JPS6289185U - - Google Patents
Info
- Publication number
- JPS6289185U JPS6289185U JP18121785U JP18121785U JPS6289185U JP S6289185 U JPS6289185 U JP S6289185U JP 18121785 U JP18121785 U JP 18121785U JP 18121785 U JP18121785 U JP 18121785U JP S6289185 U JPS6289185 U JP S6289185U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- wiring board
- multilayer wiring
- circuit pattern
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- 239000011889 copper foil Substances 0.000 claims 4
- 238000007747 plating Methods 0.000 claims 3
- 238000005259 measurement Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Description
図面は本考案の多層配線基板の一実施例を示す
上面説明図である。
１……基板、２……外層導体、３……欠除部、
４……貫通孔。
The drawing is an explanatory top view showing one embodiment of the multilayer wiring board of the present invention. 1... Board, 2... Outer layer conductor, 3... Deleted part,
4...Through hole.
Claims (1)
された回路パターンを有し、かつ表面の前記回路
パターン上に形成されためつき層のめつき厚の測
定部位の直下にあたる内層銅箔の非回路部に、そ
れぞれ適当な大きさの銅箔の欠除された部分を設
けてなる多層配線基板において、前記内層銅箔の
欠除部直上の外層導体のめつき厚測定部位に複数
個の標識を設けて成ることを特徴とする多層配線
基板。 (2) 標識が、基板の表面から裏面に貫通する孔
である実用新案登録請求の範囲第１項記載の多層
配線基板。[Claims for Utility Model Registration] (1) Having a circuit pattern formed of copper foil on the inside and on the surface, and immediately below the part where the plating thickness of the plating layer formed on the circuit pattern on the surface is to be measured. Measurement of the plating thickness of the outer layer conductor directly above the cutout portion of the inner layer copper foil in a multilayer wiring board in which a cutout portion of copper foil of an appropriate size is provided in each non-circuit portion of the inner layer copper foil. A multilayer wiring board characterized in that a plurality of signs are provided at a portion. (2) The multilayer wiring board according to claim 1, wherein the mark is a hole penetrating from the front surface to the back surface of the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18121785U JPS6289185U (en) | 1985-11-25 | 1985-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18121785U JPS6289185U (en) | 1985-11-25 | 1985-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6289185U true JPS6289185U (en) | 1987-06-08 |
Family
ID=31125883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18121785U Pending JPS6289185U (en) | 1985-11-25 | 1985-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289185U (en) |
-
1985
- 1985-11-25 JP JP18121785U patent/JPS6289185U/ja active Pending