GB2040101B - Method of fabricating printed ciurcuits - Google Patents

Method of fabricating printed ciurcuits

Info

Publication number
GB2040101B
GB2040101B GB8007439A GB8007439A GB2040101B GB 2040101 B GB2040101 B GB 2040101B GB 8007439 A GB8007439 A GB 8007439A GB 8007439 A GB8007439 A GB 8007439A GB 2040101 B GB2040101 B GB 2040101B
Authority
GB
United Kingdom
Prior art keywords
ciurcuits
fabricating printed
fabricating
printed
printed ciurcuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8007439A
Other versions
GB2040101A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP8459478A external-priority patent/JPS5512716A/en
Priority claimed from JP9317378A external-priority patent/JPS5521105A/en
Priority claimed from JP9317278A external-priority patent/JPS605237B2/en
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of GB2040101A publication Critical patent/GB2040101A/en
Application granted granted Critical
Publication of GB2040101B publication Critical patent/GB2040101B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H05K2203/097—Corona discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
GB8007439A 1978-07-13 1979-06-30 Method of fabricating printed ciurcuits Expired GB2040101B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8459478A JPS5512716A (en) 1978-07-13 1978-07-13 Method of forming printed circuit
JP9317378A JPS5521105A (en) 1978-08-01 1978-08-01 Method of forming printed circuit
JP9317278A JPS605237B2 (en) 1978-08-01 1978-08-01 How to form printed circuits

Publications (2)

Publication Number Publication Date
GB2040101A GB2040101A (en) 1980-08-20
GB2040101B true GB2040101B (en) 1982-09-15

Family

ID=27304600

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8007439A Expired GB2040101B (en) 1978-07-13 1979-06-30 Method of fabricating printed ciurcuits

Country Status (3)

Country Link
DE (1) DE2952961C1 (en)
GB (1) GB2040101B (en)
WO (1) WO1980000294A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59228785A (en) * 1983-06-10 1984-12-22 松下電工株式会社 Method of producing metal area laminated board
GB2172436B (en) * 1985-03-16 1989-06-21 Marconi Electronic Devices Electrical circuit
GB2172439B (en) * 1985-03-16 1989-06-21 Marconi Electronic Devices Electrical circuit
GB2172438A (en) * 1985-03-16 1986-09-17 Marconi Electronic Devices Printed circuits
JPS6298798A (en) * 1985-10-21 1987-05-08 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Manufacture of printed circuit board
US4859571A (en) * 1986-12-30 1989-08-22 E. I. Du Pont De Nemours And Company Embedded catalyst receptors for metallization of dielectrics
CN114830840B (en) * 2019-12-17 2024-04-05 日本发条株式会社 Laminate, bonding method, and circuit board semi-finished product

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1006692B (en) * 1953-10-29 1957-04-18 Siemens Ag Process for the production of firmly adhering metal coverings on all kinds of documents
BE768887A (en) * 1971-06-23 1971-11-03 Macdermid Inc PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE
DE2136212B1 (en) * 1971-07-20 1972-05-31 Aeg Isolier Und Kunststoff Gmbh Process for the production of a base material for printed circuits
JPS5423342B2 (en) * 1972-03-02 1979-08-13
JPS5123266B2 (en) * 1972-04-21 1976-07-15
JPS5517507B2 (en) * 1972-06-29 1980-05-12
US3978252A (en) * 1973-03-23 1976-08-31 Macdermid Incorporated Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon
JPS5133862A (en) * 1974-09-18 1976-03-23 Matsushita Electric Works Ltd Purintohaisenkiban no seiho
JPS51119969A (en) * 1975-04-14 1976-10-20 Fujikura Ltd Method of manufacturing printed wiring substrate
DE2624709A1 (en) * 1976-06-02 1977-12-15 Licentia Gmbh Adhesion promoter for printed circuits - comprises an aminoplast-modified rubber and simplifies metallisation by obviating a surface treating stage

Also Published As

Publication number Publication date
GB2040101A (en) 1980-08-20
DE2952961C1 (en) 1983-03-31
WO1980000294A1 (en) 1980-02-21

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)
PCNP Patent ceased through non-payment of renewal fee