GB2040101B - Method of fabricating printed ciurcuits - Google Patents
Method of fabricating printed ciurcuitsInfo
- Publication number
- GB2040101B GB2040101B GB8007439A GB8007439A GB2040101B GB 2040101 B GB2040101 B GB 2040101B GB 8007439 A GB8007439 A GB 8007439A GB 8007439 A GB8007439 A GB 8007439A GB 2040101 B GB2040101 B GB 2040101B
- Authority
- GB
- United Kingdom
- Prior art keywords
- ciurcuits
- fabricating printed
- fabricating
- printed
- printed ciurcuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
- H05K2203/097—Corona discharge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8459478A JPS5512716A (en) | 1978-07-13 | 1978-07-13 | Method of forming printed circuit |
JP9317378A JPS5521105A (en) | 1978-08-01 | 1978-08-01 | Method of forming printed circuit |
JP9317278A JPS605237B2 (en) | 1978-08-01 | 1978-08-01 | How to form printed circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2040101A GB2040101A (en) | 1980-08-20 |
GB2040101B true GB2040101B (en) | 1982-09-15 |
Family
ID=27304600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8007439A Expired GB2040101B (en) | 1978-07-13 | 1979-06-30 | Method of fabricating printed ciurcuits |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE2952961C1 (en) |
GB (1) | GB2040101B (en) |
WO (1) | WO1980000294A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59228785A (en) * | 1983-06-10 | 1984-12-22 | 松下電工株式会社 | Method of producing metal area laminated board |
GB2172436B (en) * | 1985-03-16 | 1989-06-21 | Marconi Electronic Devices | Electrical circuit |
GB2172439B (en) * | 1985-03-16 | 1989-06-21 | Marconi Electronic Devices | Electrical circuit |
GB2172438A (en) * | 1985-03-16 | 1986-09-17 | Marconi Electronic Devices | Printed circuits |
JPS6298798A (en) * | 1985-10-21 | 1987-05-08 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Manufacture of printed circuit board |
US4859571A (en) * | 1986-12-30 | 1989-08-22 | E. I. Du Pont De Nemours And Company | Embedded catalyst receptors for metallization of dielectrics |
CN114830840B (en) * | 2019-12-17 | 2024-04-05 | 日本发条株式会社 | Laminate, bonding method, and circuit board semi-finished product |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1006692B (en) * | 1953-10-29 | 1957-04-18 | Siemens Ag | Process for the production of firmly adhering metal coverings on all kinds of documents |
BE768887A (en) * | 1971-06-23 | 1971-11-03 | Macdermid Inc | PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE |
DE2136212B1 (en) * | 1971-07-20 | 1972-05-31 | Aeg Isolier Und Kunststoff Gmbh | Process for the production of a base material for printed circuits |
JPS5423342B2 (en) * | 1972-03-02 | 1979-08-13 | ||
JPS5123266B2 (en) * | 1972-04-21 | 1976-07-15 | ||
JPS5517507B2 (en) * | 1972-06-29 | 1980-05-12 | ||
US3978252A (en) * | 1973-03-23 | 1976-08-31 | Macdermid Incorporated | Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon |
JPS5133862A (en) * | 1974-09-18 | 1976-03-23 | Matsushita Electric Works Ltd | Purintohaisenkiban no seiho |
JPS51119969A (en) * | 1975-04-14 | 1976-10-20 | Fujikura Ltd | Method of manufacturing printed wiring substrate |
DE2624709A1 (en) * | 1976-06-02 | 1977-12-15 | Licentia Gmbh | Adhesion promoter for printed circuits - comprises an aminoplast-modified rubber and simplifies metallisation by obviating a surface treating stage |
-
1979
- 1979-06-30 DE DE2952961A patent/DE2952961C1/en not_active Expired
- 1979-06-30 WO PCT/JP1979/000171 patent/WO1980000294A1/en unknown
- 1979-06-30 GB GB8007439A patent/GB2040101B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2040101A (en) | 1980-08-20 |
DE2952961C1 (en) | 1983-03-31 |
WO1980000294A1 (en) | 1980-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
746 | Register noted 'licences of right' (sect. 46/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |