JPS58115833A - ウエ−ハの分割方法 - Google Patents

ウエ−ハの分割方法

Info

Publication number
JPS58115833A
JPS58115833A JP56215586A JP21558681A JPS58115833A JP S58115833 A JPS58115833 A JP S58115833A JP 56215586 A JP56215586 A JP 56215586A JP 21558681 A JP21558681 A JP 21558681A JP S58115833 A JPS58115833 A JP S58115833A
Authority
JP
Japan
Prior art keywords
film
wafer
bonded
adhesive
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56215586A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0318343B2 (enExample
Inventor
Masayuki Tatewaki
館脇　政行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP56215586A priority Critical patent/JPS58115833A/ja
Publication of JPS58115833A publication Critical patent/JPS58115833A/ja
Publication of JPH0318343B2 publication Critical patent/JPH0318343B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P50/00—

Landscapes

  • Dicing (AREA)
JP56215586A 1981-12-28 1981-12-28 ウエ−ハの分割方法 Granted JPS58115833A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56215586A JPS58115833A (ja) 1981-12-28 1981-12-28 ウエ−ハの分割方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56215586A JPS58115833A (ja) 1981-12-28 1981-12-28 ウエ−ハの分割方法

Publications (2)

Publication Number Publication Date
JPS58115833A true JPS58115833A (ja) 1983-07-09
JPH0318343B2 JPH0318343B2 (enExample) 1991-03-12

Family

ID=16674880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56215586A Granted JPS58115833A (ja) 1981-12-28 1981-12-28 ウエ−ハの分割方法

Country Status (1)

Country Link
JP (1) JPS58115833A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085449A (ja) * 1999-09-10 2001-03-30 Disco Abrasive Syst Ltd Ｃｓｐ基板保持部材及び該ｃｓｐ基板保持部材が載置されるｃｓｐ基板用テーブル

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552233A (en) * 1978-10-13 1980-04-16 Toshiba Corp Masking sheet
JPS5599741A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Affixing method of article onto adhesive tape

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552233A (en) * 1978-10-13 1980-04-16 Toshiba Corp Masking sheet
JPS5599741A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Affixing method of article onto adhesive tape

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085449A (ja) * 1999-09-10 2001-03-30 Disco Abrasive Syst Ltd Ｃｓｐ基板保持部材及び該ｃｓｐ基板保持部材が載置されるｃｓｐ基板用テーブル

Also Published As

Publication number Publication date
JPH0318343B2 (enExample) 1991-03-12

Similar Documents

Publication Publication Date Title
CN101379590B (zh) 用于单切晶片的支撑装置
TWI645466B (zh) 半導體晶粒之分割方法及裝置
CN101026126A (zh) 半导体芯片制造方法
JP4109823B2 (ja) 半導体装置の製造方法
KR101819162B1 (ko) 캐리어 웨이퍼와 접착필름을 부착하는 진공 라미네이터 및 그 작동방법
JP2013034027A (ja) 半導体装置製造用積層シート
KR100759687B1 (ko) 기판의 박판화 방법 및 회로소자의 제조방법
JP4767122B2 (ja) テープの貼り替え方法及び該テープの貼り替え方法を使用した基板の分割方法
JPH0725463B2 (ja) 半導体装置の製造方法
CN1296978C (zh) 半导体器件的制造方法及半导体制造装置
JPH09181150A (ja) 半導体チップのピックアップ装置及びこれを用いたピックアップ方法
JPS58115833A (ja) ウエ−ハの分割方法
JP2014013807A (ja) ウエーハの加工方法
TW200425232A (en) Semiconductor device fabrication method
KR20060123462A (ko) 웨이퍼의 전사방법
JP2009090429A (ja) マイクロマシンデバイスの加工方法
US8580070B2 (en) Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer
JP4134774B2 (ja) 電子部品供給方法
JPH11274110A (ja) 半導体ウェーハの切断方法及び切断装置
KR200363934Y1 (ko) 다이 본더의 백업 홀더 구조
JP2020092257A (ja) 基板アダプタの製造方法および電子部品に接続するための基板アダプタ
JP7713313B2 (ja) ウェーハの加工方法
US6867111B2 (en) Method of manufacturing modules with an integrated circuit
JP2008085354A (ja) 半導体製造装置
JP2004288689A (ja) 電子部品製造方法および電子部品の集合体の製造方法