JPH0330986B2 - - Google Patents

Info

Publication number
JPH0330986B2
JPH0330986B2 JP58178164A JP17816483A JPH0330986B2 JP H0330986 B2 JPH0330986 B2 JP H0330986B2 JP 58178164 A JP58178164 A JP 58178164A JP 17816483 A JP17816483 A JP 17816483A JP H0330986 B2 JPH0330986 B2 JP H0330986B2
Authority
JP
Japan
Prior art keywords
bonding pad
insulating film
layer
forming
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58178164A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6072253A (ja
Inventor
Yasushi Matsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP17816483A priority Critical patent/JPS6072253A/ja
Publication of JPS6072253A publication Critical patent/JPS6072253A/ja
Publication of JPH0330986B2 publication Critical patent/JPH0330986B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05005—Structure
    • H01L2224/05009—Bonding area integrally formed with a via connection of the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H01L2224/05558—Shape in side view conformal layer on a patterned surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
JP17816483A 1983-09-28 1983-09-28 半導体装置の製造方法 Granted JPS6072253A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17816483A JPS6072253A (ja) 1983-09-28 1983-09-28 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17816483A JPS6072253A (ja) 1983-09-28 1983-09-28 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6072253A JPS6072253A (ja) 1985-04-24
JPH0330986B2 true JPH0330986B2 (en, 2012) 1991-05-01

Family

ID=16043736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17816483A Granted JPS6072253A (ja) 1983-09-28 1983-09-28 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6072253A (en, 2012)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6362337A (ja) * 1986-09-03 1988-03-18 Nec Corp 半導体装置
DE19824400C2 (de) * 1998-05-30 2000-05-18 Bosch Gmbh Robert Leiterbahn-Kontaktierungsanordnung
JP3169907B2 (ja) 1998-09-25 2001-05-28 日本電気株式会社 多層配線構造およびその製造方法
JP5855361B2 (ja) * 2011-05-31 2016-02-09 三菱電機株式会社 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619639A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Semiconductor device
JPS57207354A (en) * 1981-06-15 1982-12-20 Toshiba Corp Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS6072253A (ja) 1985-04-24

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