AU2409500A - Apparatus and method for applying flux to a substrate - Google Patents

Apparatus and method for applying flux to a substrate

Info

Publication number
AU2409500A
AU2409500A AU24095/00A AU2409500A AU2409500A AU 2409500 A AU2409500 A AU 2409500A AU 24095/00 A AU24095/00 A AU 24095/00A AU 2409500 A AU2409500 A AU 2409500A AU 2409500 A AU2409500 A AU 2409500A
Authority
AU
Australia
Prior art keywords
substrate
applying flux
flux
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU24095/00A
Inventor
Timothy J. Provencher
Harrie Woudstra
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2409500A publication Critical patent/AU2409500A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU24095/00A 1999-01-07 2000-01-07 Apparatus and method for applying flux to a substrate Abandoned AU2409500A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22724399A 1999-01-07 1999-01-07
US09227243 1999-01-07
PCT/US2000/000427 WO2000040343A1 (en) 1999-01-07 2000-01-07 Apparatus and method for applying flux to a substrate

Publications (1)

Publication Number Publication Date
AU2409500A true AU2409500A (en) 2000-07-24

Family

ID=22852350

Family Applications (1)

Application Number Title Priority Date Filing Date
AU24095/00A Abandoned AU2409500A (en) 1999-01-07 2000-01-07 Apparatus and method for applying flux to a substrate

Country Status (3)

Country Link
EP (1) EP1156886A4 (en)
AU (1) AU2409500A (en)
WO (1) WO2000040343A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1960723A1 (en) * 1969-12-03 1971-06-09 Siemens Ag Printed circuit screen printing template
JPS55138294A (en) * 1979-04-11 1980-10-28 Matsushita Electric Ind Co Ltd Method of forming through hole connector
EP0244496B1 (en) * 1986-05-06 1991-01-16 Ibm Deutschland Gmbh Lithographic mask for ions, electrons or x-rays, and process for its production
JPH0313393A (en) * 1989-06-12 1991-01-22 Sony Corp Mask screen for cream solder printing and preparation thereof
JPH0821771B2 (en) * 1990-03-07 1996-03-04 千住金属工業株式会社 Printed circuit board soldering method
JPH04230095A (en) * 1990-12-27 1992-08-19 Fuji Photo Film Co Ltd Board mounting method
JPH05338370A (en) * 1992-06-10 1993-12-21 Dainippon Screen Mfg Co Ltd Metal mask plate for screen printing
JPH06260748A (en) * 1993-03-03 1994-09-16 Kiyoshi Saitou Partially flux applying apparatus for printed board
US5356658A (en) * 1993-07-19 1994-10-18 Motorola, Inc. Flexible high speed liquid dispenser
US5492266A (en) * 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
KR0138278B1 (en) * 1995-01-24 1998-04-27 김광호 Mask for x-ray lithography and method to manufacture the same
GB2320462B (en) * 1996-12-18 1999-03-03 Micro Metallic Ltd Improved stencil and method of producing such

Also Published As

Publication number Publication date
EP1156886A4 (en) 2002-08-28
EP1156886A1 (en) 2001-11-28
WO2000040343A1 (en) 2000-07-13

Similar Documents

Publication Publication Date Title
AU7591800A (en) Method and apparatus for single-point-delegation of a task to multiple web-basedservices
AU2003286547A1 (en) Method and apparatus for applying designs to a substrate
AU2163801A (en) Method and device for coating a substrate
AU7378998A (en) Method and apparatus for clamping a substrate
AU1590801A (en) Method and apparatus for applying a coating onto a substrate
SG90780A1 (en) Method and apparatus for dechucking a substrate
EP1196944B8 (en) Apparatus and method for transferring a workpiece
AU2001284937A1 (en) Method and apparatus for applying a curved component to a moving web
AU4127700A (en) Apparatus and method for aligning tubulars
AUPQ055999A0 (en) A method and apparatus (npage01)
AU6101500A (en) Method and apparatus for a high-performance hoist
AU5593700A (en) Apparatus and method for applying labels
AU1339401A (en) Method and apparatus for coating a substrate in a vacuum
GB2356786B (en) Method and apparatus for aligning a crystalline substrate
AU1590701A (en) Method and apparatus for dynamically coating a substrate
EP1182271B8 (en) Apparatus and method for coating substrate
AUPP868799A0 (en) A method and apparatus(IJ46P1B)
AUPP868899A0 (en) A method and apparatus(IJ46P1C)
AU2002330118A1 (en) Method and apparatus for coating a substrate
AU1471801A (en) Method and apparatus for applying a polychromatic coating onto a substrate
AUPP869099A0 (en) A method and apparatus(IJ46P1E)
AU6032599A (en) Method and apparatus for applying a bonding agent to an orthodontic band
AU2002220632A1 (en) Method for applying a substrate
AU2001247378A1 (en) Method and apparatus for bonding substrates
AUPP868699A0 (en) A method and apparatus(IJ46P1A)

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase