JPH0317369B2 - - Google Patents
Info
- Publication number
- JPH0317369B2 JPH0317369B2 JP8136987A JP8136987A JPH0317369B2 JP H0317369 B2 JPH0317369 B2 JP H0317369B2 JP 8136987 A JP8136987 A JP 8136987A JP 8136987 A JP8136987 A JP 8136987A JP H0317369 B2 JPH0317369 B2 JP H0317369B2
- Authority
- JP
- Japan
- Prior art keywords
- doping
- mask
- membrane
- boron
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000001459 lithography Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 description 51
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 48
- 229910052710 silicon Inorganic materials 0.000 description 47
- 239000010703 silicon Substances 0.000 description 47
- 229910052796 boron Inorganic materials 0.000 description 44
- 239000010410 layer Substances 0.000 description 40
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 39
- 235000012431 wafers Nutrition 0.000 description 38
- 239000000463 material Substances 0.000 description 26
- 150000002500 ions Chemical class 0.000 description 15
- 238000009792 diffusion process Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 229910052732 germanium Inorganic materials 0.000 description 10
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000005452 bending Methods 0.000 description 9
- 238000005530 etching Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 238000009826 distribution Methods 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
- 238000010884 ion-beam technique Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 238000001015 X-ray lithography Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008030 elimination Effects 0.000 description 3
- 238000003379 elimination reaction Methods 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000000609 electron-beam lithography Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 150000001638 boron Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- -1 germanium Chemical compound 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002371 helium Chemical class 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002164 ion-beam lithography Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/167—X-ray
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Electron Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP86106188.5 | 1986-05-06 | ||
| EP86106188A EP0244496B1 (de) | 1986-05-06 | 1986-05-06 | Maske für die Ionen-, Elektronen- oder Röntgenstrahllithographie und Verfahren zur ihrer Herstellung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62263636A JPS62263636A (ja) | 1987-11-16 |
| JPH0317369B2 true JPH0317369B2 (enrdf_load_stackoverflow) | 1991-03-07 |
Family
ID=8195111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62081369A Granted JPS62263636A (ja) | 1986-05-06 | 1987-04-03 | リソグラフイ用マスク |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4855197A (enrdf_load_stackoverflow) |
| EP (1) | EP0244496B1 (enrdf_load_stackoverflow) |
| JP (1) | JPS62263636A (enrdf_load_stackoverflow) |
| DE (1) | DE3677005D1 (enrdf_load_stackoverflow) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG43949A1 (en) * | 1987-09-30 | 1997-11-14 | Canon Kk | X-ray mask support and process for preparation thereof |
| DE3733311A1 (de) * | 1987-10-02 | 1989-04-13 | Philips Patentverwaltung | Verfahren zur herstellung eines maskentraegers aus sic fuer roentgenstrahllithographie-masken |
| JPH076663B2 (ja) * | 1988-01-11 | 1995-01-30 | ダイキン工業株式会社 | 空気調和装置 |
| US4827138A (en) * | 1988-02-26 | 1989-05-02 | Texas Instruments Incorporated | Filled grid mask |
| US5082695A (en) * | 1988-03-08 | 1992-01-21 | 501 Fujitsu Limited | Method of fabricating an x-ray exposure mask |
| US5049460A (en) * | 1988-05-31 | 1991-09-17 | Siemens Aktiengesellschaft | Method for producing beam-shaping diaphragms for lithographic devices |
