AU2002220632A1 - Method for applying a substrate - Google Patents

Method for applying a substrate

Info

Publication number
AU2002220632A1
AU2002220632A1 AU2002220632A AU2063202A AU2002220632A1 AU 2002220632 A1 AU2002220632 A1 AU 2002220632A1 AU 2002220632 A AU2002220632 A AU 2002220632A AU 2063202 A AU2063202 A AU 2063202A AU 2002220632 A1 AU2002220632 A1 AU 2002220632A1
Authority
AU
Australia
Prior art keywords
applying
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002220632A
Inventor
Pirmin Gerhard Muffler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUSS MicroTec Laboratory Equipment GmbH
Original Assignee
B L E LAB EQUIPMENT GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by B L E LAB EQUIPMENT GmbH filed Critical B L E LAB EQUIPMENT GmbH
Publication of AU2002220632A1 publication Critical patent/AU2002220632A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1866—Handling of layers or the laminate conforming the layers or laminate to a convex or concave profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2002220632A 2000-10-20 2001-10-15 Method for applying a substrate Abandoned AU2002220632A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10052293A DE10052293A1 (en) 2000-10-20 2000-10-20 Method for depositing a thin-walled, flat wafer substrate onto a mounting carrier with a level protective layer like wax brings the substrate into contact with the protective layer through making a gap and arching.
DE10052293 2000-10-20
PCT/EP2001/011897 WO2002035591A1 (en) 2000-10-20 2001-10-15 Method for applying a substrate

Publications (1)

Publication Number Publication Date
AU2002220632A1 true AU2002220632A1 (en) 2002-05-06

Family

ID=7660612

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002220632A Abandoned AU2002220632A1 (en) 2000-10-20 2001-10-15 Method for applying a substrate

Country Status (5)

Country Link
US (1) US6841027B2 (en)
EP (1) EP1332516A1 (en)
AU (1) AU2002220632A1 (en)
DE (1) DE10052293A1 (en)
WO (1) WO2002035591A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITTO20010823A1 (en) * 2001-08-22 2003-02-22 Taltos S P A PROCESS FOR THE CONSTRUCTION OF A STONE-GLASS COMPOSITE PANEL AND PANEL OBTAINED WITH SUCH PROCESS.
JP2005235243A (en) * 2004-02-17 2005-09-02 Tdk Corp Manufacturing method and apparatus for information recording medium
JP4841412B2 (en) * 2006-12-06 2011-12-21 日東電工株式会社 Substrate laminating equipment
US8123894B2 (en) * 2008-05-07 2012-02-28 Apple Inc. 3-dimensional curved substrate lamination
WO2012007520A1 (en) 2010-07-15 2012-01-19 Replisaurus Group Sas A chuck, and a method for bringing a first and a second substrate together
US8808483B2 (en) 2010-11-05 2014-08-19 Apple Inc. Method of making a curved touch panel
JP5973203B2 (en) * 2012-03-29 2016-08-23 リンテック株式会社 Sheet sticking device and sticking method
KR101382601B1 (en) * 2012-07-02 2014-04-17 삼성디스플레이 주식회사 Manufacturing apparatus and method of organic light emitting diode display
KR101932124B1 (en) * 2013-04-03 2018-12-26 삼성디스플레이 주식회사 Jig assembly, laminating apparatus and method for laminating using the same
JP6714507B2 (en) * 2013-09-27 2020-06-24 スリーエム イノベイティブ プロパティズ カンパニー Robot-assisted automated decal application method for complex 3D surfaces
DE102014106100A1 (en) 2014-04-30 2015-11-05 Ev Group E. Thallner Gmbh Method and apparatus for uniforming a substrate stack
CN111798780B (en) * 2020-08-10 2023-07-28 京东方科技集团股份有限公司 Testing device and testing method
CN112894277A (en) * 2021-01-19 2021-06-04 湖北凯梦科技有限公司 Preparation method and application of streamline thin-wall part
CN116130384B (en) * 2022-12-16 2023-10-24 江苏宝浦莱半导体有限公司 Semiconductor wafer film pasting technology

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3322598A (en) * 1963-10-02 1967-05-30 Alvin M Marks Laminator for securing continuous flexible film to a base
US3554834A (en) * 1968-07-24 1971-01-12 Corning Glass Works Decal applying
US3955163A (en) * 1974-06-24 1976-05-04 The Computervision Corporation Method of positioning a semiconductor wafer for contact printing
DE2608427C2 (en) * 1976-03-01 1984-07-19 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Method for cementing semiconductor wafers
JPS6035250B2 (en) * 1978-06-19 1985-08-13 松下電器産業株式会社 How to bond flexible film
JP2808794B2 (en) * 1990-02-22 1998-10-08 ソニー株式会社 Double-sided optical disk
US5131968A (en) * 1990-07-31 1992-07-21 Motorola, Inc. Gradient chuck method for wafer bonding employing a convex pressure
DE4332488C2 (en) * 1993-09-24 1996-05-30 Bosch Gmbh Robert Device for applying a carrier film
US5733410A (en) * 1996-06-03 1998-03-31 Motorola, Inc. Labeling apparatus for applying labels with a rolling motion
JPH1012578A (en) * 1996-06-26 1998-01-16 Mitsubishi Electric Corp Method and apparatus for mounting wafer on support base
US6007654A (en) * 1996-12-31 1999-12-28 Texas Instruments Incorporated Noncontact method of adhering a wafer to a wafer tape
JPH10275852A (en) * 1997-03-31 1998-10-13 Shin Etsu Handotai Co Ltd Method and device of bonding semiconductor substrate
EP1038315A4 (en) 1997-11-11 2001-07-11 Irvine Sensors Corp Method for thinning semiconductor wafers with circuits and wafers made by the same
DE19756614A1 (en) * 1997-12-18 1999-07-01 Wacker Siltronic Halbleitermat Method for assembling and disassembling a semiconductor wafer, and material mixture that is suitable for carrying out the method
DE19814101A1 (en) * 1998-03-30 1999-10-14 Fresenius Medical Care De Gmbh Process for the airtight connection of two membranes
JP3784202B2 (en) * 1998-08-26 2006-06-07 リンテック株式会社 Double-sided adhesive sheet and method of using the same

Also Published As

Publication number Publication date
DE10052293A1 (en) 2002-04-25
WO2002035591A1 (en) 2002-05-02
US6841027B2 (en) 2005-01-11
EP1332516A1 (en) 2003-08-06
US20020062921A1 (en) 2002-05-30

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