JPH0249036B2 - - Google Patents

Info

Publication number
JPH0249036B2
JPH0249036B2 JP58104782A JP10478283A JPH0249036B2 JP H0249036 B2 JPH0249036 B2 JP H0249036B2 JP 58104782 A JP58104782 A JP 58104782A JP 10478283 A JP10478283 A JP 10478283A JP H0249036 B2 JPH0249036 B2 JP H0249036B2
Authority
JP
Japan
Prior art keywords
adhesive
metal layer
layer
thin metal
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58104782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59228785A (ja
Inventor
Masami Takagi
Yoshinori Urakuchi
Hiroshi Yanagida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP10478283A priority Critical patent/JPS59228785A/ja
Priority to DE8484106575T priority patent/DE3484948D1/de
Priority to EP19840106575 priority patent/EP0135674B1/en
Publication of JPS59228785A publication Critical patent/JPS59228785A/ja
Publication of JPH0249036B2 publication Critical patent/JPH0249036B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP10478283A 1983-06-10 1983-06-10 金属面積層板の製法 Granted JPS59228785A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP10478283A JPS59228785A (ja) 1983-06-10 1983-06-10 金属面積層板の製法
DE8484106575T DE3484948D1 (de) 1983-06-10 1984-06-08 Herstellung einer schichtfolie mit einer metallischen oberflaeche.
EP19840106575 EP0135674B1 (en) 1983-06-10 1984-06-08 Production of metal surface-laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10478283A JPS59228785A (ja) 1983-06-10 1983-06-10 金属面積層板の製法

Publications (2)

Publication Number Publication Date
JPS59228785A JPS59228785A (ja) 1984-12-22
JPH0249036B2 true JPH0249036B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-10-26

Family

ID=14390036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10478283A Granted JPS59228785A (ja) 1983-06-10 1983-06-10 金属面積層板の製法

Country Status (3)

Country Link
EP (1) EP0135674B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS59228785A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3484948D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
DE68924177T2 (de) * 1988-05-09 1996-02-15 Teijin Ltd Mit epoxyharz imprägnierter prepreg.
JPH02158335A (ja) * 1988-11-26 1990-06-18 Tsuaitowan Faaren Gonie Jishu Ienjiou Yuen 可撓性印刷回路板用積層シートの製造方法
US6190737B1 (en) * 1998-02-04 2001-02-20 Motorola, Inc. Metalized elastomers
JP5727403B2 (ja) * 2012-02-29 2015-06-03 積水化学工業株式会社 積層体及び多層基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3948701A (en) * 1971-07-20 1976-04-06 Aeg-Isolier-Und Kunststoff Gmbh Process for manufacturing base material for printed circuits
GB1588475A (en) * 1977-05-14 1981-04-23 Hitachi Chemical Co Ltd Method of adhesion between insulating substrates and metal deposits electrolessly plated thereon and method of making additive printed circuit boards
GB2040101B (en) * 1978-07-13 1982-09-15 Tokyo Shibaura Electric Co Method of fabricating printed ciurcuits
JPS6414719A (en) * 1987-07-09 1989-01-18 Hitachi Maxell Magnetic recording medium

Also Published As

Publication number Publication date
DE3484948D1 (de) 1991-09-26
EP0135674A3 (en) 1987-05-06
EP0135674B1 (en) 1991-08-21
JPS59228785A (ja) 1984-12-22
EP0135674A2 (en) 1985-04-03

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