| JP2725319B2 (ja) * | 1988-11-07 | 1998-03-11 | 富士通株式会社 | 荷電粒子線マスクの製造方法 |
| US5234781A (en) * | 1988-11-07 | 1993-08-10 | Fujitsu Limited | Mask for lithographic patterning and a method of manufacturing the same |
| DE3841352A1 (de) * | 1988-12-08 | 1990-06-21 | Philips Patentverwaltung | Verfahren zur herstellung eines maskentraegers aus sic fuer strahlungslithographie-masken |
| JP2796552B2 (ja) * | 1988-12-12 | 1998-09-10 | 日本電信電話株式会社 | Ｘ線リソグラフィー用マスク |
| JPH02183532A (ja) * | 1989-01-09 | 1990-07-18 | Fujitsu Ltd | 半導体微細装置の加工方法 |
| US5552247A (en) * | 1991-04-01 | 1996-09-03 | Motorola | Method for patterning an X-ray master mask |
| JPH0567561A (ja) * | 1991-09-10 | 1993-03-19 | Canon Inc | Ｘ線マスク基板とその製造方法およびｘ線マスク |
| US5273829A (en) * | 1991-10-08 | 1993-12-28 | International Business Machines Corporation | Epitaxial silicon membranes |
| US5401932A (en) * | 1992-02-07 | 1995-03-28 | Matsushita Electric Industrial Co., Ltd. | Method of producing a stencil mask |
| US5572562A (en) * | 1993-04-30 | 1996-11-05 | Lsi Logic Corporation | Image mask substrate for X-ray semiconductor lithography |
| US5512395A (en) * | 1993-04-30 | 1996-04-30 | Lsi Logic Corporation | Image masks for semiconductor lithography |
| US5529862A (en) * | 1993-09-01 | 1996-06-25 | Texas Instruments Incorporated | Method of forming a low distortion stencil mask |
| US5674413A (en) * | 1993-12-23 | 1997-10-07 | International Business Machines Corporation | Scattering reticle for electron beam systems |
| JP2606127B2 (ja) * | 1994-04-22 | 1997-04-30 | 日本電気株式会社 | 電子線による描画方法および描画装置 |
| JP2606138B2 (ja) * | 1994-06-02 | 1997-04-30 | 日本電気株式会社 | 電子ビーム描画装置用アパチャ |
| JP2792453B2 (ja) * | 1995-01-13 | 1998-09-03 | 日本電気株式会社 | アパーチャ及びその製造方法 |
| US5876880A (en) * | 1995-05-30 | 1999-03-02 | Ims Ionen Mikrofabrikations Systeme Gellschaft M.B.H. | Process for producing a structured mask |
| JP2785788B2 (ja) * | 1996-01-19 | 1998-08-13 | 日本電気株式会社 | 一括マスク搭載ホルダ構造 |
| US5786114A (en) * | 1997-01-10 | 1998-07-28 | Kabushiki Kaisha Toshiba | Attenuated phase shift mask with halftone boundary regions |
| JP3301333B2 (ja) * | 1997-01-30 | 2002-07-15 | 三菱電機株式会社 | Ｘ線マスクの成膜方法およびｘ線マスクの成膜装置 |
| US6051344A (en) * | 1997-06-17 | 2000-04-18 | Intel Corporation | Multiple reduction photolithography technique |
| JP3168952B2 (ja) * | 1997-09-03 | 2001-05-21 | 日本電気株式会社 | 電子ビーム描画用アパーチャ装置とその製造方法 |
| DE59904533D1 (de) | 1998-03-25 | 2003-04-17 | Stuttgart Mikroelektronik | Verfahren zur herstellung grossflächiger membranmasken |
| US6124063A (en) * | 1998-07-30 | 2000-09-26 | Motorola, Inc. | Method of forming a semiconductor device utilizing lithographic mask and mask therefor |
| AU2409500A (en) * | 1999-01-07 | 2000-07-24 | Timothy J. Provencher | Apparatus and method for applying flux to a substrate |
| US7118657B2 (en) * | 1999-06-22 | 2006-10-10 | President And Fellows Of Harvard College | Pulsed ion beam control of solid state features |
| US6783643B2 (en) * | 1999-06-22 | 2004-08-31 | President And Fellows Of Harvard College | Control of solid state dimensional features |
| US7258838B2 (en) | 1999-06-22 | 2007-08-21 | President And Fellows Of Harvard College | Solid state molecular probe device |
| US7582490B2 (en) * | 1999-06-22 | 2009-09-01 | President And Fellows Of Harvard College | Controlled fabrication of gaps in electrically conducting structures |
| US6464842B1 (en) | 1999-06-22 | 2002-10-15 | President And Fellows Of Harvard College | Control of solid state dimensional features |
| JP2001100395A (ja) | 1999-09-30 | 2001-04-13 | Toshiba Corp | 露光用マスク及びその製造方法 |
| US20040104454A1 (en) * | 2002-10-10 | 2004-06-03 | Rohm Co., Ltd. | Semiconductor device and method of producing the same |
