JPH0258780B2 - - Google Patents
Info
- Publication number
- JPH0258780B2 JPH0258780B2 JP57063414A JP6341482A JPH0258780B2 JP H0258780 B2 JPH0258780 B2 JP H0258780B2 JP 57063414 A JP57063414 A JP 57063414A JP 6341482 A JP6341482 A JP 6341482A JP H0258780 B2 JPH0258780 B2 JP H0258780B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- electrode
- resin
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
- H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57063414A JPS58180050A (ja) | 1982-04-15 | 1982-04-15 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57063414A JPS58180050A (ja) | 1982-04-15 | 1982-04-15 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58180050A JPS58180050A (ja) | 1983-10-21 |
| JPH0258780B2 true JPH0258780B2 (enExample) | 1990-12-10 |
Family
ID=13228602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57063414A Granted JPS58180050A (ja) | 1982-04-15 | 1982-04-15 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58180050A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015142018A (ja) * | 2014-01-29 | 2015-08-03 | 三菱電機株式会社 | 電力用半導体装置 |
| EP3474325A4 (en) | 2016-07-27 | 2020-02-26 | Hitachi, Ltd. | SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SEMICONDUCTOR MODULE |
-
1982
- 1982-04-15 JP JP57063414A patent/JPS58180050A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58180050A (ja) | 1983-10-21 |
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