JPH0336302B2 - - Google Patents

Info

Publication number
JPH0336302B2
JPH0336302B2 JP56198934A JP19893481A JPH0336302B2 JP H0336302 B2 JPH0336302 B2 JP H0336302B2 JP 56198934 A JP56198934 A JP 56198934A JP 19893481 A JP19893481 A JP 19893481A JP H0336302 B2 JPH0336302 B2 JP H0336302B2
Authority
JP
Japan
Prior art keywords
oxide film
silicon nitride
silicon
nitride film
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56198934A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5898944A (ja
Inventor
Kenji Kawakita
Hiroyuki Sakai
Tsutomu Fujita
Toyoki Takemoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56198934A priority Critical patent/JPS5898944A/ja
Publication of JPS5898944A publication Critical patent/JPS5898944A/ja
Priority to US06/660,255 priority patent/US4563227A/en
Publication of JPH0336302B2 publication Critical patent/JPH0336302B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/014—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
    • H10W10/0145—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations of trenches having shapes other than rectangular or V-shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/17—Isolation regions comprising dielectric materials formed using trench refilling with dielectric materials, e.g. shallow trench isolations

Landscapes

  • Element Separation (AREA)
  • Local Oxidation Of Silicon (AREA)
JP56198934A 1981-12-08 1981-12-08 半導体装置の製造方法 Granted JPS5898944A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP56198934A JPS5898944A (ja) 1981-12-08 1981-12-08 半導体装置の製造方法
US06/660,255 US4563227A (en) 1981-12-08 1984-10-12 Method for manufacturing a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56198934A JPS5898944A (ja) 1981-12-08 1981-12-08 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5898944A JPS5898944A (ja) 1983-06-13
JPH0336302B2 true JPH0336302B2 (enFirst) 1991-05-31

Family

ID=16399393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56198934A Granted JPS5898944A (ja) 1981-12-08 1981-12-08 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5898944A (enFirst)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4580330A (en) * 1984-06-15 1986-04-08 Texas Instruments Incorporated Integrated circuit isolation
US4561172A (en) * 1984-06-15 1985-12-31 Texas Instruments Incorporated Integrated circuit fabrication method utilizing selective etching and oxidation to form isolation regions
US4538343A (en) * 1984-06-15 1985-09-03 Texas Instruments Incorporated Channel stop isolation technology utilizing two-step etching and selective oxidation with sidewall masking
JPS6148934A (ja) * 1984-08-16 1986-03-10 Matsushita Electronics Corp 半導体装置の製造方法
US5182227A (en) * 1986-04-25 1993-01-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method for manufacturing the same
BE1007588A3 (nl) * 1993-09-23 1995-08-16 Philips Electronics Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting met een halfgeleiderlichaam met veldisolatiegebieden gevormd door met isolerend materiaal gevulde groeven.

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53120289A (en) * 1977-03-30 1978-10-20 Toshiba Corp Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS5898944A (ja) 1983-06-13

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