JPH0343720Y2 - - Google Patents

Description

[Detailed description of the invention] <Industrial application field> This invention is a resin used for a cavity package that has a cavity for airtightly storing and holding integrated circuits (hereinafter referred to as semiconductors) such as diodes, transistors, or memories. Regarding containers.

<Prior art> Plastic packaging, which is currently the mainstream packaging method for semiconductors, involves placing a lead frame with semiconductors pre-installed between upper and lower molds, and injecting molten resin into cavities formed on both mold surfaces. It is manufactured using a method of injecting. However, with this method, the semiconductors come into direct contact with the molten resin during resin encapsulation and are exposed to high temperature and pressure, so in some cases the wires connecting the lead terminals and the electrodes of the semiconductors may break. .

In order to improve the drawbacks of such a molding method, a method is proposed in which a lead frame with semiconductors mounted thereon is sandwiched between two resin molded products that form a cavity inside (Japanese Unexamined Patent Publication No. 51-98969). , Special Publication No. 58-185) has been proposed.

<Problems to be solved by the invention> However, in such a method, the semiconductors are suspended in a closed space, so the heat emitted from the semiconductors during operation is poorly dissipated, and the semiconductors are Since the tab of the lead frame to be fixed is normally only supported by two tab hangers 9 as shown in Fig. 3, the wire connecting the electrode of the semiconductor and the lead terminal 7 may be broken due to vibration or the like. Another drawback is that the lead terminals adjacent to the tab hanger tend to come into contact with each other.

The present invention was devised in view of the above situation, and an object of the present invention is to provide a semiconductor package with excellent vibration resistance, heat dissipation performance, and reliability.

<Means for Solving the Problems> In other words, the present invention uses a thermoplastic resin plate-shaped molded container consisting of a pair of two containers each having a recess for accommodating semiconductors, and the tab surface is lower than the other lead surfaces. A resin container for a semiconductor package, which is made by sandwiching a lead frame on which a semiconductor is mounted and heat-fusion-bonding the two, characterized in that a recess of one container is provided with a protrusion capable of holding the tab suspension of the tab from both sides. .

The present invention will be described below with reference to drawings showing embodiments. FIGS. 1 and 2 show one of the plate-shaped molded containers according to the present invention,
A depression 2 for storing semiconductors is formed in the center, and one large projection 4 and four small projections 3 are formed in this depression. Such a plate-shaped molded container is manufactured by injection molding a thermoplastic resin such as polyphenylene oxide, sulfide resin, or polysulfone resin. As for the shape of the other flat molded container, in the case of ordinary semiconductors, it is sufficient to have only the depression 2.
In the case of a memory device such as an EPROM, a device with an ultraviolet-transparent glass window in the center is used. 5 is a resin reservoir into which a portion of the melted resin flows during coalescence.

3 and 4 show the shape of a typical lead frame used in the present invention, in which a tab 8 for fixing a semiconductor 10 is supported by a tab hanger 9. FIG.

The electrodes and leads of semiconductors on the tab are connected by thin gold wires, etc., but in order to keep the distance as short as possible, the tab surface is usually 0.2 to 0.2 to
It is set to be 0.5mm lower. (Figure 4).

The inner surface of the lead frame with semiconductors mounted in this way is heated and melted with hot air.
They are sandwiched between two plate-shaped molded containers and fused together.
The combined semiconductor package is then made into a product by cutting the outer frame of the lead frame and bending the leads outside the molded container.

FIGS. 5 and 6 show the internal state of the semiconductor package thus obtained, and the small protrusions 3 are arranged at positions where the tab hangers 9 can be held from both sides.

The shape of the small protrusion 3 is preferably a cylinder with a diameter of 1 to 3 mm, but a conical or prismatic protrusion may also be used. Further, the height of the small protrusion 3 is set to be equal to or slightly lower than the depth of the depression 2. The tab hanger 9 and the lead 7 adjacent to the tab hanger are usually welded to the small protrusion due to the heat generated when they are combined, but they may simply be in contact with each other.

The large protrusion 4 shown in FIGS. 1 and 2 is welded to the back surface of the tab 8 when assembled, and is provided to prevent the semiconductor from vibrating and to promote heat dissipation.

In a vibration test in which semiconductors were actually sealed using the molded container according to the present invention, there were no bonding wire breaks or lead shorts.

In contrast, when a molded container without small protrusions was used, approximately 20% of defects were observed.

<Effects of the invention> As is clear from the above explanation, the present invention has made it possible to create a cavity package for semiconductors with excellent vibration resistance.

[Brief explanation of drawings]

Fig. 1 is a plan view of a thermoplastic plate-shaped molded container according to the present invention, Fig. 2 is a sectional view taken along line A-A in Fig. 1, and Fig.
The figure is a plan view of the lead frame, FIG. 4 is a B-B end view of FIG. 3, FIG. FIG. 3 is an enlarged sectional view showing the positional relationship. Explanation of symbols, 1... Plate shaped molded container, 2... Hollow, 3... Small projection, 4... Large projection, 5... Resin reservoir, 6... Lead frame, 7... Lead, 8...
...Tab, 9...Tab hanging, 10...Semiconductor element, 1
1...Wire, 12...Window part.

Claims (1)

[Scope of utility model registration request] Using a thermoplastic resin plate-shaped molded container consisting of a set of two having a recess for storing semiconductors, the lead frame with the semiconductors attached is sandwiched between the tab surfaces with the tab surface lower than the other lead surfaces, and the two are heated and fused together. What is claimed is: 1. A resin container for a semiconductor package comprising a resin container for a semiconductor package, characterized in that a recess of one of the containers is provided with a protrusion capable of holding the tab suspension of the tab from both sides.