| JP4346063B2 (ja) * | 2002-12-03 | 2009-10-14 | 大日本印刷株式会社 | 転写マスクブランク、転写マスク並びにその転写マスクを用いた転写方法 |
| JP2004273794A (ja) * | 2003-03-10 | 2004-09-30 | Mitsubishi Electric Corp | Ｘ線マスクの製造方法およびそれにより製造されたｘ線マスクを用いた半導体装置の製造方法 |
| US20040197939A1 (en) * | 2003-03-18 | 2004-10-07 | Clark Corey M. | Method and apparatus for sub-micron device fabrication |
| ITTO20030473A1 (it) * | 2003-06-23 | 2004-12-24 | Infm Istituto Naz Per La Fisi Ca Della Mater | Procedimento litografico di nanoimpressione che prevede l'utilizzo di uno stampo presentante una regione atta a |
| US7468271B2 (en) * | 2005-04-06 | 2008-12-23 | President And Fellows Of Harvard College | Molecular characterization with carbon nanotube control |
| GB201202128D0 (en) * | 2012-02-08 | 2012-03-21 | Univ Leeds | Novel material |
| DE102013213842A1 (de) * | 2013-07-16 | 2015-01-22 | Carl Zeiss Smt Gmbh | Optisches Bauelement |
| US9425063B2 (en) | 2014-06-19 | 2016-08-23 | Infineon Technologies Ag | Method of reducing an impurity concentration in a semiconductor body, method of manufacturing a semiconductor device and semiconductor device |
| CN118500309B (zh) * | 2024-07-16 | 2024-10-18 | 华硼中子科技(杭州)有限公司 | 中子源靶体的抗氢脆层目标厚度获取方法、终端及介质 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3742230A (en) * | 1972-06-29 | 1973-06-26 | Massachusetts Inst Technology | Soft x-ray mask support substrate |
| JPS5393785A (en) * | 1977-01-27 | 1978-08-17 | Nec Corp | Transfer mask for x-ray exposure and its production |
| DE2922416A1 (de) * | 1979-06-01 | 1980-12-11 | Ibm Deutschland | Schattenwurfmaske zum strukturieren von oberflaechenbereichen und verfahren zu ihrer herstellung |
| JPS5616136A (en) * | 1979-07-17 | 1981-02-16 | Mitsubishi Electric Corp | Production of transfer mask for x-ray |
| JPS5622433A (en) * | 1979-08-02 | 1981-03-03 | Nippon Telegr & Teleph Corp <Ntt> | Fabrication of polymer mask substrate for x-ray exposure |
| EP0048291B1 (de) * | 1980-09-19 | 1985-07-03 | Ibm Deutschland Gmbh | Struktur mit einem eine durchgehende Öffnung aufweisenden Siliciumkörper und Verfahren zu ihrer Herstellung |
| DE3119682A1 (de) * | 1981-05-18 | 1982-12-02 | Philips Patentverwaltung Gmbh, 2000 Hamburg | "verfahren zur herstellung einer maske fuer die mustererzeugung in lackschichten mittels strahlungslithographie" |
| JPS57211732A (en) * | 1981-06-24 | 1982-12-25 | Toshiba Corp | X ray exposing mask and manufacture thereof |
| EP0078336B1 (de) * | 1981-10-30 | 1988-02-03 | Ibm Deutschland Gmbh | Schattenwurfmaske für die Ionenimplantation und die Ionenstrahllithographie |
| EP0098318B1 (de) * | 1982-07-03 | 1987-02-11 | Ibm Deutschland Gmbh | Verfahren zum Herstellen von Gräben mit im wesentlichen vertikalen Seitenwänden in Silicium durch reaktives Ionenätzen |
| US4640844A (en) * | 1984-03-22 | 1987-02-03 | Siemens Aktiengesellschaft | Method for the manufacture of gate electrodes formed of double layers of metal silicides having a high melting point and doped polycrystalline silicon |
| DE3425063A1 (de) * | 1984-07-07 | 1986-02-06 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Maske fuer die roentgenlithographie |
-
1986
- 1986-05-06 DE DE8686106188T patent/DE3677005D1/de not_active Expired - Lifetime
- 1986-05-06 EP EP86106188A patent/EP0244496B1/de not_active Expired - Lifetime
-
1987
- 1987-04-03 JP JP62081369A patent/JPS62263636A/ja active Granted
- 1987-05-01 US US07/044,929 patent/US4855197A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0244496B1 (de) | 1991-01-16 |
| EP0244496A1 (de) | 1987-11-11 |
| JPS62263636A (ja) | 1987-11-16 |
| US4855197A (en) | 1989-08-08 |
| DE3677005D1 (de) | 1991-02-21 |
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