JPH025543Y2 - - Google Patents

Info

Publication number
JPH025543Y2
JPH025543Y2 JP1980012742U JP1274280U JPH025543Y2 JP H025543 Y2 JPH025543 Y2 JP H025543Y2 JP 1980012742 U JP1980012742 U JP 1980012742U JP 1274280 U JP1274280 U JP 1274280U JP H025543 Y2 JPH025543 Y2 JP H025543Y2
Authority
JP
Japan
Prior art keywords
terminal
terminal portion
package
solder
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980012742U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56114549U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980012742U priority Critical patent/JPH025543Y2/ja
Publication of JPS56114549U publication Critical patent/JPS56114549U/ja
Application granted granted Critical
Publication of JPH025543Y2 publication Critical patent/JPH025543Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1980012742U 1980-02-04 1980-02-04 Expired JPH025543Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980012742U JPH025543Y2 (enExample) 1980-02-04 1980-02-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980012742U JPH025543Y2 (enExample) 1980-02-04 1980-02-04

Publications (2)

Publication Number Publication Date
JPS56114549U JPS56114549U (enExample) 1981-09-03
JPH025543Y2 true JPH025543Y2 (enExample) 1990-02-09

Family

ID=29609305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980012742U Expired JPH025543Y2 (enExample) 1980-02-04 1980-02-04

Country Status (1)

Country Link
JP (1) JPH025543Y2 (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156559A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Small electronic device packaging package
JPS55153362A (en) * 1979-05-18 1980-11-29 Matsushita Electric Ind Co Ltd Chip type semiconductor part

Also Published As

Publication number Publication date
JPS56114549U (enExample) 1981-09-03

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