JPH0343720Y2 - - Google Patents
Info
- Publication number
- JPH0343720Y2 JPH0343720Y2 JP1987062844U JP6284487U JPH0343720Y2 JP H0343720 Y2 JPH0343720 Y2 JP H0343720Y2 JP 1987062844 U JP1987062844 U JP 1987062844U JP 6284487 U JP6284487 U JP 6284487U JP H0343720 Y2 JPH0343720 Y2 JP H0343720Y2
- Authority
- JP
- Japan
- Prior art keywords
- tab
- semiconductors
- resin
- lead
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987062844U JPH0343720Y2 (enExample) | 1987-04-24 | 1987-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987062844U JPH0343720Y2 (enExample) | 1987-04-24 | 1987-04-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63170955U JPS63170955U (enExample) | 1988-11-07 |
| JPH0343720Y2 true JPH0343720Y2 (enExample) | 1991-09-12 |
Family
ID=30897515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987062844U Expired JPH0343720Y2 (enExample) | 1987-04-24 | 1987-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0343720Y2 (enExample) |
-
1987
- 1987-04-24 JP JP1987062844U patent/JPH0343720Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63170955U (enExample) | 1988-11-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6353257B1 (en) | Semiconductor package configuration based on lead frame having recessed and shouldered portions for flash prevention | |
| US4751611A (en) | Semiconductor package structure | |
| KR960019676A (ko) | 수지 봉지형 반도체 장치 및 그 제조 방법 | |
| KR910019187A (ko) | 반도체 칩 패키징 | |
| KR20060079846A (ko) | 반도체 장치의 제조 방법 | |
| JP2517691B2 (ja) | 半導体装置及びその製造方法 | |
| JP3054311B2 (ja) | ホトインタラプタの構造 | |
| JPS6155946A (ja) | 半導体類のパツケ−ジ構造 | |
| JPH0233961A (ja) | リードフレーム | |
| JP2609894B2 (ja) | 被封止部品のトランスファ樹脂封止成形方法とこれに用いられる樹脂封止成形用金型装置及びフィルムキャリア | |
| JPS58194382A (ja) | 発光装置用電極構体 | |
| JPS63287041A (ja) | 半導体素子収納パッケ−ジの製造方法 | |
| JPH05129731A (ja) | モールド型半導体レーザ装置の製造方法 | |
| JP2604054B2 (ja) | 半導体装置の製造方法 | |
| JPH0723961Y2 (ja) | 半導体素子収納用パッケージ | |
| JPS6353006A (ja) | 成形装置 | |
| JP2003133484A (ja) | 半導体装置及びその製造方法 | |
| JPS61193460A (ja) | 樹脂封止型半導体装置の製造方法 | |
| JPS63211638A (ja) | 樹脂封止型半導体装置の製造方法 | |
| JPH0625965Y2 (ja) | ガラス封止形半導体素子収納用パッケージ | |
| JPH029158A (ja) | 半導体素子の樹脂封止成形方法及びこれに用いられる半導体リードフレーム | |
| JPH0650991Y2 (ja) | 半導体素子収納用パッケージ | |
| JPH0810953Y2 (ja) | 半導体装置 | |
| JPH0213461B2 (enExample) | ||
| JP2917556B2 (ja) | 絶縁物封止型電子部品の製造方法 |