JPH0258780B2 - - Google Patents
Info
- Publication number
- JPH0258780B2 JPH0258780B2 JP57063414A JP6341482A JPH0258780B2 JP H0258780 B2 JPH0258780 B2 JP H0258780B2 JP 57063414 A JP57063414 A JP 57063414A JP 6341482 A JP6341482 A JP 6341482A JP H0258780 B2 JPH0258780 B2 JP H0258780B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- electrode
- resin
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W90/00—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57063414A JPS58180050A (ja) | 1982-04-15 | 1982-04-15 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57063414A JPS58180050A (ja) | 1982-04-15 | 1982-04-15 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58180050A JPS58180050A (ja) | 1983-10-21 |
| JPH0258780B2 true JPH0258780B2 (enExample) | 1990-12-10 |
Family
ID=13228602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57063414A Granted JPS58180050A (ja) | 1982-04-15 | 1982-04-15 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58180050A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015142018A (ja) * | 2014-01-29 | 2015-08-03 | 三菱電機株式会社 | 電力用半導体装置 |
| WO2018020729A1 (ja) * | 2016-07-27 | 2018-02-01 | 株式会社日立製作所 | 半導体モジュールおよび半導体モジュールの製造方法 |
-
1982
- 1982-04-15 JP JP57063414A patent/JPS58180050A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58180050A (ja) | 1983-10-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7263771B2 (en) | Method of manufacturing a contact sheet and socket including same | |
| JPH10335579A (ja) | 大電力半導体モジュール装置 | |
| JP3370646B2 (ja) | 半導体装置 | |
| JP2009009957A (ja) | 半導体装置 | |
| KR100990527B1 (ko) | 휨저항성 기부판을 갖는 전력 반도체 모듈 | |
| JP2873953B2 (ja) | ボトムリード形半導体パッケージ | |
| CN101207097A (zh) | 电端子 | |
| JP4431756B2 (ja) | 樹脂封止型半導体装置 | |
| JPH05259334A (ja) | 半導体装置 | |
| JPH0258780B2 (enExample) | ||
| JP7435415B2 (ja) | 半導体装置及びその製造方法 | |
| JP2018186244A (ja) | 半導体装置及び半導体装置の製造方法 | |
| US4070688A (en) | Flexible lead | |
| JPH0151058B2 (enExample) | ||
| JPS6215844A (ja) | 半導体リ−ドフレ−ム | |
| JP7116178B2 (ja) | パワー半導体装置 | |
| JP6796666B2 (ja) | 半導体装置 | |
| EP0146463B1 (en) | Compliant lead frame for surface mount semiconductor packages | |
| JPH0328511Y2 (enExample) | ||
| JPS6347266B2 (enExample) | ||
| JP2014216458A (ja) | ビームリードおよび電源装置 | |
| JPH1050897A (ja) | 半導体装置 | |
| JP5398608B2 (ja) | 半導体装置の内部接続構造、及び、半導体装置 | |
| JPH02271561A (ja) | 樹脂封止型半導体装置 | |
| JP3036597B1 (ja) | 半導体装置用リードフレーム |