JPS56114549U - - Google Patents
Info
- Publication number
- JPS56114549U JPS56114549U JP1980012742U JP1274280U JPS56114549U JP S56114549 U JPS56114549 U JP S56114549U JP 1980012742 U JP1980012742 U JP 1980012742U JP 1274280 U JP1274280 U JP 1274280U JP S56114549 U JPS56114549 U JP S56114549U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980012742U JPH025543Y2 (enExample) | 1980-02-04 | 1980-02-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980012742U JPH025543Y2 (enExample) | 1980-02-04 | 1980-02-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56114549U true JPS56114549U (enExample) | 1981-09-03 |
| JPH025543Y2 JPH025543Y2 (enExample) | 1990-02-09 |
Family
ID=29609305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980012742U Expired JPH025543Y2 (enExample) | 1980-02-04 | 1980-02-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025543Y2 (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156559A (en) * | 1976-06-23 | 1977-12-27 | Hitachi Ltd | Small electronic device packaging package |
| JPS55153362A (en) * | 1979-05-18 | 1980-11-29 | Matsushita Electric Ind Co Ltd | Chip type semiconductor part |
-
1980
- 1980-02-04 JP JP1980012742U patent/JPH025543Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156559A (en) * | 1976-06-23 | 1977-12-27 | Hitachi Ltd | Small electronic device packaging package |
| JPS55153362A (en) * | 1979-05-18 | 1980-11-29 | Matsushita Electric Ind Co Ltd | Chip type semiconductor part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH025543Y2 (enExample) | 1990-02-09 |