JPH0314001Y2 - - Google Patents

Info

Publication number

JPH0314001Y2

JPH0314001Y2 JP6426284U JP6426284U JPH0314001Y2 JP H0314001 Y2 JPH0314001 Y2 JP H0314001Y2 JP 6426284 U JP6426284 U JP 6426284U JP 6426284 U JP6426284 U JP 6426284U JP H0314001 Y2 JPH0314001 Y2 JP H0314001Y2

Authority

JP

Japan

Prior art keywords

resistor

temperature

firing

resistance

ruthenium

Prior art date

1984-04-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 238000010304 firing Methods 0.000 claims description 26
• 230000001681 protective effect Effects 0.000 claims description 11
• 239000000758 substrate Substances 0.000 claims description 8
• KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 7
• 229910052707 ruthenium Inorganic materials 0.000 claims description 7
• 229910001925 ruthenium oxide Inorganic materials 0.000 claims description 7
• WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims description 7
• 229910000510 noble metal Inorganic materials 0.000 claims description 4
• 239000010408 film Substances 0.000 description 18
• 239000011521 glass Substances 0.000 description 10
• 230000008018 melting Effects 0.000 description 6
• 238000002844 melting Methods 0.000 description 6
• 239000005388 borosilicate glass Substances 0.000 description 3
• 229910000679 solder Inorganic materials 0.000 description 3
• 238000007740 vapor deposition Methods 0.000 description 3
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
• KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
• 239000000919 ceramic Substances 0.000 description 2
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
• 229910052737 gold Inorganic materials 0.000 description 2
• 239000010931 gold Substances 0.000 description 2
• 239000000463 material Substances 0.000 description 2
• BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• 239000010409 thin film Substances 0.000 description 2
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 229910052751 metal Inorganic materials 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 238000002156 mixing Methods 0.000 description 1
• 239000000203 mixture Substances 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 230000003647 oxidation Effects 0.000 description 1
• 238000007254 oxidation reaction Methods 0.000 description 1
• 229910052763 palladium Inorganic materials 0.000 description 1
• 229910052697 platinum Inorganic materials 0.000 description 1
• 239000010970 precious metal Substances 0.000 description 1
• 239000011241 protective layer Substances 0.000 description 1