JPH0338659U - - Google Patents
Info
- Publication number
- JPH0338659U JPH0338659U JP9939689U JP9939689U JPH0338659U JP H0338659 U JPH0338659 U JP H0338659U JP 9939689 U JP9939689 U JP 9939689U JP 9939689 U JP9939689 U JP 9939689U JP H0338659 U JPH0338659 U JP H0338659U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- board
- lands
- protective film
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Description
第１図は本考案に係る一実施例のプリント配線
板の構成をスルーホールを中心に示す断面図、第
２図は従来のプリント配線板の構成をスルーホー
ルを中心に示す断面図である。
１１……基板、１２……スルーホール、１３…
…導体層、１４ａ，１４ｂ……ランド部、１５…
…ソルダーレジスト、１６……保護膜。
FIG. 1 is a sectional view showing the structure of a printed wiring board according to an embodiment of the present invention, centering on through holes, and FIG. 2 is a sectional view showing the structure of a conventional printed wiring board, centering on through holes. 11... Board, 12... Through hole, 13...
...Conductor layer, 14a, 14b...Land portion, 15...
...Solder resist, 16...Protective film.
Claims (1)
ールを設けるとともに、前記基板の両面に前記ス
ルーホールの開口部を囲つてランドを設け、前記
配線パターンを有する面の反対側に設けられたラ
ンドにプローバを当接して該配線パターンの検査
を行うプリント配線板において、 前記配線パターンを有する面側の前記スルーホ
ールの開口部を囲つて設けられたランド上に、シ
ルク印刷により保護膜を形成し、この保護膜を避
けて前記配線パターンを有する面にソルダーレジ
ストをコートしてなることを特徴とするプリント
配線板。[Claims for Utility Model Registration] A through hole is provided on a board having a wiring pattern on one side, and lands are provided on both sides of the board surrounding the openings of the through holes, and lands are provided on both sides of the board opposite to the side having the wiring pattern. In a printed wiring board in which a prober is brought into contact with a land provided on the wiring pattern to inspect the wiring pattern, the wiring pattern is inspected by silk printing on the land provided surrounding the opening of the through hole on the side having the wiring pattern. 1. A printed wiring board characterized by forming a protective film and coating a surface having the wiring pattern with a solder resist avoiding the protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9939689U JPH0338659U (en) | 1989-08-24 | 1989-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9939689U JPH0338659U (en) | 1989-08-24 | 1989-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338659U true JPH0338659U (en) | 1991-04-15 |
Family
ID=31648453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9939689U Pending JPH0338659U (en) | 1989-08-24 | 1989-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338659U (en) |
-
1989
- 1989-08-24 JP JP9939689U patent/JPH0338659U/ja active Pending