JPH02860B2 - - Google Patents

Info

Publication number
JPH02860B2
JPH02860B2 JP55149783A JP14978380A JPH02860B2 JP H02860 B2 JPH02860 B2 JP H02860B2 JP 55149783 A JP55149783 A JP 55149783A JP 14978380 A JP14978380 A JP 14978380A JP H02860 B2 JPH02860 B2 JP H02860B2
Authority
JP
Japan
Prior art keywords
lead
lead frame
small piece
present
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55149783A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5772359A (en
Inventor
Hiroshi Chiba
Shoichi Ogura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP55149783A priority Critical patent/JPS5772359A/ja
Publication of JPS5772359A publication Critical patent/JPS5772359A/ja
Publication of JPH02860B2 publication Critical patent/JPH02860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/424—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP55149783A 1980-10-24 1980-10-24 Lead frame for integrated circuit Granted JPS5772359A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55149783A JPS5772359A (en) 1980-10-24 1980-10-24 Lead frame for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55149783A JPS5772359A (en) 1980-10-24 1980-10-24 Lead frame for integrated circuit

Publications (2)

Publication Number Publication Date
JPS5772359A JPS5772359A (en) 1982-05-06
JPH02860B2 true JPH02860B2 (index.php) 1990-01-09

Family

ID=15482613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55149783A Granted JPS5772359A (en) 1980-10-24 1980-10-24 Lead frame for integrated circuit

Country Status (1)

Country Link
JP (1) JPS5772359A (index.php)

Also Published As

Publication number Publication date
JPS5772359A (en) 1982-05-06

Similar Documents

Publication Publication Date Title
JPH022294B2 (index.php)
JP2000294711A (ja) リードフレーム
JP2806328B2 (ja) 樹脂封止型半導体装置およびその製造方法
JPH02860B2 (index.php)
CN206947328U (zh) 引线框架
JPS6242389B2 (index.php)
US5554823A (en) Packaging device and its manufacturing method
JPH0427148A (ja) 半導体装置用リードフレーム
JPH05315517A (ja) 半導体装置
JPS59129451A (ja) リ−ドフレ−ム
JP2766332B2 (ja) リードフレーム及びその製造方法
JPH08288427A (ja) 半導体装置
JPH07169895A (ja) リードフレーム及びその製造方法
JPS63285960A (ja) 半導体搭載基板用の導体ピン
JPH08250638A (ja) 半導体装置
JPH04280661A (ja) 半導体装置用リードフレームの製造方法
JP2611998B2 (ja) 口金ピンとリード線の接続方法
JPS60121751A (ja) 半導体装置の製法
EP0644585A2 (en) Lead frame and method of manufacturing the same
JPS6347272B2 (index.php)
JPH0997866A (ja) リード成形方法及びリード成形用金型
JPS63122257A (ja) 半導体装置の製造方法
JPH0878604A (ja) 半導体装置用リードフレーム
JPH04305966A (ja) リードフレームの製造方法
JPH10256680A (ja) ワイヤボンディング用キバン