JPH03151B2 - - Google Patents

Info

Publication number
JPH03151B2
JPH03151B2 JP22789383A JP22789383A JPH03151B2 JP H03151 B2 JPH03151 B2 JP H03151B2 JP 22789383 A JP22789383 A JP 22789383A JP 22789383 A JP22789383 A JP 22789383A JP H03151 B2 JPH03151 B2 JP H03151B2
Authority
JP
Japan
Prior art keywords
lead pin
brazing
alloy
filler metal
brazing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22789383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60121063A (ja
Inventor
Katsuyuki Takarasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP22789383A priority Critical patent/JPS60121063A/ja
Publication of JPS60121063A publication Critical patent/JPS60121063A/ja
Publication of JPH03151B2 publication Critical patent/JPH03151B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP22789383A 1983-12-02 1983-12-02 球状ろう材付リ−ドピンの製造方法 Granted JPS60121063A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22789383A JPS60121063A (ja) 1983-12-02 1983-12-02 球状ろう材付リ−ドピンの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22789383A JPS60121063A (ja) 1983-12-02 1983-12-02 球状ろう材付リ−ドピンの製造方法

Publications (2)

Publication Number Publication Date
JPS60121063A JPS60121063A (ja) 1985-06-28
JPH03151B2 true JPH03151B2 (enExample) 1991-01-07

Family

ID=16867965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22789383A Granted JPS60121063A (ja) 1983-12-02 1983-12-02 球状ろう材付リ−ドピンの製造方法

Country Status (1)

Country Link
JP (1) JPS60121063A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0821665B2 (ja) * 1986-11-27 1996-03-04 京セラ株式会社 リ−ドピンおよびその製造方法
JPH0821666B2 (ja) * 1986-12-22 1996-03-04 株式会社徳力本店 リ−ドピン
JPS63157457A (ja) * 1986-12-22 1988-06-30 Tokuriki Honten Co Ltd リ−ドピン
JPS63157459A (ja) * 1986-12-22 1988-06-30 Tokuriki Honten Co Ltd リ−ドピンの製造方法
JPS63157456A (ja) * 1986-12-22 1988-06-30 Tokuriki Honten Co Ltd リ−ドピンおよびその製造方法
JPS63157455A (ja) * 1986-12-22 1988-06-30 Tokuriki Honten Co Ltd リ−ドピン
JPS63157458A (ja) * 1986-12-22 1988-06-30 Tokuriki Honten Co Ltd リ−ドピン
US5761779A (en) * 1989-12-07 1998-06-09 Nippon Steel Corporation Method of producing fine metal spheres of uniform size
CN107813090B (zh) * 2016-09-13 2021-08-31 富鼎电子科技(嘉善)有限公司 一种探针制备方法及制备该探针的焊接治具
CN110315086A (zh) * 2019-06-21 2019-10-11 广州番禺职业技术学院 一种银珠粒的制作工艺
CN110181136B (zh) * 2019-06-28 2021-08-10 吴忠仪表有限责任公司 蝶片式迷宫阀笼装结构钎焊方法

Also Published As

Publication number Publication date
JPS60121063A (ja) 1985-06-28

Similar Documents

Publication Publication Date Title
CN101641176B (zh) 高温焊接材料
JPH0788679A (ja) 無鉛すずアンチモン・ビスマス銅はんだ合金
JP6281916B2 (ja) はんだ材料および接合構造体
KR20190113903A (ko) 땜납 합금, 땜납 접합 재료 및 전자회로 기판
JPWO2015125855A1 (ja) 鉛フリーはんだ合金、はんだ材料及び接合構造体
JPS60121063A (ja) 球状ろう材付リ−ドピンの製造方法
JPS58107295A (ja) ろう合金
EP0222004B1 (en) Copper-zinc-manganese-nickel alloys
US4465223A (en) Process for brazing
US4053728A (en) Brazed joint between a beryllium-base part and a part primarily of a metal that is retractable with beryllium to form a brittle intermetallic compound
JP3782743B2 (ja) ハンダ用組成物、ハンダ付け方法および電子部品
JP2008036691A (ja) 鉛フリーはんだ材料及びその製造方法、接合構造、並びに電子部品実装構造
JP2019136774A (ja) 半田合金組成物、半田およびその製造方法
JPH09122967A (ja) 複合半田材料
JPS616181A (ja) セラミツクスと金属のアルミニウムろう付方法
JP2563293B2 (ja) 複合ろう材のろう付方法
EP0055368A1 (en) Process for brazing
JP3086086B2 (ja) 回路端子へのリードピンの接合方法
JPH07118498B2 (ja) 電気的接合部
JPS6090879A (ja) セラミツクと金属を接合する方法
JP4097813B2 (ja) はんだ付け方法
JPH0422595A (ja) クリームはんだ
JPS60113449A (ja) 難加工性ろう材付リ−ドピンの製造方法
JP4973109B2 (ja) 半導体装置の製造方法
JPS59105347A (ja) Ａｇろう付きストレートピンの製造方法