JPH0821771B2 - Printed circuit board soldering method - Google Patents
Printed circuit board soldering methodInfo
- Publication number
- JPH0821771B2 JPH0821771B2 JP5351090A JP5351090A JPH0821771B2 JP H0821771 B2 JPH0821771 B2 JP H0821771B2 JP 5351090 A JP5351090 A JP 5351090A JP 5351090 A JP5351090 A JP 5351090A JP H0821771 B2 JPH0821771 B2 JP H0821771B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- circuit board
- printed circuit
- cream solder
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は微細な幅のリードとリード間隙を有する電子
部品（以下、ファインピッチ部品という）と微細でない
幅のリードとリード間隙を有する電子部品（以下、チッ
プ部品という）が搭載されたプリント基板をクリームは
んだではんだ付けする方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to an electronic component having fine width leads and lead gaps (hereinafter referred to as a fine pitch component), and an electronic component having non-fine width leads and lead gaps. The present invention relates to a method for soldering a printed circuit board (hereinafter referred to as a chip component) mounted with cream solder.
一般にチップ部品をプリント基板にはんだ付けするに
は、液状またはペースト状フラックス（以下、単にフラ
ックスという）が８〜12重量％、残部粉末はんだから成
るクリームはんだ（以下、普通のクリームはんだとい
う）をマスクでプリント基板に印刷し、その上にチップ
部品を搭載してからリフロー炉、赤外線、レーザ光線、
熱風等の加熱装置で加熱することが行われていた。Generally, when soldering chip components to a printed circuit board, a mask of cream solder (hereinafter referred to as ordinary cream solder), which is composed of 8 to 12% by weight of liquid or paste-like flux (hereinafter simply referred to as flux) and the remaining powder solder, is used as a mask. After printing on the printed circuit board with, and mounting chip parts on it, reflow furnace, infrared ray, laser beam,
Heating was performed with a heating device such as hot air.
近時の電子機器には、ファインピッチ部品とチップ部
品が同時に使われており、これらの電子部品をプリント
基板にはんだ付けするには、普通のクリームはんだを使
用していた。Fine pitch components and chip components have been used at the same time in recent electronic devices, and ordinary cream solder has been used to solder these electronic components to a printed circuit board.
〔発明が解決しようとする課題〕 普通のクリームはんだでファインピッチ部品のはんだ
付けをしようとすると、クリームはんだでの印刷時、ク
リームはんだがマスクの穴の中に充填されたままとなっ
てプリント基板に付着しないという所謂「抜け」の悪い
ことがあった。またクリームはんだが抜けても、加熱溶
融時、クリームはんだが隣接したはんだ付け部のクリー
ムはんだと融合してブリッヂを形成してしまうというこ
とがあった。つまり、「抜け」の悪いことについては、
マスクに穿設した穴の大きさに対してマスクの厚さが厚
いためであり、ブリッヂを形成することについても、マ
スクが厚いためクリームはんだの付着が多くなってしま
うからである。そこで、ファインピッチに適した厚さの
薄いマスクを使用すると、チップ部品には、はんだ量が
足りなくなるばかりでなく、クリームはんだの印刷時、
マスクの穴の中に充填されたクリームはんだがスキージ
でえぐられて均一塗布ができなくなることがあった。[Problems to be Solved by the Invention] When soldering fine-pitch parts with ordinary cream solder, when printing with cream solder, the cream solder remains filled in the holes of the mask There was a bad so-called "removal" that it did not adhere to the. Further, even if the cream solder comes off, the cream solder sometimes fuses with the cream solder of the adjacent soldering portion to form a bridge during heating and melting. In other words, when it comes to "missing",
This is because the thickness of the mask is large relative to the size of the holes formed in the mask, and the formation of the bridge is also because the thick solder mask increases the adhesion of cream solder. Therefore, if a thin mask suitable for fine pitch is used, not only will the chip component not have a sufficient amount of solder, but when printing cream solder,
In some cases, the cream solder filled in the holes of the mask was scooped out by a squeegee, making uniform coating impossible.
本発明はファインピッチ部品とチップ部品を一緒に搭
載したプリント基板において、それぞれに適したクリー
ムはんだの塗布が行え、しかも抜けが悪くなったり、ブ
リッヂを形成させることがないというプリント基板のは
んだ付け方法を提供することにある。The present invention is a method for soldering a printed circuit board on which a fine pitch component and a chip component are mounted together, in which cream solder suitable for each can be applied, and the removal of the cream solder does not worsen and a bridge is not formed. To provide.
