JPH0260468B2 - - Google Patents
Info
- Publication number
- JPH0260468B2 JPH0260468B2 JP57079184A JP7918482A JPH0260468B2 JP H0260468 B2 JPH0260468 B2 JP H0260468B2 JP 57079184 A JP57079184 A JP 57079184A JP 7918482 A JP7918482 A JP 7918482A JP H0260468 B2 JPH0260468 B2 JP H0260468B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- protective film
- mask
- sandblasting
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005488 sandblasting Methods 0.000 claims description 25
- 230000001681 protective effect Effects 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 229920003002 synthetic resin Polymers 0.000 claims description 18
- 239000000057 synthetic resin Substances 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 229920002678 cellulose Polymers 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 238000005406 washing Methods 0.000 claims description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- -1 polypropylene Polymers 0.000 description 11
- 239000001913 cellulose Substances 0.000 description 9
- 239000004743 Polypropylene Substances 0.000 description 8
- 229920001155 polypropylene Polymers 0.000 description 8
- 239000000243 solution Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229920003086 cellulose ether Polymers 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 229920000623 Cellulose acetate phthalate Polymers 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 229920002301 cellulose acetate Polymers 0.000 description 2
- 229940081734 cellulose acetate phthalate Drugs 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002763 monocarboxylic acids Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920006289 polycarbonate film Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 229920003064 carboxyethyl cellulose Polymers 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57079184A JPS58196971A (ja) | 1982-05-13 | 1982-05-13 | サンドブラスト用マスクの製造方法 |
| US06/493,909 US4456680A (en) | 1982-05-13 | 1983-05-12 | Process for preparing a mask for sandblasting |
| JP21347283A JPS60104938A (ja) | 1982-05-13 | 1983-11-14 | 固体表面加工用マスク転写材 |
| US06/601,825 US4587186A (en) | 1982-05-13 | 1984-04-19 | Mask element for selective sandblasting and a method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57079184A JPS58196971A (ja) | 1982-05-13 | 1982-05-13 | サンドブラスト用マスクの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58196971A JPS58196971A (ja) | 1983-11-16 |
| JPH0260468B2 true JPH0260468B2 (enExample) | 1990-12-17 |
Family
ID=13682886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57079184A Granted JPS58196971A (ja) | 1982-05-13 | 1982-05-13 | サンドブラスト用マスクの製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4456680A (enExample) |
| JP (1) | JPS58196971A (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4727013A (en) * | 1985-09-18 | 1988-02-23 | Vacuum Applied Coatings Corp. | Method for creating a design in relief in a hard smooth substrate and apparatus for use in the method |
| US4652513A (en) * | 1985-09-18 | 1987-03-24 | Vacuum Applied Coatings Corp. | Method for creating a design in relief in a hard smooth substrate and apparatus for use in the method |
| US4764449A (en) * | 1985-11-01 | 1988-08-16 | The Chromaline Corporation | Adherent sandblast photoresist laminate |
| US4834833A (en) * | 1987-12-02 | 1989-05-30 | Palmer Alan K | Mask for etching, and method of making mask and using same |
| FR2627433B1 (fr) * | 1988-02-19 | 1990-09-21 | Longeron Alain | Procede de confection de masques et caches resistant a la gravure profonde par jet de particules abrasives |
| JP2562954B2 (ja) * | 1988-09-06 | 1996-12-11 | アイセロ化学 株式会社 | 彫食刻マスク用感光性積層フイルム |
| ATE196200T1 (de) * | 1990-10-22 | 2000-09-15 | Aicello Chemical Co | Gravierverfahren mit bildmaske und lichtempfindlicher laminatfilm für besagte bildmaske |
| US5629132B1 (en) * | 1991-03-28 | 2000-02-08 | Aicello Chemical | Method for engraving and/or etching with image-carrying mask and photo-sensitive laminate film for use in making the mask |
| US5518857A (en) * | 1991-03-28 | 1996-05-21 | Aicello Chemical Co., Ltd. | Image-carrying mask photo-sensitive laminate film for use in making an image carry mask |
| WO1992021065A1 (en) * | 1991-04-19 | 1992-11-26 | Birkholm James G | Process for preparing electromagnetic radiation imaged material |
| US5270147A (en) * | 1991-07-12 | 1993-12-14 | Agfa-Gevaert N.V. | Stripping film material |
| US5347766A (en) * | 1991-07-18 | 1994-09-20 | Mitsui Toatsu Chemicals, Inc. | Method for polishing surface of transparent substrate layer of color filter unit |
| US5989689A (en) * | 1991-12-11 | 1999-11-23 | The Chromaline Corporation | Sandblast mask laminate with blastable pressure sensitive adhesive |
| US5672225A (en) * | 1995-07-27 | 1997-09-30 | Cowan; John R. | Method for engraving three dimensional images |
| US7074358B2 (en) * | 2001-12-13 | 2006-07-11 | Alexander Sergeievich Gybin | Polymer casting method and apparatus |
| US7964335B2 (en) | 2002-01-30 | 2011-06-21 | Ikonics Corporation | Ink receptive photosensitive laminate |
| US20040062896A1 (en) * | 2002-09-26 | 2004-04-01 | Picone Terrence F. | Fractionally-releasable bonding layer for use in photo-sensitive laminate films |
| GB0307198D0 (en) * | 2003-03-28 | 2003-04-30 | 3M Innovative Properties Co | Rigid air ducting for respirator hoods and helmets |
| CN102686057A (zh) * | 2011-03-18 | 2012-09-19 | 深圳富泰宏精密工业有限公司 | 电子装置壳体及其制作方法 |
| CN102321892B (zh) * | 2011-09-09 | 2014-02-19 | 重庆大学 | 一种复合型活性阴极的制备方法 |
| CN102352517B (zh) * | 2011-10-21 | 2014-04-30 | 重庆大学 | 一种高活性阴极及其制备方法 |
| CN116072518B (zh) * | 2022-12-30 | 2025-08-08 | 天通凯巨科技有限公司 | 一种超薄钽酸锂晶片的保护膜及脱膜方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2678510A (en) * | 1952-03-20 | 1954-05-18 | Printing Die Company | Method of making relief printing plate matrices and article |
| CA1099435A (en) * | 1971-04-01 | 1981-04-14 | Gwendyline Y. Y. T. Chen | Photosensitive block copolymer composition and elements |
| CH612729A5 (en) * | 1976-07-12 | 1979-08-15 | Sulzer Ag | Device for controlling the speed of a crankshaft of an internal combustion engine, especially a diesel engine |
| JPS5420719A (en) * | 1977-07-15 | 1979-02-16 | Fuji Photo Film Co Ltd | Photosensitive material for image formation and image formation method |
| DE2758575A1 (de) * | 1977-12-29 | 1979-07-05 | Hoechst Ag | Lichtempfindliches schichtuebertragungsmaterial |
| GB2047909B (en) * | 1978-12-25 | 1982-10-06 | Karpov V D | Dry film photoresist |
| JPS5719416A (en) * | 1980-07-09 | 1982-02-01 | Mitsubishi Heavy Ind Ltd | Vessel for improving deep poor ground |
-
1982
- 1982-05-13 JP JP57079184A patent/JPS58196971A/ja active Granted
-
1983
- 1983-05-12 US US06/493,909 patent/US4456680A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58196971A (ja) | 1983-11-16 |
| US4456680A (en) | 1984-06-26 |
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