JPH0337857B2 - - Google Patents

Info

Publication number
JPH0337857B2
JPH0337857B2 JP27570586A JP27570586A JPH0337857B2 JP H0337857 B2 JPH0337857 B2 JP H0337857B2 JP 27570586 A JP27570586 A JP 27570586A JP 27570586 A JP27570586 A JP 27570586A JP H0337857 B2 JPH0337857 B2 JP H0337857B2
Authority
JP
Japan
Prior art keywords
layer
substrate
insulating resin
resin layer
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP27570586A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63128730A (ja
Inventor
Koichiro Kotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP27570586A priority Critical patent/JPS63128730A/ja
Publication of JPS63128730A publication Critical patent/JPS63128730A/ja
Publication of JPH0337857B2 publication Critical patent/JPH0337857B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP27570586A 1986-11-19 1986-11-19 多層配線方法 Granted JPS63128730A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27570586A JPS63128730A (ja) 1986-11-19 1986-11-19 多層配線方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27570586A JPS63128730A (ja) 1986-11-19 1986-11-19 多層配線方法

Publications (2)

Publication Number Publication Date
JPS63128730A JPS63128730A (ja) 1988-06-01
JPH0337857B2 true JPH0337857B2 (enrdf_load_stackoverflow) 1991-06-06

Family

ID=17559216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27570586A Granted JPS63128730A (ja) 1986-11-19 1986-11-19 多層配線方法

Country Status (1)

Country Link
JP (1) JPS63128730A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5990005A (en) * 1997-02-10 1999-11-23 Nec Corporation Method of burying a contact hole with a metal for forming multilevel interconnections
JP4173307B2 (ja) * 1999-06-24 2008-10-29 株式会社ルネサステクノロジ 半導体集積回路の製造方法

Also Published As

Publication number Publication date
JPS63128730A (ja) 1988-06-01

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