JPH0180970U - - Google Patents
Info
- Publication number
- JPH0180970U JPH0180970U JP1987177444U JP17744487U JPH0180970U JP H0180970 U JPH0180970 U JP H0180970U JP 1987177444 U JP1987177444 U JP 1987177444U JP 17744487 U JP17744487 U JP 17744487U JP H0180970 U JPH0180970 U JP H0180970U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- wiring board
- printed wiring
- hole
- hole land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す印刷配線板の
平面図、第２図は従来の一例を示す印刷配線板の
平面図である。
１……集積回路接続用パツト、２……スルーホ
ールランド、３……ライン、４……基準点。
FIG. 1 is a plan view of a printed wiring board showing an embodiment of the present invention, and FIG. 2 is a plan view of a printed wiring board showing a conventional example. 1... integrated circuit connection part, 2... through hole land, 3... line, 4... reference point.
Claims (1)
集積回路を搭載する印刷配線板において、集積回
路の外側に２．５４mm格子にのつたスルーホール
ランドを有し、このスルーホールランドと集積回
路接続用パツトを結ぶラインの幅が０．２５mmあ
り、これらの回路の最小間隙が０．３mmであり、
且つ前記スルーホールランド、パツト、ラインを
含む矩形の面積が１３．４cm2以下であることを
特徴とする印刷配線板。 In a printed wiring board mounted with an 80-pin surface-mount integrated circuit with a terminal pitch of 0.8 mm, there is a through-hole land arranged in a 2.54 mm grid on the outside of the integrated circuit, and this through-hole land is connected to the integrated circuit. The width of the line connecting the circuit parts is 0.25 mm, and the minimum gap between these circuits is 0.3 mm.
A printed wiring board characterized in that a rectangular area including the through-hole lands, pads, and lines is 13.4 cm 2 or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987177444U JPH0180970U (en) | 1987-11-20 | 1987-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987177444U JPH0180970U (en) | 1987-11-20 | 1987-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180970U true JPH0180970U (en) | 1989-05-30 |
Family
ID=31469108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987177444U Pending JPH0180970U (en) | 1987-11-20 | 1987-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180970U (en) |
-
1987
- 1987-11-20 JP JP1987177444U patent/JPH0180970U/ja active Pending
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