JPH0316220Y2 - - Google Patents
Info
- Publication number
- JPH0316220Y2 JPH0316220Y2 JP1985195371U JP19537185U JPH0316220Y2 JP H0316220 Y2 JPH0316220 Y2 JP H0316220Y2 JP 1985195371 U JP1985195371 U JP 1985195371U JP 19537185 U JP19537185 U JP 19537185U JP H0316220 Y2 JPH0316220 Y2 JP H0316220Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- terminal
- external metal
- gold
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 9
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 3
- 238000010344 co-firing Methods 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910000833 kovar Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985195371U JPH0316220Y2 (US20030220297A1-20031127-C00009.png) | 1985-12-19 | 1985-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985195371U JPH0316220Y2 (US20030220297A1-20031127-C00009.png) | 1985-12-19 | 1985-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62173171U JPS62173171U (US20030220297A1-20031127-C00009.png) | 1987-11-04 |
| JPH0316220Y2 true JPH0316220Y2 (US20030220297A1-20031127-C00009.png) | 1991-04-08 |
Family
ID=31153198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985195371U Expired JPH0316220Y2 (US20030220297A1-20031127-C00009.png) | 1985-12-19 | 1985-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316220Y2 (US20030220297A1-20031127-C00009.png) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5533182A (en) * | 1978-08-31 | 1980-03-08 | Yamatoya Shokai:Kk | Camera for photomechanical process |
| JPS5586130A (en) * | 1978-12-25 | 1980-06-28 | Hitachi Ltd | Connection of semiconductor element |
| JPS57139995A (en) * | 1981-02-24 | 1982-08-30 | Mitsubishi Electric Corp | Method of producing hybrid integrated circuit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4927646U (US20030220297A1-20031127-C00009.png) * | 1972-06-14 | 1974-03-09 |
-
1985
- 1985-12-19 JP JP1985195371U patent/JPH0316220Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5533182A (en) * | 1978-08-31 | 1980-03-08 | Yamatoya Shokai:Kk | Camera for photomechanical process |
| JPS5586130A (en) * | 1978-12-25 | 1980-06-28 | Hitachi Ltd | Connection of semiconductor element |
| JPS57139995A (en) * | 1981-02-24 | 1982-08-30 | Mitsubishi Electric Corp | Method of producing hybrid integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62173171U (US20030220297A1-20031127-C00009.png) | 1987-11-04 |
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