Utility Model Registration] (1) In a printed wiring board having a signal line pattern close to a land for connecting electronic components on the board, the above-mentioned signal on the rear side in the flow direction with respect to the land for connecting electronic components A printed wiring board characterized in that a solder attachment portion is provided on the line pattern such that the solder attachment portion does not completely overlap the land for connecting the electronic component when viewed from the flow direction. (2) In a printed wiring board that has a plurality of signal line patterns close to a land for connecting electronic components on the board, on the plurality of signal line patterns on the rear side in the flow direction with respect to the land for connecting electronic components. . A printed wiring board comprising a solder attachment part such that the solder bulges do not overlap each other when viewed from the flow direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10519389U JPH0343766U (en) | 1989-09-06 | 1989-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10519389U JPH0343766U (en) | 1989-09-06 | 1989-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0343766U true JPH0343766U (en) | 1991-04-24 |
Family
ID=31653963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10519389U Pending JPH0343766U (en) | 1989-09-06 | 1989-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0343766U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006110266A (en) * | 2004-10-18 | 2006-04-27 | Isamu Kino | Cushion material and manufacturing method thereof |
-
1989
- 1989-09-06 JP JP10519389U patent/JPH0343766U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006110266A (en) * | 2004-10-18 | 2006-04-27 | Isamu Kino | Cushion material and manufacturing method thereof |
| JP4579641B2 (en) * | 2004-10-18 | 2010-11-10 | 勇 喜納 | Method for producing moon peach stem cushion material |
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