JPS57139995A - Method of producing hybrid integrated circuit - Google Patents

Method of producing hybrid integrated circuit

Info

Publication number
JPS57139995A
JPS57139995A JP56026271A JP2627181A JPS57139995A JP S57139995 A JPS57139995 A JP S57139995A JP 56026271 A JP56026271 A JP 56026271A JP 2627181 A JP2627181 A JP 2627181A JP S57139995 A JPS57139995 A JP S57139995A
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
producing hybrid
producing
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56026271A
Other languages
Japanese (ja)
Inventor
Tsutomu Kamata
Eiji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56026271A priority Critical patent/JPS57139995A/en
Publication of JPS57139995A publication Critical patent/JPS57139995A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
JP56026271A 1981-02-24 1981-02-24 Method of producing hybrid integrated circuit Pending JPS57139995A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56026271A JPS57139995A (en) 1981-02-24 1981-02-24 Method of producing hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56026271A JPS57139995A (en) 1981-02-24 1981-02-24 Method of producing hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS57139995A true JPS57139995A (en) 1982-08-30

Family

ID=12188609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56026271A Pending JPS57139995A (en) 1981-02-24 1981-02-24 Method of producing hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS57139995A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61244055A (en) * 1985-04-22 1986-10-30 Japan Radio Co Ltd Thick-film hybrid integrated circuit board
JPS62173171U (en) * 1985-12-19 1987-11-04
JPS6322790U (en) * 1986-07-28 1988-02-15
JPH06169160A (en) * 1991-03-22 1994-06-14 Tokai Rika Co Ltd Solder joint structure

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61244055A (en) * 1985-04-22 1986-10-30 Japan Radio Co Ltd Thick-film hybrid integrated circuit board
JPS62173171U (en) * 1985-12-19 1987-11-04
JPH0316220Y2 (en) * 1985-12-19 1991-04-08
JPS6322790U (en) * 1986-07-28 1988-02-15
JPH06169160A (en) * 1991-03-22 1994-06-14 Tokai Rika Co Ltd Solder joint structure

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