JPS63128730A - 多層配線方法 - Google Patents

多層配線方法

Info

Publication number
JPS63128730A
JPS63128730A JP27570586A JP27570586A JPS63128730A JP S63128730 A JPS63128730 A JP S63128730A JP 27570586 A JP27570586 A JP 27570586A JP 27570586 A JP27570586 A JP 27570586A JP S63128730 A JPS63128730 A JP S63128730A
Authority
JP
Japan
Prior art keywords
layer
substrate
insulating
wiring
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27570586A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0337857B2 (enrdf_load_stackoverflow
Inventor
Koichiro Kotani
小谷　紘一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP27570586A priority Critical patent/JPS63128730A/ja
Publication of JPS63128730A publication Critical patent/JPS63128730A/ja
Publication of JPH0337857B2 publication Critical patent/JPH0337857B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP27570586A 1986-11-19 1986-11-19 多層配線方法 Granted JPS63128730A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27570586A JPS63128730A (ja) 1986-11-19 1986-11-19 多層配線方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27570586A JPS63128730A (ja) 1986-11-19 1986-11-19 多層配線方法

Publications (2)

Publication Number Publication Date
JPS63128730A true JPS63128730A (ja) 1988-06-01
JPH0337857B2 JPH0337857B2 (enrdf_load_stackoverflow) 1991-06-06

Family

ID=17559216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27570586A Granted JPS63128730A (ja) 1986-11-19 1986-11-19 多層配線方法

Country Status (1)

Country Link
JP (1) JPS63128730A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5990005A (en) * 1997-02-10 1999-11-23 Nec Corporation Method of burying a contact hole with a metal for forming multilevel interconnections
JP2010062587A (ja) * 1999-06-24 2010-03-18 Renesas Technology Corp 半導体集積回路装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5990005A (en) * 1997-02-10 1999-11-23 Nec Corporation Method of burying a contact hole with a metal for forming multilevel interconnections
JP2010062587A (ja) * 1999-06-24 2010-03-18 Renesas Technology Corp 半導体集積回路装置の製造方法

Also Published As

Publication number Publication date
JPH0337857B2 (enrdf_load_stackoverflow) 1991-06-06

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