本発明者はクリームはんだのフラックス量を多くすれ
ば普通のクリームはんだと同一容積であってもはんだ量
を少なくすることができ、またブリッヂが形成されにく
いことを知見し、該知見に基づいて本発明を完成させ
た。The present inventor has found that if the flux amount of cream solder is increased, the amount of solder can be reduced even with the same volume as ordinary cream solder, and that bridges are less likely to be formed, and based on the findings, Completed the invention.
本発明は、プリント基板の微細なはんだ付け部には液
状またはペースト状フラックスが25〜80重量％、残部粉
末はんだから成るクリームはんだを印刷塗布し、前記微
細なはんだ付け部を除くはんだ付け部には液状またはペ
ースト状フラックスが８〜12重量％、残部粉末はんだか
ら成るクリームはんだを印刷塗布した後、これらの塗布
部に電子部品を搭載して加熱することにより電子部品と
プリント基板とをはんだ付けすることを特徴とするプリ
ント基板のはんだ付け方法である。The present invention, the liquid or paste flux is 25 to 80% by weight to the fine soldering portion of the printed circuit board, the cream solder consisting of the remaining powder solder is applied by printing, and the soldering portion excluding the fine soldering portion is used. Is a liquid or paste flux of 8 to 12% by weight and the rest is powder solder. After soldering, soldering the electronic parts and the printed circuit board by mounting electronic parts on these parts and heating them. A method for soldering a printed circuit board, comprising:
本発明でプリント基板の微細なはんだ付け部に用いる
クリームはんだは、フラックス量が25重量％より少ない
とはんだ量が多くなってブリッヂ形成の原因となり、し
かるに80重量％を超えるとはんだの量が少なくなり過ぎ
てファインピッチ部品のはんだ付けができなくなるばか
りでなく、流動しやすくなるためクリームはんだの印刷
時にクリームはんだが不必要な箇所に流れ出たり、マス
クの裏面ににじみ出て、次に印刷するプリント基板を汚
すことになってしまう。The cream solder used for the fine soldering portion of the printed circuit board in the present invention causes a large amount of solder when the amount of flux is less than 25% by weight, and causes the formation of bridges. However, when it exceeds 80% by weight, the amount of solder is small. Not only will it become impossible to solder fine-pitch parts, but it will also easily flow, so when printing cream solder, the cream solder will flow out to unnecessary areas, or will ooze to the backside of the mask, and the next printed circuit board to be printed. Will be polluted.
また、本発明でチップ部品を搭載する部分には、フラ
ックス量が８〜12重量％、残部粉末はんだから成る普通
のクリームはんだを用いる。フラックス量がこの範囲内
にあるクリームはんだは、チップ部品に対して適当なは
んだ量が得られるとともに、印刷性も良好となる。In addition, in the present invention, a normal cream solder having a flux amount of 8 to 12% by weight and the balance powder solder is used for the portion on which the chip component is mounted. The cream solder having a flux amount within this range provides an appropriate solder amount for the chip component and also has good printability.
第１〜４図は本発明のはんだ付け方法説明する図であ
る。1 to 4 are views for explaining the soldering method of the present invention.
プリント基板１にはファインピッチ部品のランド用マ
スク２を重ね合わせ、その上にフラックス量40重量％、
残部粉末はんだからなるクリームはんだ３を載置してス
キージ４でクリームはんだ３を矢印Ａ方向に掻く。該マ
スクは、チップ部品用ランド５は覆い、ファインピッチ
部品用ランド６に合致した部分は穴７が穿設されている
（第１図）。A fine pitch component land mask 2 is overlaid on the printed circuit board 1 and a flux amount of 40% by weight,
The cream solder 3 made of the remaining powdered solder is placed and the squeegee 4 scrapes the cream solder 3 in the direction of arrow A. The mask covers the chip component lands 5 and the holes 7 are formed at the portions corresponding to the fine pitch component lands 6 (FIG. 1).
