JPS58115833A - ウエ−ハの分割方法 - Google Patents

ウエ−ハの分割方法

Info

Publication number
JPS58115833A
JPS58115833A JP56215586A JP21558681A JPS58115833A JP S58115833 A JPS58115833 A JP S58115833A JP 56215586 A JP56215586 A JP 56215586A JP 21558681 A JP21558681 A JP 21558681A JP S58115833 A JPS58115833 A JP S58115833A
Authority
JP
Japan
Prior art keywords
film
wafer
bonded
adhesive
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56215586A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0318343B2 (enExample
Inventor
Masayuki Tatewaki
館脇　政行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP56215586A priority Critical patent/JPS58115833A/ja
Publication of JPS58115833A publication Critical patent/JPS58115833A/ja
Publication of JPH0318343B2 publication Critical patent/JPH0318343B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
JP56215586A 1981-12-28 1981-12-28 ウエ−ハの分割方法 Granted JPS58115833A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56215586A JPS58115833A (ja) 1981-12-28 1981-12-28 ウエ−ハの分割方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56215586A JPS58115833A (ja) 1981-12-28 1981-12-28 ウエ−ハの分割方法

Publications (2)

Publication Number Publication Date
JPS58115833A true JPS58115833A (ja) 1983-07-09
JPH0318343B2 JPH0318343B2 (enExample) 1991-03-12

Family

ID=16674880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56215586A Granted JPS58115833A (ja) 1981-12-28 1981-12-28 ウエ−ハの分割方法

Country Status (1)

Country Link
JP (1) JPS58115833A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085449A (ja) * 1999-09-10 2001-03-30 Disco Abrasive Syst Ltd Ｃｓｐ基板保持部材及び該ｃｓｐ基板保持部材が載置されるｃｓｐ基板用テーブル

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552233A (en) * 1978-10-13 1980-04-16 Toshiba Corp Masking sheet
JPS5599741A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Affixing method of article onto adhesive tape

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552233A (en) * 1978-10-13 1980-04-16 Toshiba Corp Masking sheet
JPS5599741A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Affixing method of article onto adhesive tape

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085449A (ja) * 1999-09-10 2001-03-30 Disco Abrasive Syst Ltd Ｃｓｐ基板保持部材及び該ｃｓｐ基板保持部材が載置されるｃｓｐ基板用テーブル

Also Published As

Publication number Publication date
JPH0318343B2 (enExample) 1991-03-12

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