JPH029471B2 - - Google Patents
Info
- Publication number
- JPH029471B2 JPH029471B2 JP60043482A JP4348285A JPH029471B2 JP H029471 B2 JPH029471 B2 JP H029471B2 JP 60043482 A JP60043482 A JP 60043482A JP 4348285 A JP4348285 A JP 4348285A JP H029471 B2 JPH029471 B2 JP H029471B2
- Authority
- JP
- Japan
- Prior art keywords
- layer pattern
- inner layer
- pattern portion
- copper
- outer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 50
- 229910052802 copper Inorganic materials 0.000 claims description 41
- 239000010949 copper Substances 0.000 claims description 41
- 238000005530 etching Methods 0.000 claims description 26
- 238000007747 plating Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Electroplating Methods And Accessories (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60043482A JPS61201497A (ja) | 1985-03-04 | 1985-03-04 | 内層パタ−ン部が露出するプリント基板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60043482A JPS61201497A (ja) | 1985-03-04 | 1985-03-04 | 内層パタ−ン部が露出するプリント基板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61201497A JPS61201497A (ja) | 1986-09-06 |
| JPH029471B2 true JPH029471B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-03-02 |
Family
ID=12664941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60043482A Granted JPS61201497A (ja) | 1985-03-04 | 1985-03-04 | 内層パタ−ン部が露出するプリント基板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61201497A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1985
- 1985-03-04 JP JP60043482A patent/JPS61201497A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61201497A (ja) | 1986-09-06 |