JPH0249651Y2 - - Google Patents
Info
- Publication number
- JPH0249651Y2 JPH0249651Y2 JP1985171626U JP17162685U JPH0249651Y2 JP H0249651 Y2 JPH0249651 Y2 JP H0249651Y2 JP 1985171626 U JP1985171626 U JP 1985171626U JP 17162685 U JP17162685 U JP 17162685U JP H0249651 Y2 JPH0249651 Y2 JP H0249651Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- plating
- solder
- base metal
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985171626U JPH0249651Y2 (en:Method) | 1985-11-06 | 1985-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985171626U JPH0249651Y2 (en:Method) | 1985-11-06 | 1985-11-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6279368U JPS6279368U (en:Method) | 1987-05-21 |
| JPH0249651Y2 true JPH0249651Y2 (en:Method) | 1990-12-27 |
Family
ID=31107425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985171626U Expired JPH0249651Y2 (en:Method) | 1985-11-06 | 1985-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249651Y2 (en:Method) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722059Y2 (ja) * | 1989-04-13 | 1995-05-17 | コーア株式会社 | ジヤンパーチツプ |
| JP2545602Y2 (ja) * | 1989-12-14 | 1997-08-25 | 北陸電気工業株式会社 | ジャンパチップ |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5673493A (en) * | 1979-11-20 | 1981-06-18 | Matsushita Electric Industrial Co Ltd | Chip part for jumber |
-
1985
- 1985-11-06 JP JP1985171626U patent/JPH0249651Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6279368U (en:Method) | 1987-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5683566A (en) | Method of manufacting an SMD resistor | |
| JPH0669005B2 (ja) | 多層シ−トコイル | |
| US5119272A (en) | Circuit board and method of producing circuit board | |
| JPH0249651Y2 (en:Method) | ||
| JPH06103880A (ja) | 金属箔ヒューズの製造法 | |
| JPS62108413A (ja) | ジヤンパ−チツプの製造方法 | |
| JPH10189306A (ja) | チップ抵抗器 | |
| JPS5998597A (ja) | 多層プリント配線板 | |
| JP2839262B2 (ja) | チップ抵抗器とその製造方法 | |
| JP2806802B2 (ja) | チップ抵抗器 | |
| JPS6126171B2 (en:Method) | ||
| JP3159440B2 (ja) | 角形チップ抵抗器 | |
| JPH0513201A (ja) | 角形チツプ抵抗器 | |
| JPS6227675B2 (en:Method) | ||
| JPS6320108Y2 (en:Method) | ||
| JPH06104152A (ja) | チップ型電子部品における端子電極の形成方法 | |
| JPH0653004A (ja) | 角形チップ抵抗器およびその製造方法 | |
| JPS63257258A (ja) | 低抵抗付回路基板およびその製造法 | |
| JP4051751B2 (ja) | 電子部品の端子の製造方法 | |
| JP2000261123A (ja) | チップ抵抗器の実装構造およびチップ抵抗器の実装方法 | |
| JPS6027101A (ja) | 多連チツプ抵抗器 | |
| JP3159963B2 (ja) | チップ抵抗器 | |
| JPS61210695A (ja) | 印刷配線板の製造方法 | |
| JPS5938314B2 (ja) | 厚膜ペ−ストのメツキ方法 | |
| JPS62244197A (ja) | 焼成済セラミツク板を使つた多層基板製造法 |