JPH0318343B2 - - Google Patents
Info
- Publication number
- JPH0318343B2 JPH0318343B2 JP56215586A JP21558681A JPH0318343B2 JP H0318343 B2 JPH0318343 B2 JP H0318343B2 JP 56215586 A JP56215586 A JP 56215586A JP 21558681 A JP21558681 A JP 21558681A JP H0318343 B2 JPH0318343 B2 JP H0318343B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- wafer
- chips
- adhesive
- stand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56215586A JPS58115833A (ja) | 1981-12-28 | 1981-12-28 | ウエ−ハの分割方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56215586A JPS58115833A (ja) | 1981-12-28 | 1981-12-28 | ウエ−ハの分割方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58115833A JPS58115833A (ja) | 1983-07-09 |
| JPH0318343B2 true JPH0318343B2 (enExample) | 1991-03-12 |
Family
ID=16674880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56215586A Granted JPS58115833A (ja) | 1981-12-28 | 1981-12-28 | ウエ−ハの分割方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58115833A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4388640B2 (ja) * | 1999-09-10 | 2009-12-24 | 株式会社ディスコ | Csp基板保持部材及び該csp基板保持部材が載置されるcsp基板用テーブル |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5552233A (en) * | 1978-10-13 | 1980-04-16 | Toshiba Corp | Masking sheet |
| JPS5599741A (en) * | 1979-01-26 | 1980-07-30 | Hitachi Ltd | Affixing method of article onto adhesive tape |
-
1981
- 1981-12-28 JP JP56215586A patent/JPS58115833A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58115833A (ja) | 1983-07-09 |
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