スキージでクリームはんだを掻いた後、マスクを除去
すると、ファインピッチ部品用ランド６上だけにフラッ
クス量の多いクリームはんだ３が塗布される。（第２
図） 次にファインピッチ部品用ランド６と合致する部分に
凹陥８が形成され、チップ部品用ランド５と合致した部
分に穴９が穿設されたチップ部品のランド用マスク10を
プリント基板１に重ね合わせ、マスク10上にフラックス
量10重量％、残部粉末はんだから成る普通のクリームは
んだ11を載置し、スキージ４で矢印Ｂ方向に掻く（第３
図）。After the cream solder is scratched with a squeegee and the mask is removed, the cream solder 3 having a large amount of flux is applied only on the fine pitch component land 6. (Second
Next, a mask 10 for land of a chip component is formed on the printed circuit board 1 in which a recess 8 is formed in a portion corresponding to the land 6 for fine pitch component, and a hole 9 is formed in a portion corresponding to the land 5 for chip component. Overlaying, a normal cream solder 11 consisting of 10 wt% flux amount and the remaining powder solder is placed on the mask 10, and scratched in the direction of arrow B with the squeegee 4 (3rd
Figure).
するとチップ部品用ランド５上には普通のクリームは
んだ11が塗布され、ファインピッチ部品用ランド上には
フラックス量の多いクリームはんだ３が塗布される。
（第４図） この様にクリームはんだが塗布された部分に、それぞ
れチップ部品とファインピッチ部品を搭載してリフロー
炉で加熱したところ、未はんだやブリッヂのないはんだ
付けが行えた。Then, the normal cream solder 11 is applied on the chip component land 5, and the cream solder 3 having a large amount of flux is applied on the fine pitch component land.
(Fig. 4) Chip parts and fine pitch parts were mounted on the parts thus coated with cream solder and heated in a reflow furnace, and soldering without soldering or bridging could be performed.
本発明によれば、ファインピッチ部品用のランドとチ
ップ部品用のランドにそれぞれ適した量の粉末はんだを
含むクリームはんだが印刷塗布できるため、にじみ、抜
けによるブリッヂ形成や未はんだ等のはんだ付け不良を
起こさないという信頼あるはんだ付け部が得られるもの
である。According to the present invention, cream solder containing an appropriate amount of powdered solder can be applied to the land for fine pitch components and the land for chip components by printing, so that bridging due to bleeding or omission, soldering failure such as unsoldered solder, etc. It is possible to obtain a reliable soldered portion that does not cause
第１〜４図は、本発明のはんだ付け方法を説明する図で
ある。 １……プリント基板、２、10……マスク ３……フラックス量の多いクリームはんだ ５……チップ部品用ランド ６……ファインピッチ部品用ランド 11……普通のクリームはんだ1 to 4 are views for explaining the soldering method of the present invention. 1 ... Printed circuit board, 2, 10 ... Mask 3 ... Cream solder with a large amount of flux 5 ... Land for chip parts 6 ... Land for fine pitch parts 11 ... Ordinary cream solder
Claims (1)
状またはペースト状フラックスが25〜80重量％、残部粉
末はんだから成るクリームはんだを印刷塗布し、前記微
細なはんだ付け部を除くはんだ付け部には液状またはペ
ースト状フラックスが８〜12重量％、残部粉末はんだか
ら成るクリームはんだを印刷塗布した後、これらの塗布
部に電子部品を搭載して加熱することにより電子部品と
プリント基板とをはんだ付けすることを特徴とするプリ
ント基板のはんだ付け方法。1. A soldering portion excluding the fine soldering portion is printed by applying a cream solder consisting of 25 to 80% by weight of liquid or paste-like flux and the balance powder solder to the fine soldering portion of the printed circuit board. Liquid solder or paste flux is 8 to 12% by weight and the rest is powder solder, and then solder is applied to the electronic parts and the printed circuit board by mounting electronic parts on these parts and heating them. A method for soldering a printed circuit board, which is characterized by being attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5351090A JPH0821771B2 (en) | 1990-03-07 | 1990-03-07 | Printed circuit board soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5351090A JPH0821771B2 (en) | 1990-03-07 | 1990-03-07 | Printed circuit board soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03256396A JPH03256396A (en) | 1991-11-15 |
| JPH0821771B2 true JPH0821771B2 (en) | 1996-03-04 |
Family
ID=12944812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5351090A Expired - Lifetime JPH0821771B2 (en) | 1990-03-07 | 1990-03-07 | Printed circuit board soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0821771B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1156886A4 (en) * | 1999-01-07 | 2002-08-28 | Robotic Vision Systems | Apparatus and method for applying flux to a substrate |
-
1990
- 1990-03-07 JP JP5351090A patent/JPH0821771B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03256396A (en) | 1991-11-15 |
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