JPH0325014B2 - - Google Patents
Info
- Publication number
- JPH0325014B2 JPH0325014B2 JP24777284A JP24777284A JPH0325014B2 JP H0325014 B2 JPH0325014 B2 JP H0325014B2 JP 24777284 A JP24777284 A JP 24777284A JP 24777284 A JP24777284 A JP 24777284A JP H0325014 B2 JPH0325014 B2 JP H0325014B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- frames
- moving stage
- loading frame
- loading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000009434 installation Methods 0.000 claims description 7
- 230000007246 mechanism Effects 0.000 claims description 6
- 230000032258 transport Effects 0.000 description 12
- 210000000078 claw Anatomy 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Warehouses Or Storage Devices (AREA)
- Specific Conveyance Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24777284A JPS61127134A (ja) | 1984-11-22 | 1984-11-22 | Icフレ−ムの搬送整列装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24777284A JPS61127134A (ja) | 1984-11-22 | 1984-11-22 | Icフレ−ムの搬送整列装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61127134A JPS61127134A (ja) | 1986-06-14 |
JPH0325014B2 true JPH0325014B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-04-04 |
Family
ID=17168420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24777284A Granted JPS61127134A (ja) | 1984-11-22 | 1984-11-22 | Icフレ−ムの搬送整列装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61127134A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4903084B2 (ja) * | 2007-05-22 | 2012-03-21 | トッパン・フォームズ株式会社 | 紙捌き装置 |
-
1984
- 1984-11-22 JP JP24777284A patent/JPS61127134A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61127134A (ja) | 1986-06-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |